JP6304412B2 - Method for manufacturing vapor deposition mask with metal frame, method for manufacturing organic semiconductor element, method for forming pattern - Google Patents

Description

  The present invention relates to a method for manufacturing a vapor deposition mask with a frame and a method for manufacturing an organic semiconductor element.

  Conventionally, in the manufacture of an organic EL element, the organic layer or cathode electrode of the organic EL element is formed of, for example, a metal in which a large number of minute slits are arranged in parallel at minute intervals in a region to be deposited. A vapor deposition mask was used. When using this vapor deposition mask, the vapor deposition mask is placed on the surface of the substrate to be vapor-deposited and held by a magnet from the back side, but the rigidity of the slit is extremely small, so when holding the vapor deposition mask on the substrate surface In this case, the slits are easily distorted, which has been an obstacle to increasing the definition of the products with high definition or increasing the slit length.

  Various studies have been made on the vapor deposition mask for preventing the distortion of the slit. For example, Patent Document 1 covers a base plate that also serves as a first metal mask having a plurality of openings, and covers the openings. There has been proposed a vapor deposition mask having a second metal mask having a large number of fine slits in the region and a mask tension holding means for positioning the second metal mask on the base plate in a state where the second metal mask is pulled in the longitudinal direction of the slit. That is, a vapor deposition mask in which two kinds of metal masks are combined has been proposed. According to this vapor deposition mask, it is said that the slit accuracy can be ensured without causing distortion in the slit.

  Recently, with the increase in size of products using organic EL elements or the increase in substrate size, there is an increasing demand for deposition masks, which are used in the manufacture of deposition masks made of metal. Metal plates are also getting bigger. However, with the current metal processing technology, it is difficult to accurately form a fine pattern on a large metal plate, and it is possible to prevent distortion of the slit portion by the method proposed in Patent Document 1 above. However, it cannot cope with high definition. In addition, in the case of a vapor deposition mask made of only metal, the mass increases with the increase in size, and the total mass including the frame also increases, which hinders handling.

  When forming a vapor deposition pattern on a vapor deposition object using a vapor deposition mask, the vapor deposition mask is generally used in a state of being fixed to a metal frame. As means for fixing the vapor deposition mask to the metal frame, fixing methods using various known welding methods such as laser welding, arc welding, electric resistance welding, and electron beam welding are generally used. In addition, when fixing the vapor deposition mask to the metal frame, it is important to accurately adjust the position accuracy of the vapor deposition mask, and welding fixing is usually performed while the vapor deposition mask is pulled.

JP 2003-332057 A

  The present invention has been made in view of such a situation, and it is possible to achieve high definition and light weight even when the metal frame is enlarged without generating wrinkles on the vapor deposition mask when fixing by welding. It is a main object to provide a method for manufacturing a vapor deposition mask with a metal frame in which a mask is fixed with high positional accuracy, and to provide a method for manufacturing an organic semiconductor device capable of manufacturing an organic semiconductor device with high accuracy.

According to an embodiment of the present disclosure for solving the above-described problem, a method for manufacturing a vapor deposition mask with a metal frame includes vapor deposition at a position where a metal mask in which a through hole is formed overlaps with the metal mask in which a slit is formed. A fixing step of fixing a vapor deposition mask formed by laminating a resin mask in which an opening corresponding to a pattern to be formed is formed, and the fixing step is such that the metal frame and the metal mask face each other. The metal frame and the vapor deposition mask are overlapped, and the metal frame is formed at a part of the portion where the through hole non-formation region of the metal frame and the slit non-formation region of the metal mask are directly or indirectly in contact with each other. Further, a tension is applied to the vapor deposition mask in a state where the vapor deposition mask is temporarily fixed and the vapor deposition mask is temporarily fixed to the metal frame. And extent, while applying tension to the evaporation mask, and the deposition mask and the metal frame, and a step of fixing at a predetermined position.
In the above manufacturing method, there may be a plurality of vapor deposition masks fixed to the metal frame.
Moreover, in said manufacturing method, you may form the opening part required in order to form the vapor deposition pattern for one screen in the position which overlaps with the said slit of the said resin mask.
In the manufacturing method described above, an opening necessary for forming a deposition pattern for two or more screens may be formed at a position overlapping the slit of the resin mask.
Moreover, in said manufacturing method, among the said 2 or more screens, the opening part required in order to form the vapor deposition pattern for one screen, and the opening part required in order to form the vapor deposition pattern for another one screen, When the distance between the screens is the distance between the screens, the distance between the screens is adjacent to each other at the opening necessary to form the vapor deposition pattern for one screen. It may be longer than the distance between the parts.
The distance between the screens may be in the range of 1 mm to 100 mm.
In the above manufacturing method, the resin mask may have a groove.
Further, in the above manufacturing method, the resin mask includes an aggregate of openings necessary for forming a deposition pattern for one screen and an opening necessary for forming another deposition pattern for one screen. You may have a groove | channel between aggregates.
Further, in the above manufacturing method, there are a plurality of the opening portions that overlap the slits, the plurality of opening portions are arranged in a row in the vertical direction, and the openings in adjacent rows are shifted from each other in the vertical direction. They may be arranged, or there may be a plurality of rows arranged in the horizontal direction, and the openings of adjacent rows may be arranged shifted in the horizontal direction.
In the above manufacturing method, the thickness of the resin mask may be in a range of 4 μm to 8 μm.
Moreover, the manufacturing method of the vapor deposition mask with a metal frame of one Embodiment is the opening corresponding to the pattern which carries out vapor deposition preparation in the position which overlaps with the metal mask in which the several slit was formed in the metal frame in which the through-hole was formed. A fixing step of fixing a vapor deposition mask formed by laminating a resin mask in which a portion is formed, and the fixing step includes the metal frame and the vapor deposition mask so that the metal frame and the metal mask face each other. And the deposition mask is temporarily attached to the metal frame at a part of the portion where the through-hole non-formation region of the metal frame and the non-slit formation region of the metal mask are in direct or indirect contact with each other. A step of fixing, a step of applying tension to the vapor deposition mask in a state where the vapor deposition mask is temporarily fixed to the metal frame, and a tension of the vapor deposition mask. In a state where over and the on the deposition mask and the metal frame, and a step of welding fixed at a predetermined position, characterized in that it contains.

Moreover, the manufacturing method of the vapor deposition mask with a metal frame concerning embodiment of this indication for solving the above-mentioned subject is a lamination of a metal mask with a slit and a resin plate on a metal frame with a through hole. A fixing step of fixing the metal mask with a resin plate, a pattern in which a laser is irradiated to the resin plate through the slit from the metal mask side of the metal mask with a resin plate, and vapor deposition is produced at a position overlapping the slit of the resin plate Forming an opening corresponding to the above, and in the fixing step, the metal frame and the metal mask with a resin plate are overlapped so that the metal frame and the metal mask face each other, In a part of the portion where the through-hole non-formation region of the metal frame and the slit non-formation region of the metal mask are in direct contact or indirect contact, the gold Temporarily fixing the metal mask with a resin plate to a frame, applying a tension to the metal mask with a resin plate in a state where the metal mask with a resin plate is temporarily fixed to the metal frame, and the metal with a resin plate A step of fixing the metal frame and the metal mask with a resin plate at a predetermined position in a state where tension is applied to the mask, and the step of forming the opening includes the step of applying the tension and the fixing Or after the fixing step.
In the manufacturing method, the metal mask with a resin plate may be formed by a step of preparing a laminate of a resin plate and a metal plate and a step of forming a slit in the metal plate of the laminate. Good.
In the above manufacturing method, the slit may be formed by etching.
Moreover, in said manufacturing method, you may form a resin layer with a coating with respect to a metal plate by the said process which prepares the laminated body of the said resin plate and a metal plate.
In the manufacturing method, the metal plate and the resin plate may be bonded together in the step of preparing the laminate of the resin plate and the metal plate.
In the above manufacturing method, there may be a plurality of metal masks with a resin plate fixed to the metal frame.
Further, in the above manufacturing method, in the step of forming the opening, the resin plate of the metal mask with the resin plate is arranged so that the slit and the opening necessary for forming the vapor deposition pattern for one screen overlap. It may be a step of forming the opening.
Further, in the above manufacturing method, in the step of forming the opening, the metal mask with a resin plate is formed so that the slit and the opening necessary for forming a deposition pattern for two or more screens overlap. It may be a step of forming the opening in the resin plate.
Further, in the above manufacturing method, the step of forming the opening includes an opening necessary for forming a deposition pattern for one screen and a deposition pattern for another one screen among the two or more screens. In order to form a deposition pattern for one screen, when the distance between the screens is the shortest distance between the openings necessary to form the distance between the screens, the distance between the screens The step of forming the opening may be longer than the distance between adjacent openings in the required opening.
In the manufacturing method, the opening may be formed so that a distance between the screens is 1 mm or more and 100 mm or less.
Moreover, in said manufacturing method, the said resin plate may have a groove | channel.
Further, in the above manufacturing method, the resin plate is formed by an assembly of openings necessary for forming a vapor deposition pattern for one screen formed in the step of forming the openings and vapor deposition for another screen. You may have a groove | channel between the aggregate | assembly of the opening part required in order to form a pattern.
Further, in the above manufacturing method, the step of forming the openings includes a plurality of openings arranged in a row in the vertical direction, and the openings in adjacent rows are shifted from each other in the vertical direction. Alternatively, there may be a step of forming a plurality of the openings so that there are a plurality of rows arranged in the horizontal direction and the openings of adjacent rows are shifted from each other in the horizontal direction.
In the above manufacturing method, the thickness of the resin plate may be in the range of 4 μm to 8 μm.
Moreover, the manufacturing method of the vapor deposition mask with a metal frame of one Embodiment fixes the metal mask with a resin plate by which the metal mask with which the several slit was formed, and the resin plate were laminated | stacked on the metal frame with which the through-hole was formed. A plurality of openings corresponding to a fixing step and a pattern in which a laser is irradiated to the resin plate from the metal mask side of the metal mask with a resin plate through the slit, and vapor deposition is performed at positions overlapping the plurality of slits of the resin plate And the fixing step overlaps the metal frame and the metal mask with a resin plate so that the metal frame and the metal mask face each other, and the through hole of the metal frame In a part of the portion where the non-formation region and the non-slit formation region of the metal mask are in direct contact or indirect contact with the metal frame, the tree A step of temporarily fixing a metal mask with a plate, a step of applying tension to the metal mask with a resin plate in a state where the metal mask with a resin plate is temporarily fixed to the metal frame, and a tension on the metal mask with a resin plate A step of welding and fixing the metal frame and the metal mask with a resin plate at a predetermined location in a state where the metal frame is applied, and the step of forming the opening includes the step of applying the tension and the step of fixing by welding Or after the step of fixing by welding.

Moreover, the manufacturing method of the organic-semiconductor element concerning embodiment of this indication for solving the said subject uses the vapor deposition mask with a metal frame manufactured with the manufacturing method of said vapor deposition mask with a metal frame.
Also, an organic semiconductor device manufacturing method according to an embodiment is a method for manufacturing an organic semiconductor device using a vapor deposition method, and the manufacturing of the organic semiconductor device includes a metal frame in which a through hole is formed, and a plurality of The metal frame and the metal mask are opposed to a vapor deposition mask formed by laminating a metal mask in which slits are formed and a resin mask in which openings corresponding to a pattern to be vapor deposited are formed at positions overlapping the slits. The vapor deposition mask is placed on the metal frame at a portion where the through hole non-formation region of the metal frame and the slit non-formation region of the metal mask are directly or indirectly in contact with each other. A step of temporarily fixing, a step of applying tension to the vapor deposition mask in a state where the vapor deposition mask is temporarily fixed to the metal frame, and a step of applying tension to the vapor deposition mask. State, characterized in that the said deposition mask and the metal frame, a step of welding fixed at a predetermined position, a metal frame with evaporation mask manufactured by is used.
A pattern forming method according to an embodiment of the present disclosure for solving the above-described problem is a pattern forming method manufactured by vapor deposition, and is manufactured by the above-described method for manufacturing a vapor deposition mask with a metal frame. Use a vapor deposition mask with a metal frame.

  According to the method for manufacturing a vapor deposition mask with a metal frame of the present invention, the vapor deposition mask can achieve high definition and light weight even when the metal frame is enlarged without causing wrinkles in the vapor deposition mask when fixing by welding. It is possible to obtain a vapor deposition mask with a metal mask in which is fixed with high positional accuracy. Moreover, according to the manufacturing method of the organic semiconductor element of this invention, an organic semiconductor element can be manufactured with sufficient precision.

(A) is a front view which shows an example of the vapor deposition mask used for the manufacturing method of the vapor deposition mask with a metal frame of this invention, (b) is the schematic sectional drawing. (A), (b) is a front view which shows an example of the vapor deposition mask used for the manufacturing method of the vapor deposition mask with a metal frame of this invention. It is a front view which shows an example of the vapor deposition mask used for the manufacturing method of the vapor deposition mask with a metal frame of this invention. It is a front view which shows an example of a resin mask. It is a front view which shows an example of the vapor deposition mask used for the manufacturing method of the vapor deposition mask with a metal frame of this invention. (A)-(c) is sectional drawing for demonstrating the relationship between generation | occurrence | production of a shadow, and the thickness of a metal mask. It is a front view which shows an example of the metal frame used for the manufacturing method of the vapor deposition mask with a metal frame of this invention. (A), (b) is a front view which shows an example of the metal frame used for the manufacturing method of the vapor deposition mask with a metal frame of this invention. (A), (b) is a front view which shows an example of the state which temporarily fixed the vapor deposition mask to the metal frame, (a) is the figure seen from the resin mask side, (b) is seen from the metal mask side. FIG. (A), (b) is a front view which shows an example of the state which temporarily fixed the vapor deposition mask to the metal frame. (A), (b) is a front view which shows an example of the state which temporarily fixed the vapor deposition mask to the metal frame. It is a front view which shows an example of the state which temporarily fixed the vapor deposition mask to the metal frame. It is a fragmentary sectional view which shows an example of the state which temporarily fixed the vapor deposition mask to the metal frame. (A), (b) is a front view which shows an example of the process of applying tension | tensile_strength. It is a front view which shows an example of the welding fixing location by the process of welding fixing. (A), (b) is a front view which shows an example of the welding fixing location by the process of welding fixing. It is a front view which shows an example of a vapor deposition mask with a metal frame. It is a front view which shows an example of a vapor deposition mask with a metal frame. (A), (b) is a front view which shows an example of the state which fixed the metal mask with a resin plate to the metal frame, (a) is the figure seen from the resin plate side, (b) is a metal mask. It is the figure seen from the side. It is a figure which shows an example of the positional relationship of a support body and a magnet.

<< Method of manufacturing vapor deposition mask with metal frame >>
Hereinafter, the manufacturing method of the vapor deposition mask with a metal frame of the present invention will be described by taking the first embodiment and the second embodiment as examples.

<The manufacturing method of 1st Embodiment>
The manufacturing method of the vapor deposition mask with a metal frame of 1st Embodiment laminate | stacks the metal mask in which the several slit was formed, and the resin mask in which the opening part corresponding to the pattern produced by vapor deposition is formed in the position which overlaps with the said slit. A fixing step of fixing the vapor deposition mask to the metal frame in which the through holes are formed.

  Here, in the manufacturing method of the first embodiment, the fixing process is performed by superimposing the metal frame 50 and the vapor deposition mask 100 so that the metal frame 50 and the metal mask 10 face each other as shown in FIG. In a part of the portion where the through hole non-formation region (support 60 in the illustrated form) of the metal frame 50 and the slit non-formation region of the metal mask 10 directly or indirectly contact each other, The step of temporarily fixing the vapor deposition mask 100, the step of applying tension to the vapor deposition mask with the vapor deposition mask 100 temporarily fixed to the metal frame 50 as shown in FIG. 14, and the vapor deposition mask as shown in FIG. The method includes a step of welding and fixing the metal frame 50 and the vapor deposition mask at a predetermined position in a state where a tension is applied to 100. In each figure, a portion closed by a broken line indicates a temporarily fixed region and a welded region. Hereinafter, each step will be described.

“Process to temporarily fix the vapor deposition mask on the metal frame”
In order to obtain a vapor deposition mask with a metal frame capable of producing a high-definition vapor deposition pattern, it is important to accurately align the metal frame 50 and the vapor deposition mask 100, and the manufacturing method of the first embodiment Then, welding fixation of the vapor deposition mask 100 to the metal frame 50 is performed in a state where tension is applied to the vapor deposition mask 100. In other words, welding and fixing to the metal frame 50 are performed in a state where the vapor deposition mask 100 is stretched.

  In the manufacturing method of the first embodiment, a vapor deposition mask 100 in which a metal mask 10 and a resin mask 20 are stacked is used. When tension is applied to the vapor deposition mask 100 at the time of welding and fixing to the metal frame 50, the vapor deposition mask is deformed, and wavy wrinkles are easily generated in the vapor deposition mask. As one of the generation factors of the wavy wrinkles in the vapor deposition mask, there is a distortion or twist of the vapor deposition mask which is potentially possessed by the vapor deposition mask itself or caused by an external factor. In addition to the twist and distortion of the vapor deposition mask, wavy wrinkles are likely to occur in the vapor deposition mask due to non-uniform tension due to the configuration of the apparatus and the accuracy of the apparatus. The wavy wrinkles generated in the vapor deposition mask 100 cause variations in the dimensions of the openings 25 of the resin mask 20 constituting the vapor deposition mask 100 and the slits 15 of the metal mask 100, and are formed using the vapor deposition mask with a metal frame. This causes a decrease in the dimensional accuracy of the vapor deposition pattern.

  The manufacturing method of the first embodiment includes a step of temporarily fixing the metal frame 50 and the vapor deposition mask 100, and in this step, a through hole non-formation region of the metal frame 50, a slit non-formation region of the metal mask 10, The vapor deposition mask 100 is temporarily fixed to the metal frame 50 at a part of the portion that directly or indirectly contacts. According to the manufacturing method of the first embodiment including the step of temporarily fixing, the vapor deposition mask 100 can be held in close contact with the metal frame 50 in an extended state, and the alignment between the metal frame 50 and the vapor deposition mask 100 can be accurately performed. It is possible to prevent the generation of wrinkles that may occur when tension is applied to the vapor deposition mask 100 to be performed. In the present specification, “temporary fixing” means that a minute movement is caused in a part of a portion where the through hole non-formation region of the metal frame and the slit non-formation region of the metal mask are directly or indirectly in contact with each other. In a possible state, this means a fixed mode in which the vapor deposition mask 100 is held on the metal frame 50. Hereinafter, the vapor deposition mask 100, the metal frame 50, and one aspect of temporary fixing between the metal frame 50 and the vapor deposition mask 100 used in the manufacturing method of the first embodiment will be specifically described.

(Deposition mask)
As shown in FIG. 1, the vapor deposition mask 100 includes a metal mask 10 having a plurality of slits 15 and the surface of the metal mask 10 (the lower surface of the metal mask 10 in the case shown in FIG. 1B). The resin mask 20 in which the opening 25 corresponding to the pattern to be deposited is formed is laminated. 1A is a front view of the vapor deposition mask 100 as viewed from the metal mask 10 side, and FIG. 1B is a schematic cross-sectional view thereof.

  The vapor deposition mask 100 used in the manufacturing method of the present invention may be used to form a vapor deposition pattern corresponding to one screen, or may be used to simultaneously form vapor deposition patterns corresponding to two or more screens. There may be. In addition, the resin mask 20 shown in FIG. 1 has a plurality of openings 25 constituting one screen, and the openings 25 constituting the one screen are divided by a plurality of slits 15 (eight slits). Yes. In the resin mask 20 shown in FIG. 2, openings 25 constituting a plurality of screens (12 screens) are formed. Here, “one screen” means an assembly of openings 25 corresponding to one product. When the one product is an organic EL display, one organic EL display is formed. An aggregate of necessary organic layers, that is, an aggregate of the openings 25 serving as an organic layer is “one screen”.

  In the case where the openings 25 constituting a plurality of screens are formed in the resin mask 20, it is preferable that the openings 25 are formed at predetermined intervals for each screen unit as shown in FIG. In FIG. 2, an area enclosed by a broken line is “one screen”. In FIG. 2, one screen is constituted by six openings 25, but the present invention is not limited to this form. For example, when one opening 25 is one pixel, millions of One screen can be constituted by the opening 25. As an example of the pitch between the screens, both the vertical pitch and the horizontal pitch are about 1 mm to 100 mm. Note that the pitch between the screens means a pitch between adjacent openings in one screen and another screen adjacent to the one screen as indicated by W1 and W2 in FIG. In the form shown in FIG. 2A, one slit 15 is formed at a position that overlaps the entire opening 25 constituting one screen. However, as shown in FIG. In addition, it may be formed at a position that overlaps the entire opening 25 constituting a plurality of screens (a position that overlaps the opening 25 constituting two screens in the case shown in FIG. 2B).

  According to the vapor deposition mask 100 used in the manufacturing method of the first embodiment, it is possible to reduce the weight of the vapor deposition mask with a metal frame. Specifically, the mass of the vapor deposition mask 100 used in the manufacturing method of the first embodiment is assumed to be the same as the mass of the vapor deposition mask composed of a conventionally known metal only. In comparison, the mass of the vapor deposition mask 100 used in the manufacturing method of the first embodiment is lightened by the amount of replacing a part of the metal material of the conventionally known vapor deposition mask with a resin material. In addition, in order to reduce the weight by using a vapor deposition mask made of only metal, it is necessary to reduce the thickness of the vapor deposition mask. However, if the vapor deposition mask is thin, When the size is increased, the vapor deposition mask may be distorted or the durability may be reduced. On the other hand, according to the vapor deposition mask used in the manufacturing method of the first embodiment, even when the thickness of the entire vapor deposition mask is increased in order to satisfy distortion and durability when it is enlarged, Due to the presence of the resin mask 20, it is possible to reduce the weight as compared with a vapor deposition mask formed of only metal. Next, the resin mask 20 and the metal mask 100 constituting the vapor deposition mask 100 will be described.

(Resin mask)
The resin mask 20 is made of resin, and as shown in FIGS. 1 and 2, an opening 25 corresponding to a pattern to be deposited is formed at a position overlapping the slit 15. In the specification of the present application, the pattern formed by vapor deposition means a pattern to be produced using the vapor deposition mask. For example, when the vapor deposition mask is used for forming an organic layer of an organic EL element, the organic The shape of the layer. In the present invention, an example in which the openings are arranged in a plurality of rows in the vertical and horizontal directions has been described. However, the openings 25 only need to be formed at positions overlapping the slits, and the slits 15 are in the vertical direction. Alternatively, when only one row is arranged in the horizontal direction, the opening 25 may be formed at a position overlapping the slit 15 of the one row. This does not mean that the opening 25 is formed only at a position overlapping with the slit 15, but at a position where the slit 15 is not formed in the metal mask 10, that is, a position overlapping with the non-slit forming area. The opening 25 may be formed.

  For the resin mask 20, a conventionally known resin material can be appropriately selected and used, and the material is not particularly limited. However, a high-definition opening 25 can be formed by laser processing or the like. It is preferable to use a lightweight material having a small dimensional change rate and moisture absorption rate. Examples of such materials include polyimide resin, polyamide resin, polyamideimide resin, polyester resin, polyethylene resin, polyvinyl alcohol resin, polypropylene resin, polycarbonate resin, polystyrene resin, polyacrylonitrile resin, ethylene vinyl acetate copolymer resin, ethylene- Examples thereof include vinyl alcohol copolymer resin, ethylene-methacrylic acid copolymer resin, polyvinyl chloride resin, polyvinylidene chloride resin, cellophane, and ionomer resin. Among the materials exemplified above, a resin material having a thermal expansion coefficient of 16 ppm / ° C. or less is preferable, a resin material having a moisture absorption rate of 1.0% or less is preferable, and a resin material having both conditions is particularly preferable. . In the present invention, as described above, the resin mask 20 is made of a resin material capable of forming the openings 25 with higher definition than the metal material. Therefore, the vapor deposition mask 100 having the high-definition opening 25 can be obtained.

  The thickness of the resin mask 20 is not particularly limited. However, when vapor deposition is performed using the vapor deposition mask 200 with a metal frame of the present invention, a vapor deposition portion that is insufficient for a pattern to be formed, that is, a target vapor deposition film thickness. In order to prevent the deposition portion having a thinner film thickness, so-called shadow, from occurring, the resin mask 20 is preferably as thin as possible. However, when the thickness of the resin mask 20 is less than 3 μm, defects such as pinholes are likely to occur, and the risk of deformation and the like increases. On the other hand, if it exceeds 25 μm, shadows may occur. Considering this point, the thickness of the resin mask 20 is preferably 3 μm or more and 25 μm or less. By setting the thickness of the resin mask 20 within this range, it is possible to reduce the risk of defects such as pinholes and deformation, and to effectively prevent the generation of shadows. In particular, by setting the thickness of the resin mask 20 to 3 μm or more and 10 μm or less, more preferably 4 μm or more and 8 μm or less, it is possible to more effectively prevent the influence of shadows when forming a high-definition pattern exceeding 400 ppi. . In addition, in the vapor deposition mask 100 used with the manufacturing method of this invention, the metal mask 10 and the resin mask 20 may be joined directly, and may be joined via the adhesive layer, but it is adhesion. When the metal mask 10 and the resin mask 20 are bonded through the agent layer, the total thickness of the resin mask 20 and the pressure-sensitive adhesive layer is 3 μm or more and 25 μm or less in consideration of the shadow point, preferably It is preferably set to be in the range of 3 μm to 10 μm, particularly preferably 4 μm to 8 μm.

  There is no particular limitation on the shape and size of the opening 25, and any shape and size corresponding to the pattern to be deposited may be used. Moreover, as shown to Fig.1 (a), the pitch P1 of the vertical direction of the adjacent opening part 25 and the pitch P2 of a horizontal direction can also be suitably set according to the pattern produced by vapor deposition.

  There are no particular limitations on the positions at which the openings 25 are formed and the number of openings 25, and one may be formed at a position overlapping the slit 15, or a plurality may be formed in the vertical direction or the horizontal direction. . In the form shown in FIGS. 1 and 2, each slit 15 is formed at a position overlapping a plurality of openings 25 formed in the vertical direction and the horizontal direction.

  The cross-sectional shape of the opening 25 is not particularly limited, and the end faces facing each other of the resin mask forming the opening 25 may be substantially parallel to each other. However, as shown in FIG. It is preferable that the cross-sectional shape has a shape that expands toward the vapor deposition source. In other words, it is preferable to have a tapered surface that expands toward the metal mask 10 side. When the cross-sectional shape of the opening 25 is configured as described above, when the vapor deposition is performed using the vapor deposition mask 200 with the metal frame obtained by the manufacturing method of the first embodiment, a shadow is generated in the pattern to be created. Can be prevented. The taper angle can be appropriately set in consideration of the thickness of the resin mask 20 and the like, but the angle between the bottom end of the bottom of the resin mask and the top of the top of the resin mask is 5 It is preferably in the range of ° to 85 °, more preferably in the range of 15 ° to 75 °, and still more preferably in the range of 25 ° to 65 °. In particular, within this range, an angle smaller than the vapor deposition angle of the vapor deposition machine to be used is preferable. Further, in FIG. 1B, the end face forming the opening 25 has a linear shape, but is not limited to this, and has an outwardly convex curved shape, that is, an opening. The entire shape of the portion 25 may be a bowl shape. The opening 25 having such a cross-sectional shape is, for example, a multi-stage laser that appropriately adjusts the laser irradiation position and laser irradiation energy when the opening 25 is formed, or changes the irradiation position in stages. It can be formed by irradiation.

  Since a resin material is used for the resin mask 20, the opening 25 can be formed regardless of a processing method used in conventional metal processing, for example, a processing method such as an etching method or cutting. That is, the forming method of the opening 25 is not particularly limited, and the opening is made using various processing methods, for example, a laser processing method capable of forming the high-definition opening 25, precision press processing, photolithography processing, or the like. The portion 25 can be formed. A method of forming the opening 25 by a laser processing method or the like will be described later in the manufacturing method of the second embodiment.

  Etching methods include, for example, a wet etching method such as a spray etching method in which an etching material is sprayed from a spray nozzle at a predetermined spray pressure, an immersion etching method in an etching solution filled with the etching material, or a spin etching method in which an etching material is dropped. An etching method or a dry etching method using gas, plasma, or the like can be used.

  Further, in the manufacturing method of the first embodiment, since the resin mask 20 is used as the configuration of the vapor deposition mask 100, when the vapor deposition is performed using the vapor deposition mask 100, the opening 25 of the resin mask 20 is very High heat is applied to the gas, and gas may be generated from the end surface of the resin mask 20 where the opening 25 is formed, which may reduce the degree of vacuum in the vapor deposition apparatus. Therefore, considering this point, it is preferable that a barrier layer 26 is provided on the end surface of the resin mask 20 where the opening 25 is formed, as shown in FIG. By forming the barrier layer 26, it is possible to prevent gas from being generated from the end face where the opening 25 of the resin mask 20 is formed.

  As the barrier layer 26, an inorganic oxide, an inorganic nitride, a metal thin film layer, or a vapor deposition layer can be used. As the inorganic oxide, an oxide of aluminum, silicon, indium, tin, or magnesium can be used, and as the metal, aluminum or the like can be used. The thickness of the barrier layer 26 is preferably about 0.05 μm to 1 μm.

  Furthermore, the barrier layer preferably covers the deposition source side surface of the resin mask 20. The barrier property is further improved by covering the deposition source side surface of the resin mask 20 with the barrier layer 26. In the case of inorganic oxides and inorganic nitrides, the barrier layer is preferably formed by various PVD methods and CVD methods. In the case of a metal, it is preferably formed by a vacuum deposition method. The surface on the vapor deposition source side of the resin mask 20 referred to here may be the entire surface on the vapor deposition source side of the resin mask 20, and is exposed from the metal mask on the surface on the vapor deposition source side of the resin mask 20. It may be only the part which is.

  FIG. 4 is a plan view showing an example of the resin mask 20. As shown in FIG. 4, it is preferable that a groove 28 extending in the vertical direction or the horizontal direction (vertical direction in the case of FIG. 4) of the resin mask 20 is formed on the resin mask 20. When heat is applied at the time of vapor deposition, the resin mask 20 may thermally expand, which may cause a change in the size and position of the opening 25. However, by forming the groove 28, the expansion of the resin mask is absorbed. It is possible to prevent the resin mask 20 from expanding in a predetermined direction as a whole and accumulating the thermal expansion occurring at various portions of the resin mask and changing the size and position of the opening 25. The groove 28 may be provided at a position corresponding to the temporarily fixed portion, or may be provided at a position different from the position corresponding to the temporarily fixed portion.

  In FIG. 4, the grooves 28 extending in the vertical direction are formed between the openings 25. However, the present invention is not limited to this, and a groove extending in the horizontal direction may be formed between the openings 25. Good. Furthermore, it is not limited between the opening parts 25, You may form a groove | channel in the position which overlaps with the opening part 25. FIG. Furthermore, it is possible to form the grooves in a combination of these.

  The depth and width of the groove 28 are not particularly limited. However, if the depth of the groove 28 is too deep or too wide, the rigidity of the resin mask 20 tends to decrease. It is necessary to set in consideration of Further, the cross-sectional shape of the groove is not particularly limited, and may be arbitrarily selected in consideration of a processing method such as a U shape or a V shape.

(Metal mask)
The metal mask 10 is made of metal, and a plurality of slits 15 extending in the vertical direction or the horizontal direction are arranged at positions overlapping the opening 25 when viewed from the front of the metal mask 10. The slit 15 is synonymous with the opening.

  The width of the slit 15 is not particularly limited, and may be appropriately designed according to the pitch between the openings 25 and the pitch between the screens.

  The cross-sectional shape of the slit 15 formed in the metal mask 10 is not particularly limited, but, as with the opening 25 in the resin mask 20, as shown in FIG. It is preferable to have a shape having

  In the illustrated embodiment, the opening shape of the slit 15 has a rectangular shape, but the opening shape is not particularly limited, and the opening shape of the slit 15 may be any shape such as a trapezoidal shape or a circular shape. .

  The material of the metal mask 10 is not particularly limited, and any conventionally known material can be appropriately selected and used in the field of the evaporation mask, and examples thereof include metal materials such as stainless steel, iron-nickel alloy, and aluminum alloy. . Among them, an invar material that is an iron-nickel alloy can be suitably used because it is less deformed by heat.

  Further, as will be described later, when the metal frame 50 and the vapor deposition mask 100 are temporarily fixed using a magnetic force, the metal mask 10 is preferably formed of a magnetic material. Examples of the magnetic metal mask 10 include pure iron, carbon steel, W steel, Cr steel, Co steel, KS steel, MK steel, NKS steel, Cunico steel, and Al-Fe alloy. When the material forming the metal mask 10 is not a magnetic material, the metal mask 10 may be magnetized by dispersing the magnetic powder in the material.

  The thickness of the metal mask 10 is not particularly limited, but is preferably about 5 μm to 100 μm. Considering prevention of shadow during vapor deposition, the thickness of the metal mask 10 is preferably thin. However, when the thickness is smaller than 5 μm, the risk of breakage and deformation increases and handling may be difficult. However, in the present invention, since the metal mask 10 is integrated with the resin mask 20, even when the thickness of the metal mask 10 is as thin as 5 μm, the risk of breakage and deformation can be reduced. It can be used if it is 5 μm or more. When the thickness is greater than 100 μm, shadows may be generated, which is not preferable.

  Hereinafter, the relationship between the occurrence of shadows and the thickness of the metal mask 10 will be described in detail with reference to FIGS. 6 (a) to 6 (c). As shown in FIG. 6A, when the thickness of the metal mask 10 is thin, the vapor deposition material released from the vapor deposition source toward the vapor deposition target is the inner wall surface of the slit 15 of the metal mask 10 or the metal mask. 10 passes through the slit 15 of the metal mask 10 and the opening 25 of the resin mask 20 without colliding with the surface on the side where the resin mask 20 is not formed. Thereby, it becomes possible to form a vapor deposition pattern with a uniform film thickness on the vapor deposition object. That is, the occurrence of shadows can be prevented. On the other hand, as shown in FIG. 6B, when the thickness of the metal mask 10 is thick, for example, when the thickness of the metal mask 10 exceeds 100 μm, a part of the vapor deposition material released from the vapor deposition source. Cannot collide with the inner wall surface of the slit 15 of the metal mask 10 or the surface of the metal mask 10 where the resin mask 20 is not formed, and cannot reach the deposition target. As the amount of the vapor deposition material that cannot reach the vapor deposition target increases, an undeposited portion having a thickness smaller than the target vapor deposition thickness is generated on the vapor deposition target.

  In order to sufficiently prevent the generation of shadows, it is preferable that the cross-sectional shape of the slit 15 is a shape that expands toward the vapor deposition source, as shown in FIG. With such a cross-sectional shape, even if the thickness of the entire deposition mask is increased for the purpose of preventing distortion that may occur in the deposition mask 100 or improving durability, it is emitted from the deposition source. The deposited material can reach the deposition object without colliding with the surface of the slit 15 or the inner wall surface of the slit 15. More specifically, the angle formed by the straight line connecting the lower bottom tip of the slit 15 of the metal mask 10 and the upper bottom tip of the slit 15 of the metal mask 10 and the bottom surface of the metal mask 10 is 5 ° to 85 °. It is preferably within the range, more preferably within the range of 15 ° to 75 °, and even more preferably within the range of 25 ° to 65 °. In particular, within this range, an angle smaller than the vapor deposition angle of the vapor deposition machine to be used is preferable. With such a cross-sectional shape, even if the thickness of the metal mask 10 is relatively thick for the purpose of preventing distortion that may occur in the vapor deposition mask 100 or improving durability, the metal is released from the vapor deposition source. The vapor deposition material can reach the vapor deposition object without colliding with the inner wall surface of the slit 15. As a result, the occurrence of shadows can be more effectively prevented. FIG. 6 is a partial schematic cross-sectional view for explaining the relationship between the generation of shadows and the slits 15 of the metal mask 10. In FIG. 6C, the slit 15 of the metal mask 10 has a cross-sectional shape that expands toward the vapor deposition source, and the end faces of the resin mask 20 facing the opening 25 are substantially parallel. In order to more effectively prevent the occurrence of shadows, the slits of the metal mask 10 and the opening 25 of the resin mask 20 both have a shape in which the cross-sectional shape expands toward the deposition source side. Preferably it is.

  As shown in FIG. 5, in the front view seen from the metal mask 10 side of the vapor deposition mask 100, the openings 25 formed in the resin mask 20 visible from the slits 15 of the metal mask may be alternately arranged in the lateral direction. . In other words, the openings 25 adjacent in the horizontal direction may be shifted in the vertical direction. By arranging in this way, even when the resin mask 20 is thermally expanded, the expansion generated in various places can be absorbed by the opening 25, and the expansion is prevented from accumulating and causing a large deformation. Can do.

  The opening 25 formed in the resin mask 20 does not need to correspond to one pixel. For example, 2 to 10 pixels may be combined into one opening 25.

(Metal frame)
As shown in FIG. 7, the metal frame 50 that is finally welded to the vapor deposition mask 100 is a substantially rectangular frame member that is formed on the resin mask 20 when welded to the vapor deposition mask 100. A through hole 55 is formed so that the opening 25 is exposed. Note that this does not mean that all of the openings 25 formed in the resin mask 20 are exposed from the through holes 55, but in a position where the through holes are not formed, for example, the position overlapping the support 60. A dummy opening that does not contribute to the pattern to be deposited may be formed. The dummy opening is an opening that does not correspond to the pattern to be deposited. The metal frame 50 in the form shown in FIG. 7 has a plurality of through holes 55 defined by a plurality of support bodies 60 provided in the lateral direction. The support 60 is provided to temporarily fix the metal frame 50 and the vapor deposition mask 100. When the metal frame 50 and the vapor deposition mask 100 are overlapped, the opening 25 formed in the resin mask 20 or The metal mask 10 is provided at a position that does not overlap with the slit 15 formed in the metal mask 10. FIG. 7 is a front view showing an example of the metal frame 50. The support 60 is not limited to the illustrated form, and a plurality of supports 60 may be provided in the vertical direction as shown in FIG. 8A, and as shown in FIG. A plurality may be provided in the lateral direction.

  The material of the metal frame 50 is not particularly limited, but a metal material having high rigidity, such as SUS or Invar material, is preferable.

  The thickness of the metal frame is not particularly limited, but is preferably about 3 mm to 100 mm from the viewpoint of rigidity and the like. The width between the inner peripheral end face of the through hole 55 of the metal frame and the outer peripheral end face of the metal frame is not particularly limited as long as the metal frame and the vapor deposition mask 100 can be fixed by welding. A width of about 100 mm can be exemplified.

  The position where the support body 60 is provided is not particularly limited. For example, in the vapor deposition mask 100 in which the openings 25 corresponding to a plurality of screens are formed in the resin mask 20, the positions corresponding to each screen are supported. It is preferable that the body 60 is provided. The width of the support 60 is not particularly limited, and can be appropriately set according to the pitch between the adjacent slits 15.

  The metal frame 50 and the support body 60 may be integrated by one member. The metal frame 50 and the support body 60 may be integrated by attaching a member to be the support body 60 to a member (frame member) to be a frame portion of the metal frame 50. You may have done. Hereinafter, the description will be made centering on the case where the support body 60 is a magnetic body, but the metal frame and the vapor deposition mask or the metal frame and the metal mask with a resin plate are temporarily fixed by a method other than temporary fixing using magnetic force. In some cases, the support 60 is not necessarily a magnetic material, and a resin material or the like can also be used.

(Temporary fixing between metal frame and vapor deposition mask)
Temporary fixing of the metal frame 50 and the vapor deposition mask 100 is performed at a part of a portion where the through hole non-formation region of the metal frame 50 and the slit non-formation region of the metal mask 10 are in direct contact or indirect contact. In addition, the through-hole non-formation area | region of the metal frame 50 means the location in which the through-hole 55 is not formed in the metal frame 50, ie, the metal part of the metal frame 50. The slit non-formation region of the metal mask 10 means a portion where the slit 15 is not formed in the metal mask 10, in other words, a metal portion of the metal mask 10. The frame portion of the metal frame 50 and the support body 60 constitute a through hole non-formation region of the metal frame 50.

  There is no limitation in particular about the method of temporarily fixing the metal frame 50 and the vapor deposition mask 100, and the method illustrated below can be mentioned. Hereinafter, an example of temporary fixing will be described. In the description of temporary fixing, an example in which one vapor deposition mask 50 is temporarily fixed when a plurality of vapor deposition masks 100 are temporarily fixed to the metal frame 50 will be described. In the example described here, a plurality of slits 15 are formed in the metal mask 10, and an opening 25 constituting one screen is formed at a position overlapping with one slit 15. The manufacturing method of the first embodiment may be applied to the manufacture of a vapor deposition mask with a metal frame in which a plurality of vapor deposition masks 100 are welded and fixed to the metal frame 50, and only one vapor deposition mask 100 is fixed to the metal frame 50 by welding. The present invention can also be applied to manufacture of a vapor deposition mask with a metal frame. The same applies to the manufacturing method of the second embodiment.

(Method of temporary fixing using magnetic force)
As one aspect of temporarily fixing the metal frame and the vapor deposition mask 100, a method of temporarily fixing using a magnetic force can be given. Specifically, as shown in FIG. 9, the vapor deposition mask 100 is overlaid on one side of the metal frame 50 so that the metal frame 50 and the metal mask 10 face each other, and on the other side of the metal frame 100. The magnet 70 having a predetermined shape is arranged so as to be in contact with the support body 60, and the metal frame 50 and the vapor deposition mask 100 are temporarily fixed by attracting the magnet 70 and the vapor deposition mask 100 through the support body 60. can do. 9A is a view as seen from the resin mask 20 side of the vapor deposition mask 100, and FIG. 9B is a view as seen from the metal mask 10 side of the vapor deposition mask 100. For convenience of explanation, the magnet 70 is omitted in FIG. When the support 60 and the metal mask 10 are temporarily fixed using magnetic force, the magnetic material described above is used as the metal mask 10.

  Next, the temporary fixing position in the case where temporary fixing is performed using magnetic force will be described with reference to FIGS. FIGS. 9A and 10 are front views for explaining the temporarily fixed position, both of which are viewed from the resin mask 20 side. When the metal frame 50 partitioned into the plurality of through holes 55 by the plurality of support bodies 60 provided in the horizontal direction is used, the support body 60 provided in the horizontal direction, the metal portion of the metal mask 10, and As shown in FIG. 9A, the metal frame is placed at a position where the support 60 and the vapor deposition mask 100 are in contact with each other (a position closed by a broken line in the figure). 50 and the vapor deposition mask 100 are temporarily fixed. Similarly, when using the metal frame 50 partitioned into the plurality of through holes 55 by the plurality of support bodies 60 provided in the vertical direction, the vapor deposition mask is placed along the support body 60. Thus, as shown in FIG. 10A, the metal frame 50 and the vapor deposition mask 100 are temporarily fixed at a location where the support 60 and the vapor deposition mask 100 are in contact (a location closed by a broken line in the figure). . Further, when the metal frame 50 partitioned into the plurality of through holes 55 by the plurality of support bodies 60 provided in the vertical direction and the horizontal direction is used, as shown in FIG. The metal frame 50 and the vapor deposition mask 100 are temporarily fixed at a location where the 60 and the vapor deposition mask 100 are in contact (location closed by a broken line in the figure). FIG. 11A is a plan view showing a state in which a plurality of vapor deposition masks 100 are temporarily fixed to the metal frame 50 provided with the support 60 in the vertical direction and the horizontal direction, and the vertical direction and the horizontal direction. FIG. 11B is a plan view showing a state in which one large-sized vapor deposition mask is temporarily fixed to the metal frame 50 provided with the support 60. FIG. 11 is a plan view as seen from the resin mask 20 side. In each figure showing the temporarily fixed state, the metal portion of the metal mask 10 exists in the area closed by the broken line.

  In the above, an example in which temporary fixing is performed by one magnet 70 has been described. However, as shown in FIG. 12, the magnet 70 may be provided along the support body 60. In this case, the metal frame 50 and the vapor deposition mask 100 are temporarily fixed at the position where the magnet 70 is provided. The position where the magnet 70 is provided is not limited to the illustrated form, and may be appropriately provided at a place where temporary fixing is desired.

  When the metal frame 50 and the vapor deposition mask 100 are fixed by welding, if the support 60 and the magnet 70 are in direct contact with each other, the magnet 70 may be damaged by heat during welding. Therefore, considering this point, it is preferable to provide a heat-resistant layer between the support 60 and the magnet 70. As the material of the heat-resistant layer, a material that is not welded to the support is preferable.

  In the above description, an example is described in which the magnet 70 and the vapor deposition mask 100 are attracted and temporarily fixed using the magnet 70 having a predetermined shape via the support body 60, but the magnet 70 is not used. The metal frame 50 and the vapor deposition mask 100 can be directly temporarily fixed by applying a magnetic force to the support 60 itself. In the temporary fixing using the magnet 70, the magnet 70 is removed after the welding process is completed, so that it can be used repeatedly, which is preferable in this respect.

  In the temporary fixing using the magnetic force, the metal frame 50 and the metal mask 10 are temporarily fixed by the magnet 70, or the metal frame 50 and the metal mask 10 are temporarily fixed by the support body 60 having a magnetic force. . Therefore, the metal part of the metal mask 10 exists in the temporarily fixed location. In other words, the metal frame and the vapor deposition mask 100 are temporarily fixed in the slit non-formation region of the metal mask 10. The same applies to the case where temporary fixing is performed using an adsorption layer described below.

(Method of temporary fixing using an adsorption layer)
As another mode for temporarily fixing the metal frame and the vapor deposition mask 100, an adsorption layer 65 is provided between the support 60 and the metal mask 10 of the vapor deposition mask 100 as shown in FIG. The metal frame 50 and the vapor deposition mask 100 can also be temporarily fixed by using. FIG. 13 is a partially enlarged cross-sectional view of a portion where the metal frame 50 and the vapor deposition mask 100 are temporarily fixed. As temporary fixing using the adsorption layer 65, as the adsorption layer 65, (1) a method of temporarily fixing using an adhesive material and using the adhesive property of the adsorption layer 65, or (2) a liquid material A method for temporarily fixing the metal frame 50 and the vapor deposition mask 100 can be used.

(Method of temporary fixing using adsorption)
Further, as another aspect of temporarily fixing the metal frame and the vapor deposition mask 100, the metal frame 50 and the vapor deposition mask 100 are temporarily fixed using various adsorption methods without using the magnet 70 and the adsorption layer 65. You can also An example of the adsorption method is an air adsorption method. As an example using air adsorption, there is a method in which a suction hole for air adsorption is provided in a part of the support 60 and the metal frame 50 and the vapor deposition mask 100 are temporarily fixed by suction from the suction hole. it can. In addition to this, an electrostatic chuck is used to temporarily fix the metal frame 50 and the vapor deposition mask 100 by electrostatic attraction, and a charging gun is used to temporarily charge the metal frame and the vapor deposition mask. A method of fixing can be mentioned.

  In the various temporary fixings described above, the temporary fixing between the metal frame 50 and the vapor deposition mask 100 is such that the through hole non-formation region of the metal frame 50 and the slit non-formation region of the metal mask 10 are directly or indirectly. May be performed at all locations in contact with the metal frame 50, and may be performed at a portion of the location where the through hole non-formation region of the metal frame 50 and the non-slit formation region of the metal mask 10 are in direct or indirect contact. Also good.

"Process to apply tension to the evaporation mask"
In this step, tension is applied to the vapor deposition mask with the vapor deposition mask 100 temporarily fixed to the metal frame 50 as shown in FIG. The metal frame 50 and the vapor deposition mask 100 are aligned by applying tension to the vapor deposition mask, and then the metal frame is held in a state where the applied tension is held, in other words, in a state where the alignment is accurately performed. By performing the welding fixation of the vapor deposition mask 100 to 50, the positional accuracy between the metal frame 50 and the vapor deposition mask 100 can be improved. In the manufacturing method of the first embodiment, since the metal frame 50 and the vapor deposition mask 100 are temporarily fixed by various methods, a tension is applied to the vapor deposition mask to align the metal frame 50 and the vapor deposition mask 100. The generation of wavy wrinkles that can occur in the vapor deposition mask 100 can be prevented. In addition, when tension is applied without temporarily fixing, wavy wrinkles are likely to occur in the vapor deposition mask 100.

  “Tension” as used in the specification of the present application means a force applied in a direction in which the vapor deposition mask 100 is extended, and “applying a tension in the vapor deposition mask” means applying an external force in a direction in which the vapor deposition mask 100 is extended.

  There is no particular limitation on the method of applying tension, and various conventionally known methods in the field of vapor deposition masks can be used. As a method of applying tension, for example, as shown in FIG. 14, two opposing sides of the vapor deposition mask 100 are gripped by clamps 80 and driving means 85 such as a motor and an air cylinder connected to each clamp 80 are operated. And a method of pulling the clamp 80 as indicated by an arrow. In the illustrated form, the two opposing sides are gripped by the clamp 80 and tension is applied outward in the longitudinal direction, but one of the two opposing sides is fixed and only the other one side is fixed. A tension may be applied outward in the vertical direction. The same applies to the horizontal direction.

  Moreover, there is no limitation in particular about the direction which applies tension | tensile_strength, as shown in figure, you may apply tension | tensile_strength toward the vertical direction outward, toward a horizontal direction outward, or a vertical direction outward and a horizontal direction outward. You may apply tension toward it. In general, a tension is applied toward one of the longitudinally outward direction and the laterally outward direction. Moreover, when applying tension, it is desirable to apply tension to the vapor deposition mask without twisting or distortion. In the illustrated embodiment, the end of the vapor deposition mask 100 protrudes outward from the end of the metal frame, and the protruding portion is held by the clamp 80. The protruding portion is cut and removed after a step of welding and fixing described later. Cutting off the end is an optional step. Note that the step of applying the tension is not limited to the illustrated form, and the tension can be applied without causing the end of the vapor deposition mask 100 to protrude from the end of the metal frame 50. FIG. 14A is a front view showing a state in which tension is applied while only one vapor deposition mask 100 of the plurality of vapor deposition masks 100 is temporarily fixed to the metal frame, and FIG. These are front views which show a state when tension | tensile_strength is applied simultaneously in the state which temporarily fixed the some vapor deposition mask 100. FIG. 14B, the plurality of vapor deposition masks are held by the clamps 80 corresponding to the respective vapor deposition masks, in other words, one driving means 85 is connected to one clamp 80. However, the plurality of vapor deposition masks may be held by an integrated clamp obtained by integrating a plurality of clamps.

  The tension value applied to the vapor deposition mask can be measured, for example, using a single point type load cell (LC-4101-K006) manufactured by A & D Co., Ltd.

"Process to weld and fix metal frame and vapor deposition mask"
In this step, the metal frame 50 and the vapor deposition mask 100 are welded and fixed in a state where tension is applied to the vapor deposition mask 100 temporarily fixed to the metal frame 50. Thereby, the vapor deposition mask 200 with a metal frame in which the vapor deposition mask 100 is fixed to the metal frame 50 by welding is obtained.

  There is no particular limitation on the method for fixing by welding. For example, a conventionally known welding method such as an electric resistance welding method such as a laser welding method, an electron beam welding method, or a seam welding, or an arc welding method such as MIG, TIG, or MAG is appropriately selected. Can be used.

  There is no particular limitation on the position at which the metal frame 50 and the vapor deposition mask 100 are fixed by welding. For example, as shown in FIG. 15, there is a method of welding at a position where the vapor deposition mask 100 and the frame portion of the metal frame 50 are in contact. It is common.

  In addition to this, as shown in FIG. 16A, a part of the position where the support 60 and the metal portion of the metal mask 10 included in the vapor deposition mask 100 are in direct or indirect contact, that is, the through hole. The metal frame 50 and the vapor deposition mask 100 are fixed by welding at a part of the position where the support 60 that is the non-formation region and the metal portion of the metal mask 10 that is the non-slit formation region directly or indirectly contact each other. You can also. Further, as shown in FIG. 16B, welding fixing can be performed both at a position where the vapor deposition mask 100 and the metal frame 50 are in contact with each other and at a position where the support 60 and the metal portion of the metal mask 10 are in contact. . 15 and 16 are plan views seen from the resin mask 20 side, and the metal frame 50 and the metal mask 10 of the vapor deposition mask 100 are fixed by welding in a region closed by a broken line. In FIG. 16, the clamp 80 and the drive means 85 are omitted. In the illustrated embodiment, welding and fixing are performed at all positions where the support 60 and the metal portion of the metal mask 10 are in contact with each other. In other words, the welding fixing is performed in a line shape, but the welding fixing may be performed in a spot shape or other shapes.

  In the manufacturing method of the first embodiment, when a plurality of vapor deposition masks 100 are welded and fixed to the metal frame 50, (i) “temporary fixing step” and (ii) “tension is applied to one vapor deposition mask 100. After performing the “process” and (iii) “welding and fixing process”, a plurality of vapor deposition masks 100 are formed on the metal frame 50 by repeating the processes (i) to (iii) for other vapor deposition masks. It is possible to obtain a vapor deposition mask 100 with a metal frame in which is fixed by welding. Moreover, after performing the process (i) for each vapor deposition mask, the processes (ii) and (iii) can be performed simultaneously for all the vapor deposition masks. In addition, the steps (i) and (ii) are performed for one vapor deposition mask, the steps (i) and (ii) are performed in the same manner for the other vapor deposition masks, and finally, the above process is performed for all the vapor deposition masks. The step (iii) can also be performed simultaneously. 17 and 18 show a vapor deposition mask 200 with a metal frame manufactured by the manufacturing method of the first embodiment. 17 and 18 are both plan views as seen from the resin mask side.

<Manufacturing Method of Second Embodiment>
The manufacturing method of the vapor deposition mask with a metal frame according to the second embodiment includes a fixing step of fixing a metal mask with a resin plate in which a metal mask having a plurality of slits and a resin plate are laminated on the metal frame, and a resin plate Irradiating the resin plate with a laser from the metal mask side of the attached metal mask through the slit and forming a plurality of openings corresponding to the pattern to be deposited and formed at positions overlapping with the plurality of slits of the resin plate, and fixing In the process, the metal frame and the metal mask with a resin plate are overlapped so that the metal frame and the metal mask face each other, and the through hole non-formation region of the metal frame and the slit non-formation region of the metal mask are directly Alternatively, at a part of the indirect contact portion, the step of temporarily fixing the metal mask with a resin plate on the metal frame and the step of temporarily mounting the metal mask with a resin plate on the metal frame A step of applying tension to the metal mask with a resin plate in a fixed state, and a step of welding and fixing the metal frame and the metal mask with a resin plate at a predetermined position in a state of applying tension to the metal mask with a resin plate. And the step of forming the opening is characterized in that it is performed between the step of applying tension and the step of fixing by welding or after the step of fixing by welding. The manufacturing method of the second embodiment does not temporarily fix the vapor deposition mask to the metal frame, but temporarily fixes the metal mask with a resin plate to the metal frame and applies tension to the resin in the metal mask with the resin plate. It differs from the manufacturing method of the said 1st Embodiment by the point which forms an opening part in a board and manufactures a vapor deposition mask with a metal frame. Hereinafter, the manufacturing method of the second embodiment will be described focusing on the differences from the manufacturing method of the first embodiment.

“Process to temporarily fix metal mask with resin plate on metal frame”
In this step, as shown in FIG. 19, the metal mask with resin plate 40 is temporarily fixed to the metal frame 50. FIG. 19 is a plan view showing a state where the metal mask with resin plate 40 is temporarily fixed to the metal frame 50, (a) is a view seen from the resin plate 30 side, and (b) is the metal mask 10 side. FIG. In the manufacturing method of the first embodiment, as shown in FIGS. 9 to 11, an example using a large magnet 70 that contacts all the supports 60 is given. However, in the manufacturing method of the second embodiment, an opening is used. Since the laser beam is irradiated through the slit 15 in the step of forming the portion 25, as shown in FIG. 19, the magnet is positioned at the position overlapping with the slit 15, in other words, at the position where the opening 25 is to be formed. 70 is preferably not provided. In the manufacturing method of the second embodiment, even when the magnet 70 is provided at a position overlapping with the slit 15, the opening 25 may be formed in the resin plate 30 through the magnet 70 by laser light. it can. However, in this case, the magnet 70 is damaged and the magnet cannot be used repeatedly, which is not preferable in terms of cost. In addition, due to the presence of the magnet 70, the dimensional accuracy of the formed opening 25 may be reduced. As the temporary fixing method, the method described in the manufacturing method of the first embodiment can be used as it is, and a detailed description thereof is omitted here.

  The arrangement position of the magnet 70 is not limited to the form shown in FIG. 19, and can be set as appropriate as long as the formation of the opening 25 is not hindered. FIG. 20 is a diagram illustrating an example of a positional relationship between the support body 60 and the magnet 70. The arrangement of the magnet 70 can be applied as it is in the manufacturing method of the first embodiment.

(Metal mask with resin plate)
The metal mask 40 with a resin plate used in this step is formed by laminating the metal mask 10 formed with a plurality of slits 15 and the resin plate 30. As the metal mask 10, the one described in the manufacturing method of the first embodiment can be used as it is. The resin plate 30 becomes the resin mask 20 by finally forming the opening 25, and the material and the thickness of the resin plate 30 are the same as those of the manufacturing method of the first embodiment. The described materials can be appropriately selected and used.

  The method for bonding the metal mask 10 having a plurality of slits 15 and the resin plate 30 to form the metal mask 40 with a resin plate and the resin plate 30 is not particularly limited. It is also possible to obtain a metal mask with a resin plate by preparing a laminate having a resin layer formed by coating and forming slits 15 in the metal plate in the state of the laminate. In the present invention, the resin plate constituting the metal mask with a resin plate includes a resin layer and a resin film formed by coating as described above. That is, the resin plate may be prepared in advance or may be formed by a conventionally known coating method or the like. The resin plate 30 is a concept including a resin film and a resin sheet. Further, the hardness of the resin plate 30 is not limited, and may be a hard plate or a soft plate. Moreover, the metal mask 10 in which the slit 15 is formed and the resin plate 30 may be bonded together using various adhesives, or a resin plate having self-adhesiveness may be used. The size of the metal mask 10 formed with the slits 15 and the resin plate 30 may be the same. Considering the subsequent fixing to the metal frame 50, if the size of the resin plate 30 is made smaller than that of the metal mask 10 and the outer peripheral portion of the metal mask 10 is exposed, the metal mask 10 and the frame It is preferable because it is easy to weld.

  As a method for forming the metal mask 10, a masking member, for example, a resist material is applied to the surface of the metal plate, a predetermined portion is exposed and developed, and finally a position where one slit 15 is formed. A resist pattern is formed leaving As the resist material used as the masking member, those having good processability and desired resolution are preferable. Next, etching is performed by an etching method using this resist pattern as an etching resistant mask. After the etching is completed, the resist pattern is removed by washing. Thereby, the metal mask 10 in which the slit 15 is formed is obtained. Etching for forming the slit 15 may be performed from one side of the metal plate or from both sides. In addition, when forming a slit 15 in a metal plate using a laminate in which a metal plate and a resin plate are laminated, a masking member is applied to the surface of the metal plate that is not in contact with the resin plate. The slit 15 is formed by etching from one side. When the resin plate 30 has etching resistance to the etching material of the metal plate, it is not necessary to mask the surface of the resin plate, but when the resin plate 30 does not have resistance to the etching material of the metal plate. Needs to be coated with a masking member on the surface of the resin plate. In the above description, the resist material is mainly described as the masking member. However, instead of coating the resist material, a dry film resist may be laminated and the same patterning may be performed. Further, instead of forming the slits 15 by etching, the slits 15 can be formed by irradiating laser light.

"Process to apply tension to metal mask with resin plate"
In this step, tension is applied to the metal mask with resin plate 40 while the metal mask with resin plate 40 is temporarily fixed to the metal frame 50. About the method of applying tension, various methods described in the manufacturing method of the first embodiment may be used.

"Process for forming openings"
In this step, the metal mask 40 with a resin plate is irradiated with laser light from the metal mask 10 side of the metal mask 40 with a resin plate in a state where the tension is applied to the metal mask 40 with the resin plate, that is, the metal mask 40 with the resin plate is held. An opening 25 corresponding to the pattern to be deposited is formed at a position overlapping the slit 15 of the mask 10. Thereby, the vapor deposition mask 100 obtained by laminating the metal mask 10 in which the slits 15 are formed and the resin mask 20 in which the openings 25 are formed is obtained. At this stage, the vapor deposition mask 100 exists in a state of being temporarily fixed to the metal frame 50, so that generation of wavy wrinkles that can occur in the vapor deposition mask 100 is also prevented.

  In the second embodiment, since the opening 25 is formed in a state where tension is applied, it is possible to form the opening 25 with high definition without causing variations in the dimensions of the opening 25. In addition, when tension is applied after the opening 25 is formed, the dimension of the opening 25 may vary depending on the tension. Therefore, the manufacturing method of the second embodiment can obtain the vapor deposition mask 200 with a metal frame in which the vapor deposition mask 100 including the resin mask 20 in which an extremely high-definition opening is formed is fixed to the metal frame 50 by welding. This is superior to the manufacturing method of the first embodiment.

  The laser device used in this step is not particularly limited, and a conventionally known laser device may be used.

  In addition, when the opening 25 is formed in the metal mask 40 with a resin plate temporarily fixed to the metal frame, a reference plate (in which a pattern for vapor deposition, that is, a pattern corresponding to the opening 25 to be formed is provided in advance. (Not shown) is prepared, and the reference plate is bonded to the surface of the resin plate where the metal mask 10 is not formed, and laser irradiation corresponding to the pattern of the reference plate is performed from the metal mask 10 side. May be. According to this method, the opening 25 can be formed in a so-called facing-off state in which laser irradiation is performed while observing the pattern of the reference plate bonded to the resin plate of the metal mask with the resin plate, and the dimensions of the opening. The high-definition opening 25 with extremely high accuracy can be formed. Moreover, since this method forms the opening part 25 in the state temporarily fixed to the metal frame 50, it can be set as the vapor deposition mask excellent not only in dimensional accuracy but in positional accuracy.

  In the case of using the above method, it is necessary that the pattern of the reference plate can be recognized by a laser irradiation device or the like through the resin plate 30 from the metal mask 10 side. As the resin plate, when it has a certain thickness, it is necessary to use a transparent one. However, as described above, a preferable thickness considering the influence of shadow, for example, about 3 μm to 25 μm. In the case of the thickness, the reference plate pattern can be recognized even with a colored resin plate.

"Process to weld and fix metal frame and vapor deposition mask"
In this step, the metal frame 50 and the vapor deposition mask 100 are welded and fixed in a state where tension is applied to the vapor deposition mask 100 temporarily fixed to the metal frame 50, that is, in a state where the tension applied to the metal mask with resin plate is maintained. Is called. Thereby, the vapor deposition mask 200 with the metal frame obtained by welding and fixing the vapor deposition mask 100 to the metal frame 50 is obtained in a state where the metal frame 50 and the vapor deposition mask 100 are accurately aligned. In this step, the method described in the manufacturing method of the first embodiment can be used as it is, and detailed description thereof is omitted.

<Modification of Manufacturing Method of Second Embodiment>
In the manufacturing method of the second embodiment, the step of forming the opening 25 in the resin plate 30 of the metal mask with resin plate 40 is performed after the step of applying tension and before the step of welding and fixing. However, instead of this embodiment, the step of forming the opening 25 in the resin plate 30 of the metal mask with resin plate 40 may be performed after the metal frame 50 and the metal mask with resin plate 40 are fixed by welding. Good. Even when the step of forming the opening 25 is performed between or after the step of applying the tension and the step of fixing by welding, after the step of fixing by welding, the opening 25 is formed. In this step, the metal mask with resin plate 40 is temporarily fixed in a state where tension is applied to the metal frame 50, or is welded and fixed in a state where tension is applied. Therefore, the vapor deposition mask 100 including the resin mask 20 in which the extremely high-definition opening 25 is formed is welded to the metal frame 50 without causing a dimensional variation that may occur due to tension applied to the formed opening 25. The vapor deposition mask 200 with a fixed metal frame can be obtained.

(Method for manufacturing organic semiconductor element)
Next, the manufacturing method of the organic semiconductor element of this invention is demonstrated. The method for producing an organic semiconductor element of the present invention includes a step of forming a vapor deposition pattern by a vapor deposition method using a vapor deposition mask with a metal frame, and the following vapor deposition mask with a metal frame is used in the step of forming the organic semiconductor element. It is characterized in that

  An organic semiconductor device manufacturing method according to an embodiment having a step of forming a vapor deposition pattern by a vapor deposition method using a vapor deposition mask with a metal frame includes an electrode formation step of forming an electrode on a substrate, an organic layer formation step, and a counter electrode formation A vapor deposition pattern is formed on the substrate by a vapor deposition method using a vapor deposition mask with a metal frame in each arbitrary step. For example, when the vapor deposition method using the vapor deposition mask with a metal frame is applied to the organic layer forming step, a vapor deposition pattern of the organic layer is formed on the substrate. In addition, the manufacturing method of the organic-semiconductor element of this invention is not limited to these processes, It is applicable to the arbitrary processes of the conventionally well-known organic-semiconductor element using a vapor deposition method.

  In the method for producing an organic semiconductor element of the present invention, a metal frame having a through hole, a metal mask having a plurality of slits, and an opening corresponding to a pattern to be deposited are formed at positions overlapping the slits. The vapor deposition mask formed by laminating the resin mask is overlapped so that the metal frame and the metal mask face each other, and the through hole non-formation region of the metal frame and the slit non-formation region of the metal mask are directly or At a part of the indirect contact portion, the step of temporarily fixing the vapor deposition mask to the metal frame, the step of applying tension to the vapor deposition mask with the vapor deposition mask temporarily fixed to the metal frame, and the tension to the vapor deposition mask In the applied state, the metal frame and the vapor deposition mask are used for the vapor deposition mask with the metal frame manufactured by the step of welding and fixing at a predetermined location. To have the feature.

  As for the vapor deposition mask 200 with a metal frame used in the method for producing an organic semiconductor element of the present invention, the vapor deposition mask 200 with a metal frame produced by the production method of the present invention described above can be used as it is. Detailed description is omitted. According to the vapor deposition mask 200 with a metal frame described above, an organic semiconductor element having a high-definition pattern can be formed by the opening 25 having high dimensional accuracy of the vapor deposition mask 200 with the metal frame. As an organic semiconductor element manufactured with the manufacturing method of this invention, the organic layer, light emitting layer, cathode electrode, etc. of an organic EL element can be mentioned, for example. In particular, the method for producing an organic semiconductor element of the present invention can be suitably used for producing R, G, and B light emitting layers of organic EL elements that require high-definition pattern accuracy.

  In addition, the present invention prevents the generation of wavy wrinkles that can occur in the vapor deposition mask by applying tension to the vapor deposition mask after temporarily fixing the vapor deposition mask to the metal frame in manufacturing the vapor deposition mask with the metal frame. However, for example, when measuring the dimensions of the vapor deposition mask, by applying tension while the vapor deposition mask is temporarily fixed to the metal frame, the occurrence of wavy wrinkles can be prevented in the same way, and measurement that can be caused by wavy wrinkles An error can also be prevented.

DESCRIPTION OF SYMBOLS 10 ... Metal mask 15 ... Slit 20 ... Resin mask 25 ... Opening part 30 ... Resin board 40 ... Metal mask with resin board 50 ... Metal frame 55 ... Through-hole 60 ... Supporting body 65 ... Adsorption layer 80 ... Clamp 85 ... Driving means 100 ... Evaporation mask 200 ... Evaporation mask with metal frame

Claims (26)

A method of manufacturing a vapor deposition mask with a metal frame,
An evaporation mask formed by laminating a metal mask having a slit and a resin mask having an opening corresponding to a pattern to be deposited at a position overlapping the slit is fixed to a metal frame in which a through hole is formed. Having a fixing process,
The fixing step includes
Wherein such metal frame and said metal mask is opposed, superposed and the metal frame and the deposition mask, a through hole unformed region of the metal frame, and a slit formed area of the metal mask directly, Or, in a part of the indirectly contact portion, temporarily fixing the vapor deposition mask to the metal frame,
Applying tension to the vapor deposition mask in a state where the vapor deposition mask is temporarily fixed to the metal frame;
Fixing the metal frame and the vapor deposition mask at a predetermined location in a state where tension is applied to the vapor deposition mask,
A method of manufacturing a vapor deposition mask with a metal frame. A plurality of vapor deposition masks fixed to the metal frame;
The manufacturing method of the vapor deposition mask with a metal frame of Claim 1.   An opening necessary for forming a vapor deposition pattern for one screen is formed at a position overlapping the slit of the resin mask.
  The manufacturing method of the vapor deposition mask with a metal frame of Claim 1 or 2.   An opening necessary for forming a deposition pattern for two or more screens is formed at a position overlapping the slit of the resin mask.
  The manufacturing method of the vapor deposition mask with a metal frame of Claim 1 or 2.   Among the two or more screens, the distance of the distance between the opening necessary for forming the vapor deposition pattern for one screen and the opening necessary for forming the vapor deposition pattern for the other one screen. When the distance between the screens is the shortest distance between the screens, the distance between the screens is longer than the distance between adjacent openings in the openings necessary to form a vapor deposition pattern for one screen,
  The manufacturing method of the vapor deposition mask with a metal frame of Claim 4.   The distance between the screens is in the range of 1 mm to 100 mm,
  The manufacturing method of the vapor deposition mask with a metal frame of Claim 5.   The resin mask has a groove;
  The manufacturing method of the vapor deposition mask with a metal frame of any one of Claims 1 thru | or 6.   The resin mask has a groove between an assembly of openings necessary for forming a deposition pattern for one screen and an assembly of openings necessary for forming another deposition pattern for one screen. Have
  The manufacturing method of the vapor deposition mask with a metal frame of any one of Claims 4 thru | or 6.   There are a plurality of the openings that overlap the slits, the openings are arranged in a plurality of rows in the vertical direction, and the openings in adjacent rows are shifted from each other in the vertical direction, or horizontally There are a plurality of rows aligned in the direction, and the openings of adjacent rows are arranged offset in the lateral direction.
  The manufacturing method of the vapor deposition mask with a metal frame of any one of Claims 1 thru | or 8.   The resin mask has a thickness of 4 μm or more and 8 μm or less,
  The manufacturing method of the vapor deposition mask with a metal frame of any one of Claims 1 thru | or 9.   A method of manufacturing a vapor deposition mask with a metal frame,
  A fixing step of fixing a metal mask with a resin plate in which a metal mask having a slit and a resin plate are laminated on a metal frame in which a through hole is formed;
  Irradiating the resin plate with a laser from the metal mask side of the metal mask with a resin plate through the slit, and forming an opening corresponding to a pattern to be deposited and formed at a position overlapping the slit of the resin plate;
  Have
  The fixing step includes
  The metal frame and the metal mask with resin plate are overlapped so that the metal frame and the metal mask face each other, and a through hole non-formation region of the metal frame and a slit non-formation region of the metal mask are formed. A step of temporarily fixing the metal mask with a resin plate to the metal frame in a part of the portion that directly or indirectly contacts;
  Applying tension to the metal mask with resin plate in a state where the metal mask with resin plate is temporarily fixed to the metal frame;
  The step of fixing the metal frame and the metal mask with a resin plate at a predetermined position in a state where tension is applied to the metal mask with a resin plate,
  Including
  The step of forming the opening is performed between the step of applying the tension and the step of fixing, or after the step of fixing.
  A method of manufacturing a vapor deposition mask with a metal frame.   The metal mask with the resin plate,
  Preparing a laminate of a resin plate and a metal plate;
  Forming a slit in the metal plate of the laminate;
  Formed by,
  The manufacturing method of the vapor deposition mask with a metal frame of Claim 11.   Forming the slit by etching;
  The manufacturing method of the vapor deposition mask with a metal frame of Claim 12.   In the step of preparing the laminate of the resin plate and the metal plate, a resin layer is formed on the metal plate by coating.
  The manufacturing method of the vapor deposition mask with a metal frame of Claim 12 or 13.   In the step of preparing the laminate of the resin plate and the metal plate, the metal plate and the resin plate are bonded together.
  The manufacturing method of the vapor deposition mask with a metal frame of Claim 12 or 13.   There are a plurality of metal masks with resin plates fixed to the metal frame,
  The manufacturing method of the vapor deposition mask with a metal frame of any one of Claims 11 thru | or 15.   Forming the opening comprises:
  The step of forming the opening in the resin plate of the metal mask with a resin plate so that the slit and the opening necessary for forming the vapor deposition pattern for one screen overlap.
  The manufacturing method of the vapor deposition mask with a metal frame of any one of Claims 11 thru | or 16.   Forming the opening comprises:
  The step of forming the opening in the resin plate of the metal mask with a resin plate so that the slit and the opening necessary for forming a deposition pattern for two or more screens overlap.
  The manufacturing method of the vapor deposition mask with a metal frame of any one of Claims 11 thru | or 16.   Forming the opening comprises:
  Among the two or more screens, the distance of the distance between the opening necessary for forming the vapor deposition pattern for one screen and the opening necessary for forming the vapor deposition pattern for the other one screen. When the distance between the screens is the shortest distance between the screens, the distance between the screens is longer than the distance between adjacent openings in the openings necessary to form the vapor deposition pattern for one screen. So as to form the opening,
  The manufacturing method of the vapor deposition mask with a metal frame of Claim 18.   Forming the opening so that a distance between the screens is 1 mm or more and 100 mm or less;
  The manufacturing method of the vapor deposition mask with a metal frame of Claim 19.   The resin plate has a groove;
  The manufacturing method of the vapor deposition mask with a metal frame of any one of Claims 11 thru | or 20.   The resin plate is necessary for forming an aggregate of openings necessary for forming a deposition pattern for one screen formed in the step of forming the opening and another deposition pattern for one screen. Having a groove between the assembly of openings,
  The manufacturing method of the vapor deposition mask with a metal frame of any one of Claims 18 thru | or 20.   Forming the opening comprises:
  A plurality of openings are arranged in a row in the vertical direction, and the openings in adjacent rows are shifted from each other in the vertical direction, or a plurality of rows are arranged in the horizontal direction, and adjacent rows Is a step of forming a plurality of the openings so that the openings are arranged laterally displaced from each other.
  The manufacturing method of the vapor deposition mask with a metal frame of any one of Claims 11 thru | or 22.   The thickness of the resin plate is in the range of 4 μm or more and 8 μm or less.
  The manufacturing method of the vapor deposition mask with a metal frame of any one of Claims 11 thru | or 23.   A method of manufacturing an organic semiconductor element using a vapor deposition method,
  A metal frame-equipped vapor deposition mask manufactured by the method for producing a metal frame-equipped vapor deposition mask according to any one of claims 1 to 24 is used.
  A method for producing an organic semiconductor element.   A method of forming a pattern produced by vapor deposition,
  A metal frame-equipped vapor deposition mask manufactured by the method for producing a metal frame-equipped vapor deposition mask according to any one of claims 1 to 24 is used.
  Pattern formation method.

Images