JP6311800B2 - 拡大されたバックチャンバを備えたマイクロホンおよび製造方法 - Google Patents
拡大されたバックチャンバを備えたマイクロホンおよび製造方法 Download PDFInfo
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/222—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only for microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00309—Processes for packaging MEMS devices suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/01—Electrostatic transducers characterised by the use of electrets
- H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
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- B81—MICROSTRUCTURAL TECHNOLOGY
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- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/015—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being integrated on the same substrate
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Otolaryngology (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Pressure Sensors (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Description
BP 底板、
AD 被覆部(キャップまたは蓋)
を備え、この被覆部は、
OE 音響入口用の開口
を備えている。
MW マイクロホン変換器は、
ME 膜
を備えている。
SFE 音響ガイド素子は、
SK 音響路
を備えている。
AT 仕切りは、例えば箔を備えていて、これは、
FV フロントチャンバと
RV バックチャンバとを
切り離す。
DF ブシュ(膜の上方の箔中にある)
DM 密閉手段(音響ガイド素子と被覆部との間にある)
IC 回路
DL 音響ガイド素子の上面にある貫通路
AK 外側接点
DG 密閉部
LB はんだバンプ
VE 相互接続部面
DK ヴィア
BM 固定手段
Claims (10)
- マイクロホンであって、
底板と、被覆部と、この被覆部に音響入口用の開口とを有する閉じた中空空間筐体を備え、
MEMS部品として形成されたマイクロホン変換器と、中に音響路が形成された音響ガイド素子とであって、双方が互いに隣接して、前記底板上で、前記中空空間筐体の内側に配置されている、マイクロホン変換器と音響ガイド素子とを備え、
前記中空空間筐体の内側を、フロントチャンバとバックチャンバとに区分する仕切りを備え、
前記音響路が、前記開口を前記フロントチャンバと連結し、前記バックチャンバに対しては音響密閉で隔絶しており、
前記仕切りは、箔として形成されていて、少なくとも前記マイクロホン変換器と前記音響ガイド素子とを上張りし、前記底板の方に向かって密閉し、
前記マイクロホン変換器の上方にある前記箔中で、ブシュが解放されていて、前記ブシュが、前記中空空間筐体の内側にある前記バックチャンバを、前記MEMSマイクロホン変換器中で膜の上方で予め形成されたチャンバと連結し、
前記音響路を備えた前記音響ガイド素子は、前記開口の周りで、前記被覆部の方に向かって密に隔絶されている、マイクロホン。 - 前記音響ガイド素子は、妥当な場合には存在する被覆層および/または接着剤層と共になって、前記底板の上で、前記マイクロホン変換器よりも高く、したがって、前記中空空間筐体を閉じた後は、前記被覆部の内側に当接可能で、一方で、前記MEMSマイクロホン変換器の上面は、前記被覆部の内側からは距離を保っている、請求項1に記載のマイクロホン。
- 前記音響ガイド素子は、前記マイクロホン変換器と共に、等しい技術で前記底板上に取り付けられていて、
前記音響ガイド素子と前記被覆部との間を密閉するために、前記箔および妥当な場合にはさらなる密閉手段が機能する、請求項1または2に記載のマイクロホン。 - 前記底板上には、さらに集積回路(IC)が取り付けられていて、前記集積回路は、任意選択的に前記仕切りの下方に配置されていて、したがって、前記フロントチャンバの内側に、または、前記バックチャンバ中に配置されている、請求項1〜3のいずれか1項に記載のマイクロホン。
- 前記被覆部は、前記底板上に接着された、またははんだ付けされたキャップとして形成されていて、前記キャップの下で、前記中空空間筐体の前記中空空間が、取り囲まれている、請求項1〜4のいずれか1項に記載のマイクロホン。
- 前記キャップは、金属からなり、または少なくとも1つの金属層を含む、請求項5に記載のマイクロホン。
- 前記音響ガイド素子は、前記音響路用の貫通路を備えた、少なくとも1つの上方向を向いた平坦な表面と、前記底板上に前記音響ガイド素子を載置させる側方部分とを有する、請求項1〜6のいずれか1項に記載のマイクロホン。
- 前記音響ガイド素子は、金属、セラミックまたは導体基板材料から製造されている、請求項1〜7のいずれか1項に記載のマイクロホン。
- 前記底板は、前記マイクロホン変換器と前記集積回路とのための接続面を有し、
前記接続面は、前記底板の下面上の外側接点と導電接続されている、請求項1〜8のいずれか1項に記載のマイクロホン。 - より拡大されたバックチャンバを備えたマイクロホンの製造方法であって、
中空空間筐体の底板上に、互いに近くに隣接するマイクロホン変換器と、音響路を備えた音響ガイド素子とを取り付け、
前記マイクロホン変換器と、前記音響ガイド素子とを、前記底板の方に向かって密閉する箔で上を覆い、
ブシュを、前記マイクロホン変換器の上方で前記箔を通って設け、かつ、貫通路を、前記箔を通って、前記音響ガイド素子の上面上にある前記音響路の上方合流部に設け、
被覆部を前記底板上に載置することにより、前記中空空間筐体を閉じ、
前記音響ガイド素子が、前記底板の上方で前記被覆部を支持し、
前記被覆部中の開口が、前記載置後に、前記音響路の前記上方合流部と共に隔絶をし、前記音響路の前記下方の開口が、前記箔の下方にあるフロントチャンバと連結されていて、
膜が、前記マイクロホン変換器の下面で、前記フロントチャンバと連結されていて、
前記フロントチャンバが、前記箔により、被覆部と箔との間で取り囲まれているバックチャンバから切り離される、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014105849.6A DE102014105849B3 (de) | 2014-04-25 | 2014-04-25 | Mikrofon mit vergrößertem Rückvolumen und Verfahren zur Herstellung |
DE102014105849.6 | 2014-04-25 | ||
PCT/EP2015/053404 WO2015161940A1 (de) | 2014-04-25 | 2015-02-18 | MIKROFON MIT VERGRÖßERTEM RÜCKVOLUMEN UND VERFAHREN ZUR HERSTELLUNG |
Publications (2)
Publication Number | Publication Date |
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JP2017517938A JP2017517938A (ja) | 2017-06-29 |
JP6311800B2 true JP6311800B2 (ja) | 2018-04-18 |
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Country | Link |
---|---|
US (1) | US9854350B2 (ja) |
JP (1) | JP6311800B2 (ja) |
DE (1) | DE102014105849B3 (ja) |
WO (1) | WO2015161940A1 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP6412598B2 (ja) * | 2014-06-23 | 2018-10-24 | Tdk株式会社 | マイクロフォンおよびマイクロフォンを製造する方法 |
US10065852B2 (en) * | 2016-09-26 | 2018-09-04 | Taiwan Semiconductor Manufacturing Company Ltd. | MEMS device and manufacturing method thereof |
DE102018203094B3 (de) * | 2018-03-01 | 2019-05-23 | Infineon Technologies Ag | MEMS-Baustein |
EP3680211B1 (en) * | 2019-01-10 | 2024-03-06 | TE Connectivity Solutions GmbH | Sensor unit and method of interconnecting a substrate and a carrier |
WO2021010499A1 (ko) * | 2019-07-12 | 2021-01-21 | 엘지전자 주식회사 | 음성 입력 장치 |
WO2021010498A1 (ko) * | 2019-07-12 | 2021-01-21 | 엘지전자 주식회사 | 음성 입력 장치 |
CN111031462A (zh) * | 2019-11-12 | 2020-04-17 | 山东新港电子科技有限公司 | 前置后音腔mems mic |
CN112689041B (zh) * | 2020-12-22 | 2023-05-26 | 维沃移动通信有限公司 | 电子设备 |
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DE102004011148B3 (de) * | 2004-03-08 | 2005-11-10 | Infineon Technologies Ag | Mikrophon und Verfahren zum Herstellen eines Mikrophons |
DE102005008512B4 (de) * | 2005-02-24 | 2016-06-23 | Epcos Ag | Elektrisches Modul mit einem MEMS-Mikrofon |
DE102005053765B4 (de) | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS-Package und Verfahren zur Herstellung |
WO2009038692A1 (en) * | 2007-09-19 | 2009-03-26 | Akustica, Inc. | A mems package |
CN201274566Y (zh) * | 2008-09-26 | 2009-07-15 | 瑞声声学科技(深圳)有限公司 | Mems麦克风 |
WO2010095203A1 (ja) * | 2009-02-17 | 2010-08-26 | 株式会社 村田製作所 | 音響的トランスデューサユニット |
JP2011124748A (ja) * | 2009-12-10 | 2011-06-23 | Funai Electric Co Ltd | マイクロホンユニット |
EP2381698A1 (en) | 2010-04-21 | 2011-10-26 | Nxp B.V. | Microphone |
DE102011012295B4 (de) * | 2011-02-24 | 2020-06-04 | Tdk Corporation | MEMS-Mikrofon und Verfahren zur Herstellung des MEMS-Mikrofons |
WO2012004339A1 (de) * | 2010-07-08 | 2012-01-12 | Epcos Ag | Mems-mikrofon und verfahren zur herstellung des mems-mikrofons |
JP5668664B2 (ja) * | 2011-10-12 | 2015-02-12 | 船井電機株式会社 | マイクロホン装置、マイクロホン装置を備えた電子機器、マイクロホン装置の製造方法、マイクロホン装置用基板およびマイクロホン装置用基板の製造方法 |
KR101320573B1 (ko) * | 2011-11-30 | 2013-10-28 | 주식회사 비에스이 | 멤스 마이크로폰 |
US8779535B2 (en) * | 2012-03-14 | 2014-07-15 | Analog Devices, Inc. | Packaged integrated device die between an external and internal housing |
US20140064546A1 (en) * | 2012-08-01 | 2014-03-06 | Knowles Electronics, Llc | Microphone assembly |
DE102013106353B4 (de) | 2013-06-18 | 2018-06-28 | Tdk Corporation | Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement |
KR101369464B1 (ko) * | 2013-06-27 | 2014-03-06 | 주식회사 비에스이 | 멤스 마이크로폰 |
KR101454325B1 (ko) * | 2013-08-07 | 2014-11-03 | 주식회사 비에스이 | 멤스 마이크로폰 |
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2014
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JP2017517938A (ja) | 2017-06-29 |
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US9854350B2 (en) | 2017-12-26 |
DE102014105849B3 (de) | 2015-09-17 |
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