JP2016540393A5 - - Google Patents

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Publication number
JP2016540393A5
JP2016540393A5 JP2016516529A JP2016516529A JP2016540393A5 JP 2016540393 A5 JP2016540393 A5 JP 2016540393A5 JP 2016516529 A JP2016516529 A JP 2016516529A JP 2016516529 A JP2016516529 A JP 2016516529A JP 2016540393 A5 JP2016540393 A5 JP 2016540393A5
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JP
Japan
Prior art keywords
magnetic field
substrate
dipole
plane
dipole coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2016516529A
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English (en)
Japanese (ja)
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JP2016540393A (ja
Filing date
Publication date
Priority claimed from US14/036,526 external-priority patent/US9495899B2/en
Application filed filed Critical
Publication of JP2016540393A publication Critical patent/JP2016540393A/ja
Publication of JP2016540393A5 publication Critical patent/JP2016540393A5/ja
Ceased legal-status Critical Current

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JP2016516529A 2013-09-25 2014-09-24 面内磁界を使用する非接触データ通信、ならびに関連するシステムおよび方法 Ceased JP2016540393A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/036,526 2013-09-25
US14/036,526 US9495899B2 (en) 2013-09-25 2013-09-25 Contactless data communication using in-plane magnetic fields, and related systems and methods
PCT/US2014/057176 WO2015048104A2 (en) 2013-09-25 2014-09-24 Contactless data communication using in-plane magnetic fields, and related systems and methods

Publications (2)

Publication Number Publication Date
JP2016540393A JP2016540393A (ja) 2016-12-22
JP2016540393A5 true JP2016540393A5 (cg-RX-API-DMAC7.html) 2017-10-05

Family

ID=51846938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016516529A Ceased JP2016540393A (ja) 2013-09-25 2014-09-24 面内磁界を使用する非接触データ通信、ならびに関連するシステムおよび方法

Country Status (8)

Country Link
US (2) US9495899B2 (cg-RX-API-DMAC7.html)
EP (1) EP3050218A2 (cg-RX-API-DMAC7.html)
JP (1) JP2016540393A (cg-RX-API-DMAC7.html)
KR (1) KR20160062083A (cg-RX-API-DMAC7.html)
CN (1) CN105580284B (cg-RX-API-DMAC7.html)
BR (1) BR112016006531A2 (cg-RX-API-DMAC7.html)
CA (1) CA2922509A1 (cg-RX-API-DMAC7.html)
WO (1) WO2015048104A2 (cg-RX-API-DMAC7.html)

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Publication number Priority date Publication date Assignee Title
JP6202853B2 (ja) * 2013-03-29 2017-09-27 キヤノン株式会社 給電装置
US9495899B2 (en) 2013-09-25 2016-11-15 Qualcomm Incorporated Contactless data communication using in-plane magnetic fields, and related systems and methods
CN103794224B (zh) * 2014-01-27 2017-01-11 华中科技大学 一种基于相变磁性材料的非易失性逻辑器件及逻辑操作方法
WO2016154762A1 (en) * 2015-04-02 2016-10-06 Insight Diagnostics Inc. Portable detection device
US10027381B2 (en) 2016-07-27 2018-07-17 Micron Technology, Inc. Method and apparatus for inductive coupling signal transmission
US10580560B2 (en) 2016-12-28 2020-03-03 Wits Co., Ltd. Coil module
GB2565310B (en) * 2017-08-08 2020-05-13 Advanced Risc Mach Ltd 3D interconnected die stack
JP2019047030A (ja) 2017-09-05 2019-03-22 Tdk株式会社 スピン流磁化反転素子、磁気抵抗効果素子、磁気メモリ及び高周波磁気素子
US10741318B2 (en) * 2017-09-05 2020-08-11 Tdk Corporation Spin current magnetization rotational element, spin-orbit-torque magnetoresistance effect element, magnetic memory, and high-frequency magnetic element
US11115084B2 (en) * 2018-11-27 2021-09-07 Allegro Microsystems, Llc Isolated data transfer system
US11630169B1 (en) 2022-01-17 2023-04-18 Allegro Microsystems, Llc Fabricating a coil above and below a magnetoresistance element
US11782105B2 (en) 2022-01-17 2023-10-10 Allegro Microsystems, Llc Fabricating planarized coil layer in contact with magnetoresistance element
US12364163B2 (en) 2022-08-30 2025-07-15 Allegro Microsystems, Llc Fabricating an electroconductive contact on a top layer of a tunneling magnetoresistance element using two hard masks

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WO2003023913A1 (en) * 2001-09-06 2003-03-20 Brown University Research Fondation Magneto-optoelectronic switch and sensor
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US7164181B2 (en) * 2003-07-30 2007-01-16 Hewlett-Packard Development Company, L.P. Spin injection devices
ATE386949T1 (de) 2003-12-23 2008-03-15 Nxp Bv Hochempfindlicher magnetischer eingebauter stromsensor
US7088611B2 (en) 2004-11-30 2006-08-08 Infineon Technologies Ag MRAM with switchable ferromagnetic offset layer
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JP5265689B2 (ja) 2008-09-22 2013-08-14 アルプス・グリーンデバイス株式会社 磁気結合型アイソレータ
US8630585B2 (en) * 2008-09-24 2014-01-14 Lg Electronics Inc. Method and apparatus for communicating with external interface device using contactless
JP5299675B2 (ja) * 2008-11-27 2013-09-25 Ｔｄｋ株式会社 信号伝送装置
JP5440837B2 (ja) * 2009-03-26 2014-03-12 Ｔｄｋ株式会社 信号伝達装置
WO2010113383A1 (ja) * 2009-03-31 2010-10-07 日本電気株式会社 半導体装置
CN201788291U (zh) * 2010-03-11 2011-04-06 清华大学 极低频发射接收系统、极低频发射机和极低频接收机
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US8791533B2 (en) 2012-01-30 2014-07-29 Broadcom Corporation Semiconductor package having an interposer configured for magnetic signaling
JP5464307B2 (ja) * 2012-02-24 2014-04-09 株式会社村田製作所 アンテナ装置および無線通信装置
US9030780B2 (en) * 2012-08-08 2015-05-12 The United States Of America As Represented By The Secretary Of The Army Method and apparatus for reading a non-volatile memory using a spin torque oscillator
US9495899B2 (en) 2013-09-25 2016-11-15 Qualcomm Incorporated Contactless data communication using in-plane magnetic fields, and related systems and methods

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