JP6309047B2 - 基板挟持装置、成膜装置及び成膜方法 - Google Patents
基板挟持装置、成膜装置及び成膜方法 Download PDFInfo
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- JP6309047B2 JP6309047B2 JP2016131734A JP2016131734A JP6309047B2 JP 6309047 B2 JP6309047 B2 JP 6309047B2 JP 2016131734 A JP2016131734 A JP 2016131734A JP 2016131734 A JP2016131734 A JP 2016131734A JP 6309047 B2 JP6309047 B2 JP 6309047B2
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- substrate
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- 239000000758 substrate Substances 0.000 title claims description 95
- 238000000034 method Methods 0.000 title claims description 8
- 238000003825 pressing Methods 0.000 claims description 72
- 230000008020 evaporation Effects 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 238000005422 blasting Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroluminescent Light Sources (AREA)
Description
2 支持具
3 押圧具
4 押圧部
4a 頂部
4b 側面部
5 縁部
7 真空槽
Claims (9)
- 基板を支持する支持具と、この支持具に対向配置され、前記基板を押圧する押圧具とを有し、前記支持具と前記押圧具とで前記基板を挟持する基板挟持装置であって、前記押圧具の基板との対向面には、前記基板側に向かって突出する押圧部が3つ以上設けられ、前記押圧部は、いずれかの前記押圧部の頂部に対し他の2つ以上の前記押圧部の頂部が前記対向面と平行な平面方向において異なる方向に離間した状態で設けられ、且つ、前記押圧部は、前記基板との対向面の縁部と平行に複数並設されており、これらの押圧部で前記基板を押圧するように構成されていることを特徴とする基板挟持装置。
- 前記押圧部の頂部は、前記基板との対向面の縁部から内方に後退した位置に設けられていることを特徴とする請求項1に記載の基板挟持装置。
- 前記押圧部の底部と頂部とを繋ぐ側面部が傾斜面に設定されていることを特徴とする請求項2に記載の基板挟持装置。
- 前記側面部が前記頂部側ほど先細るテーパ面に設定されていることを特徴とする請求項3に記載の基板挟持装置。
- 前記押圧部は、前記基板との対向面を囲繞するように設けられていることを特徴とする請求項1〜4のいずれか1項に記載の基板挟持装置。
- 前記押圧部は、挟持する前記基板の辺部と平行に複数列設けられていることを特徴とする請求項1〜4のいずれか1項に記載の基板挟持装置。
- 前記押圧部は、前記基板との矩形状の対向面の4つの縁部夫々に沿って並設されていることを特徴とする請求項1〜4のいずれか1項に記載の基板挟持装置。
- 真空槽内に設けられた基板に成膜を行う成膜装置であって、請求項1〜7のいずれか1項に記載の基板挟持装置が設けられていることを特徴とする成膜装置。
- 基板に成膜を行う成膜方法であって、
前記基板を挟持する挟持工程と、
前記挟持工程で挟持された基板を挟持しない解放状態とする解放工程とを有し、
前記挟持工程及び前記解放工程は、請求項1〜7のいずれか1項に記載の基板挟持装置を用いて行うことを特徴とする成膜方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016131734A JP6309047B2 (ja) | 2016-07-01 | 2016-07-01 | 基板挟持装置、成膜装置及び成膜方法 |
KR1020170075909A KR101960169B1 (ko) | 2016-07-01 | 2017-06-15 | 기판 협지 장치, 성막 장치 및 성막 방법 |
CN201710518668.9A CN107557746B (zh) | 2016-07-01 | 2017-06-30 | 基板夹持装置、成膜装置及成膜方法 |
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JP2016131734A JP6309047B2 (ja) | 2016-07-01 | 2016-07-01 | 基板挟持装置、成膜装置及び成膜方法 |
Publications (2)
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JP2018003094A JP2018003094A (ja) | 2018-01-11 |
JP6309047B2 true JP6309047B2 (ja) | 2018-04-11 |
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JP2016131734A Active JP6309047B2 (ja) | 2016-07-01 | 2016-07-01 | 基板挟持装置、成膜装置及び成膜方法 |
Country Status (3)
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JP (1) | JP6309047B2 (ja) |
KR (1) | KR101960169B1 (ja) |
CN (1) | CN107557746B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7057335B2 (ja) * | 2019-10-29 | 2022-04-19 | キヤノントッキ株式会社 | 基板保持装置、基板処理装置、基板保持方法、成膜方法、及び電子デバイスの製造方法 |
CN112853273B (zh) * | 2020-12-31 | 2022-12-16 | 南京深光科技有限公司 | 一种柔性amoled掩模版表面镀膜设备 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0282039U (ja) * | 1988-12-13 | 1990-06-25 | ||
JPH10102249A (ja) * | 1996-09-27 | 1998-04-21 | Nissin Electric Co Ltd | 基板保持装置 |
JP4467367B2 (ja) * | 2004-06-22 | 2010-05-26 | 大日本スクリーン製造株式会社 | 基板反転装置、基板搬送装置、基板処理装置、基板反転方法、基板搬送方法および基板処理方法 |
JP4553124B2 (ja) | 2004-12-16 | 2010-09-29 | 株式会社日立ハイテクノロジーズ | 真空蒸着方法及びelディスプレイ用パネル |
JP2006332460A (ja) * | 2005-05-27 | 2006-12-07 | Hitachi High-Tech Control Systems Corp | ウェーハの搬送装置 |
WO2010106958A1 (ja) * | 2009-03-18 | 2010-09-23 | 株式会社アルバック | 位置合わせ方法、蒸着方法 |
JP5479948B2 (ja) * | 2010-03-02 | 2014-04-23 | 株式会社ディスコ | 搬送機構 |
JP2011233510A (ja) * | 2010-04-05 | 2011-11-17 | Canon Inc | 蒸着装置 |
US9076834B2 (en) * | 2012-09-28 | 2015-07-07 | United Microelectronics Corp. | Spacer for thermal plate in semiconductor processing |
-
2016
- 2016-07-01 JP JP2016131734A patent/JP6309047B2/ja active Active
-
2017
- 2017-06-15 KR KR1020170075909A patent/KR101960169B1/ko active IP Right Grant
- 2017-06-30 CN CN201710518668.9A patent/CN107557746B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR20180003993A (ko) | 2018-01-10 |
KR101960169B1 (ko) | 2019-03-19 |
JP2018003094A (ja) | 2018-01-11 |
CN107557746B (zh) | 2020-11-10 |
CN107557746A (zh) | 2018-01-09 |
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