JP6291412B2 - 位置決めフレーム構造 - Google Patents

位置決めフレーム構造 Download PDF

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Publication number
JP6291412B2
JP6291412B2 JP2014263987A JP2014263987A JP6291412B2 JP 6291412 B2 JP6291412 B2 JP 6291412B2 JP 2014263987 A JP2014263987 A JP 2014263987A JP 2014263987 A JP2014263987 A JP 2014263987A JP 6291412 B2 JP6291412 B2 JP 6291412B2
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Japan
Prior art keywords
chamber
positioning
carrier
frame structure
holder
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JP2014263987A
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English (en)
Japanese (ja)
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JP2015132601A5 (cg-RX-API-DMAC7.html
JP2015132601A (ja
Inventor
ウー ティエンシュン
ウー ティエンシュン
ホワン チュヨンウエイ
ホワン チュヨンウエイ
シェイ シャオチー
シェイ シャオチー
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Sensata Technologies Changzhou Co Ltd
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Sensata Technologies Changzhou Co Ltd
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Publication of JP2015132601A5 publication Critical patent/JP2015132601A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/30—Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/026—Housings for speed measuring devices, e.g. pulse generator
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
    • G01P3/42—Devices characterised by the use of electric or magnetic means
    • G01P3/44—Devices characterised by the use of electric or magnetic means for measuring angular speed
    • G01P3/48—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage
    • G01P3/481—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals
    • G01P3/488—Devices characterised by the use of electric or magnetic means for measuring angular speed by measuring frequency of generated current or voltage of pulse signals delivered by variable reluctance detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
JP2014263987A 2013-12-31 2014-12-26 位置決めフレーム構造 Active JP6291412B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310752418.3 2013-12-31
CN201310752418.3A CN104749390B (zh) 2013-12-31 2013-12-31 定位框架结构

Publications (3)

Publication Number Publication Date
JP2015132601A JP2015132601A (ja) 2015-07-23
JP2015132601A5 JP2015132601A5 (cg-RX-API-DMAC7.html) 2018-02-08
JP6291412B2 true JP6291412B2 (ja) 2018-03-14

Family

ID=52423542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014263987A Active JP6291412B2 (ja) 2013-12-31 2014-12-26 位置決めフレーム構造

Country Status (5)

Country Link
US (1) US9564351B2 (cg-RX-API-DMAC7.html)
EP (1) EP2896966B1 (cg-RX-API-DMAC7.html)
JP (1) JP6291412B2 (cg-RX-API-DMAC7.html)
KR (1) KR20150079466A (cg-RX-API-DMAC7.html)
CN (1) CN104749390B (cg-RX-API-DMAC7.html)

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US5115194A (en) * 1990-09-27 1992-05-19 Kearney-National Inc. Hall effect position sensor with flux limiter and magnetic dispersion means
US5255795A (en) * 1991-12-05 1993-10-26 Vlsi Technology, Inc. Test fixture
JPH07101163B2 (ja) * 1992-10-14 1995-11-01 カーニー−ナショナル・インコーポレーテッド 磁束制限器及び磁気分散手段を備えるホール効果位置センサ
US7876188B2 (en) * 2006-11-06 2011-01-25 Tang System Green technologies: the killer application of EMI-free on-chip inductor
US5414355A (en) * 1994-03-03 1995-05-09 Honeywell Inc. Magnet carrier disposed within an outer housing
JPH08139429A (ja) * 1994-11-07 1996-05-31 Sumitomo Electric Ind Ltd 電子回路装置
US5500589A (en) * 1995-01-18 1996-03-19 Honeywell Inc. Method for calibrating a sensor by moving a magnet while monitoring an output signal from a magnetically sensitive component
US5581179A (en) * 1995-05-31 1996-12-03 Allegro Microsystems, Inc. Hall-effect ferrous-article-proximity sensor assembly
JPH09133743A (ja) * 1995-11-08 1997-05-20 Murata Mfg Co Ltd 磁気センサ
US6355885B1 (en) * 1996-05-02 2002-03-12 William J. Rintz Sub frame assembly for light switch assembly
US6288533B1 (en) * 1997-05-29 2001-09-11 Physical Electronics Laboratory Method and apparatus for detecting rotor position by use of magnetic field sensor pairs
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JPH11153452A (ja) * 1997-11-20 1999-06-08 Hitachi Ltd 回転検出装置
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US5868251A (en) * 1997-11-06 1999-02-09 Lin; Wan-Chang Disk-shaped storage case for screwdriver tips
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WO2003003407A1 (en) * 2001-06-28 2003-01-09 Greene, Tweed Of Delaware, Inc. Self contained sensing apparatus and system
US6707293B2 (en) * 2001-11-15 2004-03-16 Honeywell International Inc. 360-degree rotary position sensor having a magnetoresistive sensor and a hall sensor
JP4179083B2 (ja) * 2003-07-08 2008-11-12 株式会社デンソー 回転検出装置
US7462317B2 (en) * 2004-11-10 2008-12-09 Enpirion, Inc. Method of manufacturing an encapsulated package for a magnetic device
DE102005047414B4 (de) * 2005-02-21 2012-01-05 Infineon Technologies Ag Magnetoresistives Sensormodul und Verfahren zum Herstellen desselben
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Also Published As

Publication number Publication date
CN104749390A (zh) 2015-07-01
CN104749390B (zh) 2020-07-03
EP2896966B1 (en) 2021-06-23
US9564351B2 (en) 2017-02-07
US20150187623A1 (en) 2015-07-02
EP2896966A1 (en) 2015-07-22
KR20150079466A (ko) 2015-07-08
JP2015132601A (ja) 2015-07-23

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