JP6293433B2 - シリコーン樹脂組成物 - Google Patents

シリコーン樹脂組成物 Download PDF

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Publication number
JP6293433B2
JP6293433B2 JP2013160713A JP2013160713A JP6293433B2 JP 6293433 B2 JP6293433 B2 JP 6293433B2 JP 2013160713 A JP2013160713 A JP 2013160713A JP 2013160713 A JP2013160713 A JP 2013160713A JP 6293433 B2 JP6293433 B2 JP 6293433B2
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silicone resin
silicon atom
group
resin composition
oligomer
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JP2013160713A
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Japanese (ja)
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JP2014043572A5 (enExample
JP2014043572A (ja
Inventor
高島　正之
正之 高島
岳 吉川
岳 吉川
剛史 亀田
剛史 亀田
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Sumitomo Chemical Co Ltd
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Sumitomo Chemical Co Ltd
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JP2013160713A 2012-08-01 2013-08-01 シリコーン樹脂組成物 Active JP6293433B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013160713A JP6293433B2 (ja) 2012-08-01 2013-08-01 シリコーン樹脂組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012171444 2012-08-01
JP2012171444 2012-08-01
JP2013160713A JP6293433B2 (ja) 2012-08-01 2013-08-01 シリコーン樹脂組成物

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JP2014043572A JP2014043572A (ja) 2014-03-13
JP2014043572A5 JP2014043572A5 (enExample) 2016-08-18
JP6293433B2 true JP6293433B2 (ja) 2018-03-14

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6694568B2 (ja) * 2015-03-27 2020-05-20 Hoya株式会社 硬化性樹脂組成物、および光半導体装置
JP2017008297A (ja) * 2015-06-16 2017-01-12 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 硬化性樹脂組成物、光学素子および光半導体装置
CN108368344A (zh) * 2015-12-21 2018-08-03 住友化学株式会社 有机硅树脂组合物及其应用
US20200149520A1 (en) * 2017-04-28 2020-05-14 Panasonic Appliances Refrigeration Devices Singapore Sealed refrigerant compressor and refrigeration device including same
KR102053996B1 (ko) * 2018-09-27 2019-12-09 한양대학교 산학협력단 배리어, 배리어 제조방법, 배리어를 포함하는 디스플레이, 및 배리어를 포함하는 디스플레이의 제조방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5263171B2 (ja) * 2007-11-19 2013-08-14 東亞合成株式会社 ポリシロキサンおよびその製造方法ならびに硬化物の製造方法
CN102365315B (zh) * 2009-03-27 2014-12-10 旭硝子株式会社 有机聚硅氧烷和硬涂剂组合物以及具有硬涂层的树脂基板
JP2011202154A (ja) * 2010-03-01 2011-10-13 Yokohama Rubber Co Ltd:The 加熱硬化性光半導体封止用シリコーン樹脂組成物およびこれを用いる光半導体封止体
JPWO2012046784A1 (ja) * 2010-10-05 2014-02-24 旭硝子株式会社 ハードコート被膜付き樹脂基板およびその製造方法

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