JP6313259B2 - 光子放出のスペクトルマッピング - Google Patents

光子放出のスペクトルマッピング Download PDF

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Publication number
JP6313259B2
JP6313259B2 JP2015080148A JP2015080148A JP6313259B2 JP 6313259 B2 JP6313259 B2 JP 6313259B2 JP 2015080148 A JP2015080148 A JP 2015080148A JP 2015080148 A JP2015080148 A JP 2015080148A JP 6313259 B2 JP6313259 B2 JP 6313259B2
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Japan
Prior art keywords
grating
order diffraction
light
objective lens
transmissive
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JP2015080148A
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English (en)
Japanese (ja)
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JP2015203700A5 (enExample
JP2015203700A (ja
Inventor
エルブ，デランド
アントニー，リバディ
ティエリー，パラサン
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FEI EFA Inc
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DCG Systems Inc
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Publication of JP2015203700A5 publication Critical patent/JP2015203700A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/66—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light electrically excited, e.g. electroluminescence

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Spectrometry And Color Measurement (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Microscoopes, Condenser (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
JP2015080148A 2014-04-10 2015-04-09 光子放出のスペクトルマッピング Active JP6313259B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461978173P 2014-04-10 2014-04-10
US61/978,173 2014-04-10

Publications (3)

Publication Number Publication Date
JP2015203700A JP2015203700A (ja) 2015-11-16
JP2015203700A5 JP2015203700A5 (enExample) 2018-04-05
JP6313259B2 true JP6313259B2 (ja) 2018-04-18

Family

ID=54264886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015080148A Active JP6313259B2 (ja) 2014-04-10 2015-04-09 光子放出のスペクトルマッピング

Country Status (4)

Country Link
US (1) US9903824B2 (enExample)
JP (1) JP6313259B2 (enExample)
SG (1) SG10201502809YA (enExample)
TW (1) TWI551856B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015175851A (ja) 2014-03-13 2015-10-05 ディーシージー システムズ、 インコーポライテッドＤｃｇ Ｓｙｓｔｅｍｓ Ｉｎｃ． 発光スペクトル分析による欠陥の分離のためのシステムと方法
US9903824B2 (en) 2014-04-10 2018-02-27 Fei Efa, Inc. Spectral mapping of photo emission
US10712667B2 (en) * 2016-12-14 2020-07-14 Asml Netherlands B.V. Optical device and associated system
US11294165B2 (en) * 2017-03-30 2022-04-05 The Board Of Trustees Of The Leland Stanford Junior University Modular, electro-optical device for increasing the imaging field of view using time-sequential capture
JP6954775B2 (ja) * 2017-06-29 2021-10-27 浜松ホトニクス株式会社 デバイス解析装置及びデバイス解析方法
CN112422796B (zh) * 2020-11-17 2023-04-07 维沃移动通信有限公司 摄像头结构、摄像控制方法、装置及电子设备
WO2024241626A1 (ja) 2023-05-19 2024-11-28 浜松ホトニクス株式会社 検査装置及び検査方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220403A (en) 1991-03-11 1993-06-15 International Business Machines Corporation Apparatus and a method for high numerical aperture microscopic examination of materials
US5208648A (en) 1991-03-11 1993-05-04 International Business Machines Corporation Apparatus and a method for high numerical aperture microscopic examination of materials
US5940545A (en) 1996-07-18 1999-08-17 International Business Machines Corporation Noninvasive optical method for measuring internal switching and other dynamic parameters of CMOS circuits
US6621275B2 (en) 2001-11-28 2003-09-16 Optonics Inc. Time resolved non-invasive diagnostics system
US6943572B2 (en) 2002-09-03 2005-09-13 Credence Systems Corporation Apparatus and method for detecting photon emissions from transistors
US6891363B2 (en) * 2002-09-03 2005-05-10 Credence Systems Corporation Apparatus and method for detecting photon emissions from transistors
US7012537B2 (en) 2004-02-10 2006-03-14 Credence Systems Corporation Apparatus and method for determining voltage using optical observation
US7110172B2 (en) * 2004-02-27 2006-09-19 Hamamatsu Photonics K.K. Microscope and sample observation method
US7327452B2 (en) * 2004-08-09 2008-02-05 Credence Systems Corporation Light beam apparatus and method for orthogonal alignment of specimen
US20090002656A1 (en) 2007-06-29 2009-01-01 Asml Netherlands B.V. Device and method for transmission image detection, lithographic apparatus and mask for use in a lithographic apparatus
US20090147255A1 (en) 2007-12-07 2009-06-11 Erington Kent B Method for testing a semiconductor device and a semiconductor device testing system
JP5187843B2 (ja) * 2008-09-01 2013-04-24 浜松ホトニクス株式会社 半導体検査装置及び検査方法
SG10201506637YA (en) * 2009-05-01 2015-10-29 Dcg Systems Inc Systems and method for laser voltage imaging state mapping
US8988653B2 (en) 2009-08-20 2015-03-24 Asml Netherlands B.V. Lithographic apparatus, distortion determining method, and patterning device
JP2012037310A (ja) * 2010-08-05 2012-02-23 Renesas Electronics Corp 半導体集積回路の故障解析装置及び故障解析方法
JP2015175851A (ja) 2014-03-13 2015-10-05 ディーシージー システムズ、 インコーポライテッドＤｃｇ Ｓｙｓｔｅｍｓ Ｉｎｃ． 発光スペクトル分析による欠陥の分離のためのシステムと方法
US9903824B2 (en) 2014-04-10 2018-02-27 Fei Efa, Inc. Spectral mapping of photo emission

Also Published As

Publication number Publication date
JP2015203700A (ja) 2015-11-16
TWI551856B (zh) 2016-10-01
TW201538965A (zh) 2015-10-16
US9903824B2 (en) 2018-02-27
US20150293037A1 (en) 2015-10-15
SG10201502809YA (en) 2015-11-27

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