JP6283502B2 - ワーク厚み測定器 - Google Patents
ワーク厚み測定器 Download PDFInfo
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- JP6283502B2 JP6283502B2 JP2013241674A JP2013241674A JP6283502B2 JP 6283502 B2 JP6283502 B2 JP 6283502B2 JP 2013241674 A JP2013241674 A JP 2013241674A JP 2013241674 A JP2013241674 A JP 2013241674A JP 6283502 B2 JP6283502 B2 JP 6283502B2
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- measuring
- plate
- workpiece
- chuck table
- measurement
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- 238000005259 measurement Methods 0.000 claims description 75
- 230000007246 mechanism Effects 0.000 claims description 47
- 239000000523 sample Substances 0.000 claims description 37
- 238000001514 detection method Methods 0.000 claims 1
- 230000003028 elevating effect Effects 0.000 description 22
- 238000004891 communication Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- A Measuring Device Byusing Mechanical Method (AREA)
Description
11a、51a 第1の測定機構
11b、51b 第2の測定機構
12、57 高さ差測定部
13、65 原点出し部
15a、53a 第1の測定子
15b、53b 第2の測定子
16a、16b、52a、52b 昇降シリンダ(第1、第2の移動部)
17a、17b 板バネ(第1、第2の移動部)
31、63 センサ部
32、64 センサ面
33、61 測定板
41 チャックテーブル
42 チャックテーブルの上面
48 板状ワークの上面
W 板状ワーク
Claims (1)
- チャックテーブルで保持する板状ワークの厚みを測定するワーク厚み測定器であって、
該チャックテーブルの上面に接触する第1の測定子と、該第1の測定子を該チャックテーブルの上面に対して垂直方向に移動させる第1の移動部と、を備える第1の測定機構と、
該チャックテーブルの上面に保持される板状ワークの上面に接触させる第2の測定子と、該第2の測定子を該チャックテーブルの上面に対して垂直方向に移動させる第2の移動部と、を備える第2の測定機構と、
該第1の測定子の高さと該第2の測定子の高さとの差を測定する高さ差測定部と、
同一面上に該第1の測定子と該第2の測定子とを接触させた時の該高さ差測定部が測定した測定値をゼロにして該高さ差測定部の原点出しを行なう原点出し部と、で少なくとも構成され、
該高さ差測定部が測定した測定値を板状ワークの厚みとするワーク厚み測定器。
Priority Applications (1)
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JP2013241674A JP6283502B2 (ja) | 2013-11-22 | 2013-11-22 | ワーク厚み測定器 |
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JP2013241674A JP6283502B2 (ja) | 2013-11-22 | 2013-11-22 | ワーク厚み測定器 |
Publications (2)
Publication Number | Publication Date |
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JP2015102365A JP2015102365A (ja) | 2015-06-04 |
JP6283502B2 true JP6283502B2 (ja) | 2018-02-21 |
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JP2013241674A Active JP6283502B2 (ja) | 2013-11-22 | 2013-11-22 | ワーク厚み測定器 |
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JP (1) | JP6283502B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105157652B (zh) * | 2015-08-31 | 2018-06-19 | 株洲壹星科技股份有限公司 | 一种受电弓弓头碳滑块厚度检测方法 |
CN105004305B (zh) * | 2015-08-31 | 2018-10-30 | 株洲壹星科技股份有限公司 | 一种受电弓弓头碳滑块厚度检测装置 |
CN108225242B (zh) * | 2017-12-19 | 2019-12-03 | 苏州鼎纳自动化技术有限公司 | 一种手机屏幕钢化玻璃膜厚度检测检测方法 |
CN108225241B (zh) * | 2017-12-19 | 2019-11-12 | 徐州诚凯知识产权服务有限公司 | 一种手机屏幕钢化玻璃膜厚度检测装置 |
JP7364385B2 (ja) | 2019-07-26 | 2023-10-18 | 株式会社ディスコ | 研削装置 |
JP7330905B2 (ja) * | 2020-01-16 | 2023-08-22 | 株式会社東京精密 | 接触式板厚測定器における自己診断装置 |
CN111426292B (zh) * | 2020-04-27 | 2022-01-28 | 珠海格力大金机电设备有限公司 | 功率器件安装高度自动测量设备及其加工方法、电路板测量系统 |
CN113405512B (zh) * | 2021-06-17 | 2022-08-23 | 浙江爱丽智能检测技术集团有限公司 | 一种土工织物厚度测定装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0336761U (ja) * | 1989-03-31 | 1991-04-10 | ||
US5951370A (en) * | 1997-10-02 | 1999-09-14 | Speedfam-Ipec Corp. | Method and apparatus for monitoring and controlling the flatness of a polishing pad |
JP2000006018A (ja) * | 1998-06-23 | 2000-01-11 | Disco Abrasive Syst Ltd | 研削装置 |
JP5025200B2 (ja) * | 2006-09-19 | 2012-09-12 | 株式会社ディスコ | 研削加工時の厚さ測定方法 |
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