SG10201502809YA - Spectral mapping of photo emission - Google Patents
Spectral mapping of photo emissionInfo
- Publication number
- SG10201502809YA SG10201502809YA SG10201502809YA SG10201502809YA SG10201502809YA SG 10201502809Y A SG10201502809Y A SG 10201502809YA SG 10201502809Y A SG10201502809Y A SG 10201502809YA SG 10201502809Y A SG10201502809Y A SG 10201502809YA SG 10201502809Y A SG10201502809Y A SG 10201502809YA
- Authority
- SG
- Singapore
- Prior art keywords
- spectral mapping
- photo emission
- photo
- emission
- spectral
- Prior art date
Links
- 238000013507 mapping Methods 0.000 title 1
- 230000003595 spectral effect Effects 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/66—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light electrically excited, e.g. electroluminescence
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Spectrometry And Color Measurement (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Microscoopes, Condenser (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461978173P | 2014-04-10 | 2014-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201502809YA true SG10201502809YA (en) | 2015-11-27 |
Family
ID=54264886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201502809YA SG10201502809YA (en) | 2014-04-10 | 2015-04-10 | Spectral mapping of photo emission |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9903824B2 (enExample) |
| JP (1) | JP6313259B2 (enExample) |
| SG (1) | SG10201502809YA (enExample) |
| TW (1) | TWI551856B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015175851A (ja) | 2014-03-13 | 2015-10-05 | ディーシージー システムズ、 インコーポライテッドＤｃｇ Ｓｙｓｔｅｍｓ Ｉｎｃ． | 発光スペクトル分析による欠陥の分離のためのシステムと方法 |
| US9903824B2 (en) | 2014-04-10 | 2018-02-27 | Fei Efa, Inc. | Spectral mapping of photo emission |
| US10712667B2 (en) * | 2016-12-14 | 2020-07-14 | Asml Netherlands B.V. | Optical device and associated system |
| US11294165B2 (en) * | 2017-03-30 | 2022-04-05 | The Board Of Trustees Of The Leland Stanford Junior University | Modular, electro-optical device for increasing the imaging field of view using time-sequential capture |
| JP6954775B2 (ja) * | 2017-06-29 | 2021-10-27 | 浜松ホトニクス株式会社 | デバイス解析装置及びデバイス解析方法 |
| CN112422796B (zh) * | 2020-11-17 | 2023-04-07 | 维沃移动通信有限公司 | 摄像头结构、摄像控制方法、装置及电子设备 |
| WO2024241626A1 (ja) | 2023-05-19 | 2024-11-28 | 浜松ホトニクス株式会社 | 検査装置及び検査方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5220403A (en) | 1991-03-11 | 1993-06-15 | International Business Machines Corporation | Apparatus and a method for high numerical aperture microscopic examination of materials |
| US5208648A (en) | 1991-03-11 | 1993-05-04 | International Business Machines Corporation | Apparatus and a method for high numerical aperture microscopic examination of materials |
| US5940545A (en) | 1996-07-18 | 1999-08-17 | International Business Machines Corporation | Noninvasive optical method for measuring internal switching and other dynamic parameters of CMOS circuits |
| US6621275B2 (en) | 2001-11-28 | 2003-09-16 | Optonics Inc. | Time resolved non-invasive diagnostics system |
| US6943572B2 (en) | 2002-09-03 | 2005-09-13 | Credence Systems Corporation | Apparatus and method for detecting photon emissions from transistors |
| US6891363B2 (en) * | 2002-09-03 | 2005-05-10 | Credence Systems Corporation | Apparatus and method for detecting photon emissions from transistors |
| US7012537B2 (en) | 2004-02-10 | 2006-03-14 | Credence Systems Corporation | Apparatus and method for determining voltage using optical observation |
| US7110172B2 (en) * | 2004-02-27 | 2006-09-19 | Hamamatsu Photonics K.K. | Microscope and sample observation method |
| US7327452B2 (en) * | 2004-08-09 | 2008-02-05 | Credence Systems Corporation | Light beam apparatus and method for orthogonal alignment of specimen |
| US20090002656A1 (en) | 2007-06-29 | 2009-01-01 | Asml Netherlands B.V. | Device and method for transmission image detection, lithographic apparatus and mask for use in a lithographic apparatus |
| US20090147255A1 (en) | 2007-12-07 | 2009-06-11 | Erington Kent B | Method for testing a semiconductor device and a semiconductor device testing system |
| JP5187843B2 (ja) * | 2008-09-01 | 2013-04-24 | 浜松ホトニクス株式会社 | 半導体検査装置及び検査方法 |
| SG10201506637YA (en) * | 2009-05-01 | 2015-10-29 | Dcg Systems Inc | Systems and method for laser voltage imaging state mapping |
| US8988653B2 (en) | 2009-08-20 | 2015-03-24 | Asml Netherlands B.V. | Lithographic apparatus, distortion determining method, and patterning device |
| JP2012037310A (ja) * | 2010-08-05 | 2012-02-23 | Renesas Electronics Corp | 半導体集積回路の故障解析装置及び故障解析方法 |
| JP2015175851A (ja) | 2014-03-13 | 2015-10-05 | ディーシージー システムズ、 インコーポライテッドＤｃｇ Ｓｙｓｔｅｍｓ Ｉｎｃ． | 発光スペクトル分析による欠陥の分離のためのシステムと方法 |
| US9903824B2 (en) | 2014-04-10 | 2018-02-27 | Fei Efa, Inc. | Spectral mapping of photo emission |
-
2015
- 2015-04-08 US US14/682,057 patent/US9903824B2/en active Active
- 2015-04-09 JP JP2015080148A patent/JP6313259B2/ja active Active
- 2015-04-09 TW TW104111375A patent/TWI551856B/zh active
- 2015-04-10 SG SG10201502809YA patent/SG10201502809YA/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015203700A (ja) | 2015-11-16 |
| TWI551856B (zh) | 2016-10-01 |
| TW201538965A (zh) | 2015-10-16 |
| US9903824B2 (en) | 2018-02-27 |
| JP6313259B2 (ja) | 2018-04-18 |
| US20150293037A1 (en) | 2015-10-15 |
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