JP6312822B2 - 可変電圧読出クロック信号を有するｔｄｉ撮像システム - Google Patents

可変電圧読出クロック信号を有するｔｄｉ撮像システム Download PDF

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Publication number
JP6312822B2
JP6312822B2 JP2016524210A JP2016524210A JP6312822B2 JP 6312822 B2 JP6312822 B2 JP 6312822B2 JP 2016524210 A JP2016524210 A JP 2016524210A JP 2016524210 A JP2016524210 A JP 2016524210A JP 6312822 B2 JP6312822 B2 JP 6312822B2
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amplitude
pixel
drivers
signals
tdi
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JP2016533063A5 (enExample
JP2016533063A (ja
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グオウー ジェン
グオウー ジェン
ジェン−ホワー ホワード チャーン
ジェン−ホワー ホワード チャーン
ビヌ バラクリシュナン
ビヌ バラクリシュナン
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KLA Corp
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KLA Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/711—Time delay and integration [TDI] registers; TDI shift registers

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  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2016524210A 2013-06-26 2014-06-26 可変電圧読出クロック信号を有するｔｄｉ撮像システム Active JP6312822B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361839768P 2013-06-26 2013-06-26
US61/839,768 2013-06-26
US14/308,383 2014-06-18
US14/308,383 US9658170B2 (en) 2013-06-26 2014-06-18 TDI imaging system with variable voltage readout clock signals
PCT/US2014/044411 WO2014210359A1 (en) 2013-06-26 2014-06-26 Tdi imaging system with variable voltage readout clock signals

Publications (3)

Publication Number Publication Date
JP2016533063A JP2016533063A (ja) 2016-10-20
JP2016533063A5 JP2016533063A5 (enExample) 2017-08-03
JP6312822B2 true JP6312822B2 (ja) 2018-04-18

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JP2016524210A Active JP6312822B2 (ja) 2013-06-26 2014-06-26 可変電圧読出クロック信号を有するｔｄｉ撮像システム

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US (1) US9658170B2 (enExample)
JP (1) JP6312822B2 (enExample)
IL (1) IL243084A0 (enExample)
TW (1) TWI605247B (enExample)
WO (1) WO2014210359A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3107281B1 (en) * 2015-06-17 2020-03-18 IMEC vzw Device for imaging and method for acquiring a time delay and integration image
KR102332942B1 (ko) * 2015-11-27 2021-12-01 에스케이하이닉스 주식회사 전력 소모 감소를 위한 카운팅 장치 및 그를 이용한 아날로그-디지털 변환 장치와 씨모스 이미지 센서
ES2854000T3 (es) * 2016-11-07 2021-09-20 Dnae Diagnostics Ltd Matriz ISFET
EP3534872B1 (en) 2016-12-20 2022-03-23 Colgate-Palmolive Company Two-phase oral care whitening compositions
US11263737B2 (en) * 2019-01-10 2022-03-01 Lam Research Corporation Defect classification and source analysis for semiconductor equipment
CN112055157B (zh) * 2020-09-21 2021-06-29 中国科学院长春光学精密机械与物理研究所 多组tdi成像的摄像同步性控制系统
DE102024111144A1 (de) * 2024-04-22 2025-10-23 Carl Zeiss Smt Gmbh Verfahren zum Betreiben einer Maskeninspektionsvorrichtung, EUV-Kamera, Maskeninspektionsvorrichtung, Computerprogrammprodukt

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6597446B2 (en) 2001-03-22 2003-07-22 Sentec Corporation Holographic scatterometer for detection and analysis of wafer surface deposits
US7952633B2 (en) 2004-11-18 2011-05-31 Kla-Tencor Technologies Corporation Apparatus for continuous clocking of TDI sensors
US7609309B2 (en) 2004-11-18 2009-10-27 Kla-Tencor Technologies Corporation Continuous clocking of TDI sensors
US8624971B2 (en) 2009-01-23 2014-01-07 Kla-Tencor Corporation TDI sensor modules with localized driving and signal processing circuitry for high speed inspection
WO2010148293A2 (en) 2009-06-19 2010-12-23 Kla-Tencor Corporation Euv high throughput inspection system for defect detection on patterned euv masks, mask blanks, and wafers
US9279774B2 (en) 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
WO2015120328A1 (en) * 2014-02-07 2015-08-13 Rambus Inc. Feedthrough-compensated image sensor

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Publication number Publication date
US20150002655A1 (en) 2015-01-01
JP2016533063A (ja) 2016-10-20
TW201516393A (zh) 2015-05-01
IL243084A0 (en) 2016-02-29
WO2014210359A1 (en) 2014-12-31
TWI605247B (zh) 2017-11-11
US9658170B2 (en) 2017-05-23

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