KR101894127B1 - 구동 장치, 리소그래피 장치 및 물품 제조 방법 - Google Patents

구동 장치, 리소그래피 장치 및 물품 제조 방법 Download PDF

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KR101894127B1
KR101894127B1 KR1020150048898A KR20150048898A KR101894127B1 KR 101894127 B1 KR101894127 B1 KR 101894127B1 KR 1020150048898 A KR1020150048898 A KR 1020150048898A KR 20150048898 A KR20150048898 A KR 20150048898A KR 101894127 B1 KR101894127 B1 KR 101894127B1
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thrust
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coefficient
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KR20150118900A (ko
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고오지 요시다
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캐논 가부시끼가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/404—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for compensation, e.g. for backlash, overshoot, tool offset, tool wear, temperature, machine construction errors, load, inertia
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45028—Lithography
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50218—Synchronize groups of axis, spindles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20221—Translation
    • H01J2237/20228—Mechanical X-Y scanning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20278—Motorised movement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20278—Motorised movement
    • H01J2237/20285—Motorised movement computer-controlled

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Control Of Multiple Motors (AREA)
  • General Engineering & Computer Science (AREA)
KR1020150048898A 2014-04-15 2015-04-07 구동 장치, 리소그래피 장치 및 물품 제조 방법 Active KR101894127B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-083454 2014-04-15
JP2014083454A JP6308852B2 (ja) 2014-04-15 2014-04-15 駆動装置、リソグラフィ装置、および物品の製造方法

Publications (2)

Publication Number Publication Date
KR20150118900A KR20150118900A (ko) 2015-10-23
KR101894127B1 true KR101894127B1 (ko) 2018-08-31

Family

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KR1020150048898A Active KR101894127B1 (ko) 2014-04-15 2015-04-07 구동 장치, 리소그래피 장치 및 물품 제조 방법

Country Status (3)

Country Link
US (1) US9802341B2 (enExample)
JP (1) JP6308852B2 (enExample)
KR (1) KR101894127B1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112003501B (zh) * 2020-07-21 2021-11-19 清华大学 干扰磁场下电机正弦误差的出力补偿方法及装置
DE102023205571A1 (de) * 2023-06-14 2024-12-19 Carl Zeiss Smt Gmbh Optisches system, lithographieanlage und verfahren zum vermindern von schwingungsbasierten störungen

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050267609A1 (en) * 2004-05-25 2005-12-01 Asmil Netherlands B.V. Lithographic motion control system and method
US20070035266A1 (en) * 2004-05-19 2007-02-15 Sumitomo Heavy Industries, Ltd. Movable body position control device and stage device using the movable body position control device
WO2010110990A2 (en) 2009-03-27 2010-09-30 Electro Scientific Industries, Inc. Force reaction compensation system

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3184044B2 (ja) * 1994-05-24 2001-07-09 キヤノン株式会社 微動位置決め制御装置
KR100459694B1 (ko) * 1998-04-08 2005-04-06 삼성전자주식회사 모터 토크 상수 측정방법
JP4272750B2 (ja) 1998-06-23 2009-06-03 キヤノン株式会社 露光装置及び除振装置、システム同定装置及びその方法
JP3413485B2 (ja) * 2000-01-31 2003-06-03 住友重機械工業株式会社 リニアモータにおける推力リップル測定方法
US6668202B2 (en) * 2001-11-21 2003-12-23 Sumitomo Heavy Industries, Ltd. Position control system and velocity control system for stage driving mechanism
JP2003284388A (ja) 2002-03-19 2003-10-03 Nikon Corp モータ駆動装置、ステージ装置、およびそれを備えた露光装置
JP2004274997A (ja) * 2003-02-21 2004-09-30 Matsushita Electric Ind Co Ltd モータ駆動装置
JP4487168B2 (ja) * 2003-05-09 2010-06-23 株式会社ニコン ステージ装置及びその駆動方法、並びに露光装置
JP2009077591A (ja) * 2007-09-21 2009-04-09 Juki Corp Ｘｙ位置決め装置の駆動制御装置
JP5569195B2 (ja) * 2010-07-02 2014-08-13 シンフォニアテクノロジー株式会社 リニアアクチュエータ駆動装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070035266A1 (en) * 2004-05-19 2007-02-15 Sumitomo Heavy Industries, Ltd. Movable body position control device and stage device using the movable body position control device
US20050267609A1 (en) * 2004-05-25 2005-12-01 Asmil Netherlands B.V. Lithographic motion control system and method
WO2010110990A2 (en) 2009-03-27 2010-09-30 Electro Scientific Industries, Inc. Force reaction compensation system

Also Published As

Publication number Publication date
JP6308852B2 (ja) 2018-04-11
KR20150118900A (ko) 2015-10-23
JP2015204703A (ja) 2015-11-16
US9802341B2 (en) 2017-10-31
US20150293459A1 (en) 2015-10-15

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