JP2016533063A5 - - Google Patents

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Publication number
JP2016533063A5
JP2016533063A5 JP2016524210A JP2016524210A JP2016533063A5 JP 2016533063 A5 JP2016533063 A5 JP 2016533063A5 JP 2016524210 A JP2016524210 A JP 2016524210A JP 2016524210 A JP2016524210 A JP 2016524210A JP 2016533063 A5 JP2016533063 A5 JP 2016533063A5
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JP
Japan
Prior art keywords
amplitude
drivers
phase signal
signals
pixel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2016524210A
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English (en)
Japanese (ja)
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JP2016533063A (ja
JP6312822B2 (ja
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Publication date
Priority claimed from US14/308,383 external-priority patent/US9658170B2/en
Application filed filed Critical
Publication of JP2016533063A publication Critical patent/JP2016533063A/ja
Publication of JP2016533063A5 publication Critical patent/JP2016533063A5/ja
Application granted granted Critical
Publication of JP6312822B2 publication Critical patent/JP6312822B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016524210A 2013-06-26 2014-06-26 可変電圧読出クロック信号を有するtdi撮像システム Active JP6312822B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361839768P 2013-06-26 2013-06-26
US61/839,768 2013-06-26
US14/308,383 2014-06-18
US14/308,383 US9658170B2 (en) 2013-06-26 2014-06-18 TDI imaging system with variable voltage readout clock signals
PCT/US2014/044411 WO2014210359A1 (en) 2013-06-26 2014-06-26 Tdi imaging system with variable voltage readout clock signals

Publications (3)

Publication Number Publication Date
JP2016533063A JP2016533063A (ja) 2016-10-20
JP2016533063A5 true JP2016533063A5 (enExample) 2017-08-03
JP6312822B2 JP6312822B2 (ja) 2018-04-18

Family

ID=52115216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016524210A Active JP6312822B2 (ja) 2013-06-26 2014-06-26 可変電圧読出クロック信号を有するtdi撮像システム

Country Status (5)

Country Link
US (1) US9658170B2 (enExample)
JP (1) JP6312822B2 (enExample)
IL (1) IL243084A0 (enExample)
TW (1) TWI605247B (enExample)
WO (1) WO2014210359A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3107281B1 (en) * 2015-06-17 2020-03-18 IMEC vzw Device for imaging and method for acquiring a time delay and integration image
KR102332942B1 (ko) * 2015-11-27 2021-12-01 에스케이하이닉스 주식회사 전력 소모 감소를 위한 카운팅 장치 및 그를 이용한 아날로그-디지털 변환 장치와 씨모스 이미지 센서
ES2854000T3 (es) * 2016-11-07 2021-09-20 Dnae Diagnostics Ltd Matriz ISFET
EP3534872B1 (en) 2016-12-20 2022-03-23 Colgate-Palmolive Company Two-phase oral care whitening compositions
US11263737B2 (en) * 2019-01-10 2022-03-01 Lam Research Corporation Defect classification and source analysis for semiconductor equipment
CN112055157B (zh) * 2020-09-21 2021-06-29 中国科学院长春光学精密机械与物理研究所 多组tdi成像的摄像同步性控制系统
DE102024111144A1 (de) * 2024-04-22 2025-10-23 Carl Zeiss Smt Gmbh Verfahren zum Betreiben einer Maskeninspektionsvorrichtung, EUV-Kamera, Maskeninspektionsvorrichtung, Computerprogrammprodukt

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6597446B2 (en) 2001-03-22 2003-07-22 Sentec Corporation Holographic scatterometer for detection and analysis of wafer surface deposits
US7952633B2 (en) 2004-11-18 2011-05-31 Kla-Tencor Technologies Corporation Apparatus for continuous clocking of TDI sensors
US7609309B2 (en) 2004-11-18 2009-10-27 Kla-Tencor Technologies Corporation Continuous clocking of TDI sensors
US8624971B2 (en) 2009-01-23 2014-01-07 Kla-Tencor Corporation TDI sensor modules with localized driving and signal processing circuitry for high speed inspection
WO2010148293A2 (en) 2009-06-19 2010-12-23 Kla-Tencor Corporation Euv high throughput inspection system for defect detection on patterned euv masks, mask blanks, and wafers
US9279774B2 (en) 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
WO2015120328A1 (en) * 2014-02-07 2015-08-13 Rambus Inc. Feedthrough-compensated image sensor

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