JP6307869B2 - 電子部品、恒温槽付水晶発振器、電子機器および移動体 - Google Patents

電子部品、恒温槽付水晶発振器、電子機器および移動体 Download PDF

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Publication number
JP6307869B2
JP6307869B2 JP2013265011A JP2013265011A JP6307869B2 JP 6307869 B2 JP6307869 B2 JP 6307869B2 JP 2013265011 A JP2013265011 A JP 2013265011A JP 2013265011 A JP2013265011 A JP 2013265011A JP 6307869 B2 JP6307869 B2 JP 6307869B2
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Japan
Prior art keywords
support
electronic component
container
protrusion
heating element
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JP2013265011A
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English (en)
Japanese (ja)
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JP2015122608A5 (enExample
JP2015122608A (ja
Inventor
健作 磯畑
健作 磯畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2013265011A priority Critical patent/JP6307869B2/ja
Priority to US14/573,349 priority patent/US9276555B2/en
Priority to CN201420819363.3U priority patent/CN204304950U/zh
Priority to CN201410798256.1A priority patent/CN104734663B/zh
Priority to TW103144621A priority patent/TWI645671B/zh
Priority to CN201910126761.4A priority patent/CN110048690B/zh
Publication of JP2015122608A publication Critical patent/JP2015122608A/ja
Priority to US15/006,730 priority patent/US9595914B2/en
Priority to US15/421,851 priority patent/US9941839B2/en
Publication of JP2015122608A5 publication Critical patent/JP2015122608A5/ja
Priority to US15/905,254 priority patent/US10164568B2/en
Application granted granted Critical
Publication of JP6307869B2 publication Critical patent/JP6307869B2/ja
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/02—Details
    • H03B5/04—Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B2200/00—Indexing scheme relating to details of oscillators covered by H03B
    • H03B2200/0014—Structural aspects of oscillators
    • H03B2200/0018—Structural aspects of oscillators relating to the cutting angle of a crystal, e.g. AT cut quartz

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
JP2013265011A 2013-12-24 2013-12-24 電子部品、恒温槽付水晶発振器、電子機器および移動体 Active JP6307869B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2013265011A JP6307869B2 (ja) 2013-12-24 2013-12-24 電子部品、恒温槽付水晶発振器、電子機器および移動体
US14/573,349 US9276555B2 (en) 2013-12-24 2014-12-17 Electronic component, electronic apparatus, and moving object
CN201420819363.3U CN204304950U (zh) 2013-12-24 2014-12-19 电子部件、电子设备以及移动体
CN201410798256.1A CN104734663B (zh) 2013-12-24 2014-12-19 电子部件、电子设备以及移动体
TW103144621A TWI645671B (zh) 2013-12-24 2014-12-19 電子零件、電子機器、移動體及附恆溫槽石英振盪器
CN201910126761.4A CN110048690B (zh) 2013-12-24 2014-12-19 带恒温槽的石英振荡器、电子设备以及移动体
US15/006,730 US9595914B2 (en) 2013-12-24 2016-01-26 Electronic component, electronic apparatus, and moving object
US15/421,851 US9941839B2 (en) 2013-12-24 2017-02-01 Electronic component, electronic apparatus, and moving object
US15/905,254 US10164568B2 (en) 2013-12-24 2018-02-26 Electronic component, electronic apparatus, and moving object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013265011A JP6307869B2 (ja) 2013-12-24 2013-12-24 電子部品、恒温槽付水晶発振器、電子機器および移動体

Related Child Applications (1)

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JP2018043848A Division JP6572985B2 (ja) 2018-03-12 2018-03-12 電子部品、恒温槽付水晶発振器、電子機器および移動体

Publications (3)

Publication Number Publication Date
JP2015122608A JP2015122608A (ja) 2015-07-02
JP2015122608A5 JP2015122608A5 (enExample) 2017-02-02
JP6307869B2 true JP6307869B2 (ja) 2018-04-11

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Country Status (4)

Country Link
US (4) US9276555B2 (enExample)
JP (1) JP6307869B2 (enExample)
CN (3) CN110048690B (enExample)
TW (1) TWI645671B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6307869B2 (ja) * 2013-12-24 2018-04-11 セイコーエプソン株式会社 電子部品、恒温槽付水晶発振器、電子機器および移動体
US20180191299A1 (en) * 2015-07-27 2018-07-05 Guangdong DAPU Telecom Technology Co., Ltd. Directly-heating oven controlled crystal oscillator
JP6561764B2 (ja) 2015-10-23 2019-08-21 セイコーエプソン株式会社 発振器、電子機器および基地局
WO2017111020A1 (ja) * 2015-12-24 2017-06-29 株式会社村田製作所 圧電発振装置及びその製造方法
WO2017179300A1 (ja) * 2016-04-14 2017-10-19 株式会社村田製作所 弾性波装置及びその製造方法
JP6828286B2 (ja) * 2016-06-27 2021-02-10 セイコーエプソン株式会社 発振器、電子機器および移動体
JPWO2018092572A1 (ja) * 2016-11-16 2019-10-17 株式会社大真空 水晶振動デバイス
JP6942983B2 (ja) * 2017-03-17 2021-09-29 セイコーエプソン株式会社 発振器、電子機器および移動体
JP7516959B2 (ja) * 2020-07-30 2024-07-17 セイコーエプソン株式会社 発振器
CN116455343B (zh) * 2023-05-15 2024-01-23 烟台明德亨电子科技有限公司 一种晶振用陶瓷基座的加工方法

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JPS5825606Y2 (ja) * 1975-07-14 1983-06-02 カブシキガイシヤ セイコウシヤ スイシヨウハツシンキ
US4443732A (en) * 1983-02-22 1984-04-17 Asahi Dempa Co., Ltd. Temperature-compensated crystal resonator unit
JPH01240880A (ja) * 1988-03-22 1989-09-26 Fujitsu Ltd プリント基板の試験方法
JP3105623B2 (ja) 1992-02-26 2000-11-06 日本電波工業株式会社 恒温制御水晶発振器
RU2122278C1 (ru) * 1997-07-09 1998-11-20 Открытое акционерное общество "МОРИОН" Термостатированный кварцевый генератор и способ настройки его терморегулятора
US6060692A (en) * 1998-09-02 2000-05-09 Cts Corporation Low power compact heater for piezoelectric device
JP2001292487A (ja) * 2000-04-04 2001-10-19 Star Micronics Co Ltd スピーカユニット
JP4000960B2 (ja) * 2001-10-19 2007-10-31 株式会社村田製作所 分波器、通信装置
JP4804813B2 (ja) 2005-06-24 2011-11-02 日本電波工業株式会社 圧電発振器
TW200818691A (en) * 2006-08-08 2008-04-16 Hrl Lab Llc An integrated quartz oscillator on an active electronic substrate
JP4629744B2 (ja) 2008-02-21 2011-02-09 日本電波工業株式会社 恒温型の水晶発振器
JP4885207B2 (ja) * 2008-12-25 2012-02-29 日本電波工業株式会社 多段型とした恒温型の水晶発振器
JP5362344B2 (ja) 2008-12-26 2013-12-11 日本電波工業株式会社 多段型とした恒温型の水晶発振器
JP4955042B2 (ja) * 2009-05-18 2012-06-20 日本電波工業株式会社 恒温型の水晶発振器
JP2011134990A (ja) * 2009-12-25 2011-07-07 Renesas Electronics Corp 半導体装置およびその製造方法
JP5845014B2 (ja) * 2010-09-14 2016-01-20 日本電波工業株式会社 表面実装型水晶発振器
JP2013232836A (ja) * 2012-05-01 2013-11-14 Nippon Dempa Kogyo Co Ltd 発振装置
JP5613746B2 (ja) * 2012-11-07 2014-10-29 日本電波工業株式会社 恒温型の水晶発振器
JP6307869B2 (ja) * 2013-12-24 2018-04-11 セイコーエプソン株式会社 電子部品、恒温槽付水晶発振器、電子機器および移動体

Also Published As

Publication number Publication date
TW201526539A (zh) 2015-07-01
US20180191300A1 (en) 2018-07-05
CN110048690B (zh) 2024-10-11
TWI645671B (zh) 2018-12-21
CN110048690A (zh) 2019-07-23
US9941839B2 (en) 2018-04-10
CN204304950U (zh) 2015-04-29
US20170149384A1 (en) 2017-05-25
CN104734663A (zh) 2015-06-24
US20160142010A1 (en) 2016-05-19
US9276555B2 (en) 2016-03-01
US10164568B2 (en) 2018-12-25
CN104734663B (zh) 2019-03-12
US20150180445A1 (en) 2015-06-25
US9595914B2 (en) 2017-03-14
JP2015122608A (ja) 2015-07-02

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