JP6272239B2 - ステンシルプリンターを作動させるためのシステムおよび方法 - Google Patents

ステンシルプリンターを作動させるためのシステムおよび方法 Download PDF

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Publication number
JP6272239B2
JP6272239B2 JP2014555659A JP2014555659A JP6272239B2 JP 6272239 B2 JP6272239 B2 JP 6272239B2 JP 2014555659 A JP2014555659 A JP 2014555659A JP 2014555659 A JP2014555659 A JP 2014555659A JP 6272239 B2 JP6272239 B2 JP 6272239B2
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Japan
Prior art keywords
printer
plug
material applicator
application
operating system
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JP2014555659A
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Japanese (ja)
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JP2015517197A (ja
JP2015517197A5 (https=
Inventor
ジョエル ブルーム ジョナサン
ジョエル ブルーム ジョナサン
エー．ペラウルト ジョセフ
エー．ペラウルト ジョセフ
イー．ドネラン マイケル
イー．ドネラン マイケル
イー．フォックス ジェイムズ
イー．フォックス ジェイムズ
ルフェーブル グレゴリー
ルフェーブル グレゴリー
Original Assignee
イリノイ トゥール ワークス インコーポレイティド
イリノイ トゥール ワークス インコーポレイティド
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Publication of JP2015517197A5 publication Critical patent/JP2015517197A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0881—Machines for printing on polyhedral articles
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00—Arrangements for program control, e.g. control units
    • G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/44—Arrangements for executing specific programs
    • G06F9/445—Program loading or initiating
    • G06F9/44521—Dynamic linking or loading; Link editing at or after load time, e.g. Java class loading
    • G06F9/44526—Plug-ins; Add-ons
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00—Arrangements for program control, e.g. control units
    • G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/46—Multiprogramming arrangements
    • G06F9/54—Interprogram communication
    • G06F9/547—Remote procedure calls [RPC]; Web services
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

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  • Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
JP2014555659A 2012-02-01 2013-01-30 ステンシルプリンターを作動させるためのシステムおよび方法 Active JP6272239B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/363,586 US9060437B2 (en) 2012-02-01 2012-02-01 System and method for operating a stencil printer
US13/363,586 2012-02-01
PCT/US2013/023759 WO2013116278A1 (en) 2012-02-01 2013-01-30 System and method for operating a stencil printer

Publications (3)

Publication Number Publication Date
JP2015517197A JP2015517197A (ja) 2015-06-18
JP2015517197A5 JP2015517197A5 (https=) 2016-03-24
JP6272239B2 true JP6272239B2 (ja) 2018-01-31

Family

ID=47748757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014555659A Active JP6272239B2 (ja) 2012-02-01 2013-01-30 ステンシルプリンターを作動させるためのシステムおよび方法

Country Status (8)

Country Link
US (1) US9060437B2 (https=)
EP (1) EP2810542B1 (https=)
JP (1) JP6272239B2 (https=)
KR (1) KR101925665B1 (https=)
CN (1) CN104221479B (https=)
MY (1) MY172390A (https=)
PL (1) PL2810542T3 (https=)
WO (1) WO2013116278A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9370925B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Stencil printer having stencil shuttle assembly
US9370924B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Dual action stencil wiper assembly for stencil printer
US10723117B2 (en) 2015-04-07 2020-07-28 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US9370923B1 (en) 2015-04-07 2016-06-21 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10703089B2 (en) 2015-04-07 2020-07-07 Illinois Tool Works Inc. Edge lock assembly for a stencil printer
CN106227946B (zh) * 2016-07-26 2019-03-12 上海望友信息科技有限公司 一种pcb网板制作方法及系统
US11453170B2 (en) 2017-08-31 2022-09-27 General Electric Company Distribution of customized engineering models for additive manufacturing
EP3815350A4 (en) * 2018-06-27 2021-11-03 Hewlett-Packard Development Company, L.P. OPERATION PERFORMANCE APPLIED TO A DOCUMENT
US12259715B2 (en) * 2021-10-27 2025-03-25 Illinois Tool Works Inc. Open application interface for industrial equipment
US12190129B2 (en) * 2022-01-04 2025-01-07 Citrix Systems, Inc. Control over application plugins

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001059569A2 (en) * 2000-02-09 2001-08-16 Apriva, Inc. Communication systems, components, and methods with programmable wireless devices
US6754551B1 (en) 2000-06-29 2004-06-22 Printar Ltd. Jet print apparatus and method for printed circuit board manufacturing
US7117504B2 (en) * 2001-07-10 2006-10-03 Microsoft Corporation Application program interface that enables communication for a network software platform
US7292900B2 (en) 2001-07-13 2007-11-06 Siemens Aktiengesellschaft Power distribution expert system
US7003871B2 (en) 2003-10-01 2006-02-28 Integrated Ideas & Technologies, Inc. Solder paste stencil manufacturing system
US7013802B2 (en) 2004-02-19 2006-03-21 Speedline Technologies, Inc. Method and apparatus for simultaneous inspection and cleaning of a stencil
JP4539496B2 (ja) 2005-08-25 2010-09-08 オムロン株式会社 半田材検査装置、半田材検査装置の制御方法、半田材検査プログラム、半田材検査プログラムを記録したコンピュータ読み取り可能な記録媒体
US7324861B1 (en) * 2006-11-30 2008-01-29 Chun Bin Zheng Numerical control system and method for laser cutting SMT stencil
CN101204871B (zh) * 2006-12-23 2011-06-29 海德堡印刷机械股份公司 用于外围设备的基于浏览器的操作界面
US8413577B2 (en) * 2008-11-19 2013-04-09 Illinois Tool Works Inc. Vertically separated pass through conveyor system and method in surface mount technology process equipment
TW201110022A (en) 2009-09-15 2011-03-16 Inventec Corp Plug-in downloading system for expanding functions of software and method thereof

Also Published As

Publication number Publication date
EP2810542A1 (en) 2014-12-10
JP2015517197A (ja) 2015-06-18
EP2810542B1 (en) 2016-12-07
CN104221479B (zh) 2017-06-23
CN104221479A (zh) 2014-12-17
KR101925665B1 (ko) 2018-12-05
MY172390A (en) 2019-11-22
US9060437B2 (en) 2015-06-16
PL2810542T3 (pl) 2017-06-30
KR20140119804A (ko) 2014-10-10
US20130192482A1 (en) 2013-08-01
WO2013116278A1 (en) 2013-08-08

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