TWI605247B - 具有可變電壓讀出時脈訊號之時間延遲積分成像系統 - Google Patents
具有可變電壓讀出時脈訊號之時間延遲積分成像系統 Download PDFInfo
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- TWI605247B TWI605247B TW103122162A TW103122162A TWI605247B TW I605247 B TWI605247 B TW I605247B TW 103122162 A TW103122162 A TW 103122162A TW 103122162 A TW103122162 A TW 103122162A TW I605247 B TWI605247 B TW I605247B
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- Taiwan
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- pixel
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Links
- 238000003384 imaging method Methods 0.000 title claims description 51
- 238000000034 method Methods 0.000 claims description 57
- 230000010354 integration Effects 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000012071 phase Substances 0.000 description 138
- 238000012546 transfer Methods 0.000 description 34
- 239000004065 semiconductor Substances 0.000 description 19
- 238000007689 inspection Methods 0.000 description 16
- 238000007796 conventional method Methods 0.000 description 13
- 230000007547 defect Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 9
- 230000020169 heat generation Effects 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 230000002950 deficient Effects 0.000 description 6
- 238000013459 approach Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 238000012545 processing Methods 0.000 description 2
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- 238000003491 array Methods 0.000 description 1
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- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/711—Time delay and integration [TDI] registers; TDI shift registers
Landscapes
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Immunology (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361839768P | 2013-06-26 | 2013-06-26 | |
| US14/308,383 US9658170B2 (en) | 2013-06-26 | 2014-06-18 | TDI imaging system with variable voltage readout clock signals |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201516393A TW201516393A (zh) | 2015-05-01 |
| TWI605247B true TWI605247B (zh) | 2017-11-11 |
Family
ID=52115216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103122162A TWI605247B (zh) | 2013-06-26 | 2014-06-26 | 具有可變電壓讀出時脈訊號之時間延遲積分成像系統 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9658170B2 (enExample) |
| JP (1) | JP6312822B2 (enExample) |
| IL (1) | IL243084A0 (enExample) |
| TW (1) | TWI605247B (enExample) |
| WO (1) | WO2014210359A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3107281B1 (en) * | 2015-06-17 | 2020-03-18 | IMEC vzw | Device for imaging and method for acquiring a time delay and integration image |
| KR102332942B1 (ko) * | 2015-11-27 | 2021-12-01 | 에스케이하이닉스 주식회사 | 전력 소모 감소를 위한 카운팅 장치 및 그를 이용한 아날로그-디지털 변환 장치와 씨모스 이미지 센서 |
| ES2854000T3 (es) * | 2016-11-07 | 2021-09-20 | Dnae Diagnostics Ltd | Matriz ISFET |
| EP3534872B1 (en) | 2016-12-20 | 2022-03-23 | Colgate-Palmolive Company | Two-phase oral care whitening compositions |
| US11263737B2 (en) * | 2019-01-10 | 2022-03-01 | Lam Research Corporation | Defect classification and source analysis for semiconductor equipment |
| CN112055157B (zh) * | 2020-09-21 | 2021-06-29 | 中国科学院长春光学精密机械与物理研究所 | 多组tdi成像的摄像同步性控制系统 |
| DE102024111144A1 (de) * | 2024-04-22 | 2025-10-23 | Carl Zeiss Smt Gmbh | Verfahren zum Betreiben einer Maskeninspektionsvorrichtung, EUV-Kamera, Maskeninspektionsvorrichtung, Computerprogrammprodukt |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6597446B2 (en) | 2001-03-22 | 2003-07-22 | Sentec Corporation | Holographic scatterometer for detection and analysis of wafer surface deposits |
| US7952633B2 (en) | 2004-11-18 | 2011-05-31 | Kla-Tencor Technologies Corporation | Apparatus for continuous clocking of TDI sensors |
| US7609309B2 (en) | 2004-11-18 | 2009-10-27 | Kla-Tencor Technologies Corporation | Continuous clocking of TDI sensors |
| US8624971B2 (en) | 2009-01-23 | 2014-01-07 | Kla-Tencor Corporation | TDI sensor modules with localized driving and signal processing circuitry for high speed inspection |
| WO2010148293A2 (en) | 2009-06-19 | 2010-12-23 | Kla-Tencor Corporation | Euv high throughput inspection system for defect detection on patterned euv masks, mask blanks, and wafers |
| US9279774B2 (en) | 2011-07-12 | 2016-03-08 | Kla-Tencor Corp. | Wafer inspection |
| WO2015120328A1 (en) * | 2014-02-07 | 2015-08-13 | Rambus Inc. | Feedthrough-compensated image sensor |
-
2014
- 2014-06-18 US US14/308,383 patent/US9658170B2/en active Active
- 2014-06-26 JP JP2016524210A patent/JP6312822B2/ja active Active
- 2014-06-26 TW TW103122162A patent/TWI605247B/zh active
- 2014-06-26 WO PCT/US2014/044411 patent/WO2014210359A1/en not_active Ceased
-
2015
- 2015-12-22 IL IL243084A patent/IL243084A0/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| US20150002655A1 (en) | 2015-01-01 |
| JP2016533063A (ja) | 2016-10-20 |
| TW201516393A (zh) | 2015-05-01 |
| IL243084A0 (en) | 2016-02-29 |
| WO2014210359A1 (en) | 2014-12-31 |
| JP6312822B2 (ja) | 2018-04-18 |
| US9658170B2 (en) | 2017-05-23 |
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