JP6308852B2 - 駆動装置、リソグラフィ装置、および物品の製造方法 - Google Patents

駆動装置、リソグラフィ装置、および物品の製造方法 Download PDF

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Publication number
JP6308852B2
JP6308852B2 JP2014083454A JP2014083454A JP6308852B2 JP 6308852 B2 JP6308852 B2 JP 6308852B2 JP 2014083454 A JP2014083454 A JP 2014083454A JP 2014083454 A JP2014083454 A JP 2014083454A JP 6308852 B2 JP6308852 B2 JP 6308852B2
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Japan
Prior art keywords
actuator
thrust
control unit
actuators
unit
Prior art date
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Application number
JP2014083454A
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English (en)
Japanese (ja)
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JP2015204703A (ja
JP2015204703A5 (enExample
Inventor
宏二 吉田
宏二 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2014083454A priority Critical patent/JP6308852B2/ja
Priority to KR1020150048898A priority patent/KR101894127B1/ko
Priority to US14/685,684 priority patent/US9802341B2/en
Publication of JP2015204703A publication Critical patent/JP2015204703A/ja
Publication of JP2015204703A5 publication Critical patent/JP2015204703A5/ja
Application granted granted Critical
Publication of JP6308852B2 publication Critical patent/JP6308852B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/404—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for compensation, e.g. for backlash, overshoot, tool offset, tool wear, temperature, machine construction errors, load, inertia
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45028—Lithography
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50218—Synchronize groups of axis, spindles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20221—Translation
    • H01J2237/20228—Mechanical X-Y scanning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20278—Motorised movement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20278—Motorised movement
    • H01J2237/20285—Motorised movement computer-controlled

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Control Of Multiple Motors (AREA)
  • General Engineering & Computer Science (AREA)
JP2014083454A 2014-04-15 2014-04-15 駆動装置、リソグラフィ装置、および物品の製造方法 Active JP6308852B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014083454A JP6308852B2 (ja) 2014-04-15 2014-04-15 駆動装置、リソグラフィ装置、および物品の製造方法
KR1020150048898A KR101894127B1 (ko) 2014-04-15 2015-04-07 구동 장치, 리소그래피 장치 및 물품 제조 방법
US14/685,684 US9802341B2 (en) 2014-04-15 2015-04-14 Driving apparatus, lithography apparatus, and method of manufacturing an article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014083454A JP6308852B2 (ja) 2014-04-15 2014-04-15 駆動装置、リソグラフィ装置、および物品の製造方法

Publications (3)

Publication Number Publication Date
JP2015204703A JP2015204703A (ja) 2015-11-16
JP2015204703A5 JP2015204703A5 (enExample) 2017-06-08
JP6308852B2 true JP6308852B2 (ja) 2018-04-11

Family

ID=54264998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014083454A Active JP6308852B2 (ja) 2014-04-15 2014-04-15 駆動装置、リソグラフィ装置、および物品の製造方法

Country Status (3)

Country Link
US (1) US9802341B2 (enExample)
JP (1) JP6308852B2 (enExample)
KR (1) KR101894127B1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112003501B (zh) * 2020-07-21 2021-11-19 清华大学 干扰磁场下电机正弦误差的出力补偿方法及装置
DE102023205571A1 (de) * 2023-06-14 2024-12-19 Carl Zeiss Smt Gmbh Optisches system, lithographieanlage und verfahren zum vermindern von schwingungsbasierten störungen

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3184044B2 (ja) * 1994-05-24 2001-07-09 キヤノン株式会社 微動位置決め制御装置
KR100459694B1 (ko) * 1998-04-08 2005-04-06 삼성전자주식회사 모터 토크 상수 측정방법
JP4272750B2 (ja) 1998-06-23 2009-06-03 キヤノン株式会社 露光装置及び除振装置、システム同定装置及びその方法
JP3413485B2 (ja) * 2000-01-31 2003-06-03 住友重機械工業株式会社 リニアモータにおける推力リップル測定方法
US6668202B2 (en) * 2001-11-21 2003-12-23 Sumitomo Heavy Industries, Ltd. Position control system and velocity control system for stage driving mechanism
JP2003284388A (ja) 2002-03-19 2003-10-03 Nikon Corp モータ駆動装置、ステージ装置、およびそれを備えた露光装置
JP2004274997A (ja) * 2003-02-21 2004-09-30 Matsushita Electric Ind Co Ltd モータ駆動装置
JP4487168B2 (ja) * 2003-05-09 2010-06-23 株式会社ニコン ステージ装置及びその駆動方法、並びに露光装置
JP4391883B2 (ja) * 2004-05-19 2009-12-24 住友重機械工業株式会社 移動体位置制御装置及びこの制御装置を用いたステージ装置
US7289858B2 (en) * 2004-05-25 2007-10-30 Asml Netherlands B.V. Lithographic motion control system and method
JP2009077591A (ja) * 2007-09-21 2009-04-09 Juki Corp Ｘｙ位置決め装置の駆動制御装置
US8735774B2 (en) * 2009-03-27 2014-05-27 Electro Scientific Industries, Inc. Force reaction compensation system
JP5569195B2 (ja) * 2010-07-02 2014-08-13 シンフォニアテクノロジー株式会社 リニアアクチュエータ駆動装置

Also Published As

Publication number Publication date
KR20150118900A (ko) 2015-10-23
JP2015204703A (ja) 2015-11-16
US9802341B2 (en) 2017-10-31
KR101894127B1 (ko) 2018-08-31
US20150293459A1 (en) 2015-10-15

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