JP6304044B2 - 感放射線樹脂組成物および電子部品 - Google Patents

感放射線樹脂組成物および電子部品 Download PDF

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Publication number
JP6304044B2
JP6304044B2 JP2014559797A JP2014559797A JP6304044B2 JP 6304044 B2 JP6304044 B2 JP 6304044B2 JP 2014559797 A JP2014559797 A JP 2014559797A JP 2014559797 A JP2014559797 A JP 2014559797A JP 6304044 B2 JP6304044 B2 JP 6304044B2
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ene
hept
acid
sulfur
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Japanese (ja)
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JPWO2014119777A1 (ja
Inventor
聡 阿部
聡 阿部
隆志 堤
隆志 堤
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Zeon Corp
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Zeon Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/27—Compounds containing a nitrogen atom bound to two other nitrogen atoms, e.g. diazoamino-compounds
    • C08K5/28—Azides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C08K5/375—Thiols containing six-membered aromatic rings

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2014559797A 2013-02-04 2014-02-03 感放射線樹脂組成物および電子部品 Active JP6304044B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013019167 2013-02-04
JP2013019167 2013-02-04
PCT/JP2014/052408 WO2014119777A1 (ja) 2013-02-04 2014-02-03 感放射線樹脂組成物および電子部品

Publications (2)

Publication Number Publication Date
JPWO2014119777A1 JPWO2014119777A1 (ja) 2017-01-26
JP6304044B2 true JP6304044B2 (ja) 2018-04-04

Family

ID=51262475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014559797A Active JP6304044B2 (ja) 2013-02-04 2014-02-03 感放射線樹脂組成物および電子部品

Country Status (5)

Country Link
JP (1) JP6304044B2 (ko)
KR (1) KR102217197B1 (ko)
CN (1) CN104969125B (ko)
TW (1) TWI632163B (ko)
WO (1) WO2014119777A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016063909A1 (ja) * 2014-10-24 2016-04-28 住友ベークライト株式会社 感光性接着剤組成物および半導体装置
JPWO2017038620A1 (ja) * 2015-08-31 2018-06-14 日本ゼオン株式会社 樹脂組成物
US11467494B2 (en) * 2019-03-15 2022-10-11 Merck Patent Gmbh Positive type photosensitive polysiloxane composition
TW202422223A (zh) 2019-10-15 2024-06-01 美商羅門哈斯電子材料有限公司 光致抗蝕劑組成物及圖案形成方法
WO2023176680A1 (ja) * 2022-03-14 2023-09-21 株式会社Adeka 組成物及び硬化物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4222306B2 (ja) * 2002-09-30 2009-02-12 日本ゼオン株式会社 ポジ型感放射線性樹脂組成物、樹脂パターン膜とその形成方法、及び樹脂パターン膜の利用
JP4590893B2 (ja) * 2004-03-23 2010-12-01 Ｊｓｒ株式会社 接着剤用液状硬化性樹脂組成物
JP2005292278A (ja) * 2004-03-31 2005-10-20 Nippon Zeon Co Ltd 感放射線組成物、積層体及びその製造方法並びに電子部品
JP5589270B2 (ja) * 2007-10-23 2014-09-17 Ｊｓｒ株式会社 青色カラーフィルタ用感放射線性組成物、カラーフィルタ及び液晶表示素子
KR101274384B1 (ko) * 2008-06-20 2013-06-19 동우 화인켐 주식회사 청색 감광성 수지 조성물, 이를 이용한 컬러필터 및 액정표시장치
JP5306903B2 (ja) * 2008-07-02 2013-10-02 富士フイルム株式会社 インプリント用硬化性組成物、これを用いた硬化物およびその製造方法、並びに、液晶表示装置用部材
JP5476758B2 (ja) * 2009-03-19 2014-04-23 Ｊｓｒ株式会社 感放射線性樹脂組成物、液晶表示素子の層間絶縁膜、保護膜及びスペーサーとその形成方法
KR20120089650A (ko) * 2009-10-16 2012-08-13 제이에스알 가부시끼가이샤 감방사선성 수지 조성물 및 층간 절연막의 형성 방법
JP5716672B2 (ja) * 2009-11-30 2015-05-13 日立化成株式会社 感光性樹脂組成物、感光性樹脂ワニス、感光性樹脂フィルム、及び感光性樹脂硬化物
JP2012212039A (ja) * 2011-03-31 2012-11-01 Sekisui Chem Co Ltd 感光性組成物及びプリント配線板
TWI507819B (zh) * 2011-03-31 2015-11-11 Toyo Ink Sc Holdings Co Ltd 著色組成物及用此之彩色濾光片
JP6010322B2 (ja) * 2012-04-09 2016-10-19 株式会社カネカ 硬化性組成物およびその用途

Also Published As

Publication number Publication date
TW201439127A (zh) 2014-10-16
KR102217197B1 (ko) 2021-02-17
KR20150115832A (ko) 2015-10-14
CN104969125A (zh) 2015-10-07
JPWO2014119777A1 (ja) 2017-01-26
WO2014119777A1 (ja) 2014-08-07
CN104969125B (zh) 2019-06-04
TWI632163B (zh) 2018-08-11

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