KR101925665B1 - 스텐실 프린터 작동 시스템 및 방법 - Google Patents

스텐실 프린터 작동 시스템 및 방법 Download PDF

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Publication number
KR101925665B1
KR101925665B1 KR1020147024563A KR20147024563A KR101925665B1 KR 101925665 B1 KR101925665 B1 KR 101925665B1 KR 1020147024563 A KR1020147024563 A KR 1020147024563A KR 20147024563 A KR20147024563 A KR 20147024563A KR 101925665 B1 KR101925665 B1 KR 101925665B1
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South Korea
Prior art keywords
printer
plug
material applicator
operating system
function
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Korean (ko)
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KR20140119804A (ko
Inventor
조나단 조엘 블룸
조셉 에이 페로
마이클 이 도니란
제임스 이 폭스
그레고리 르페브르
Original Assignee
일리노이즈 툴 워크스 인코포레이티드
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Publication of KR20140119804A publication Critical patent/KR20140119804A/ko
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Publication of KR101925665B1 publication Critical patent/KR101925665B1/ko
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/08Machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/08Machines
    • B41F15/0881Machines for printing on polyhedral articles
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00Arrangements for program control, e.g. control units
    • G06F9/06Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/44Arrangements for executing specific programs
    • G06F9/445Program loading or initiating
    • G06F9/44521Dynamic linking or loading; Link editing at or after load time, e.g. Java class loading
    • G06F9/44526Plug-ins; Add-ons
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00Arrangements for program control, e.g. control units
    • G06F9/06Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/46Multiprogramming arrangements
    • G06F9/54Interprogram communication
    • G06F9/547Remote procedure calls [RPC]; Web services
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

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  • Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
KR1020147024563A 2012-02-01 2013-01-30 스텐실 프린터 작동 시스템 및 방법 Active KR101925665B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/363,586 US9060437B2 (en) 2012-02-01 2012-02-01 System and method for operating a stencil printer
US13/363,586 2012-02-01
PCT/US2013/023759 WO2013116278A1 (en) 2012-02-01 2013-01-30 System and method for operating a stencil printer

Publications (2)

Publication Number Publication Date
KR20140119804A KR20140119804A (ko) 2014-10-10
KR101925665B1 true KR101925665B1 (ko) 2018-12-05

Family

ID=47748757

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147024563A Active KR101925665B1 (ko) 2012-02-01 2013-01-30 스텐실 프린터 작동 시스템 및 방법

Country Status (8)

Country Link
US (1) US9060437B2 (https=)
EP (1) EP2810542B1 (https=)
JP (1) JP6272239B2 (https=)
KR (1) KR101925665B1 (https=)
CN (1) CN104221479B (https=)
MY (1) MY172390A (https=)
PL (1) PL2810542T3 (https=)
WO (1) WO2013116278A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9370925B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Stencil printer having stencil shuttle assembly
US9370924B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Dual action stencil wiper assembly for stencil printer
US10723117B2 (en) 2015-04-07 2020-07-28 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US9370923B1 (en) 2015-04-07 2016-06-21 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10703089B2 (en) 2015-04-07 2020-07-07 Illinois Tool Works Inc. Edge lock assembly for a stencil printer
CN106227946B (zh) * 2016-07-26 2019-03-12 上海望友信息科技有限公司 一种pcb网板制作方法及系统
US11453170B2 (en) 2017-08-31 2022-09-27 General Electric Company Distribution of customized engineering models for additive manufacturing
EP3815350A4 (en) * 2018-06-27 2021-11-03 Hewlett-Packard Development Company, L.P. OPERATION PERFORMANCE APPLIED TO A DOCUMENT
US12259715B2 (en) * 2021-10-27 2025-03-25 Illinois Tool Works Inc. Open application interface for industrial equipment
US12190129B2 (en) * 2022-01-04 2025-01-07 Citrix Systems, Inc. Control over application plugins

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070046283A1 (en) 2005-08-25 2007-03-01 Omron Corporation Solder material test apparatus, and method of controlling the same
US20080152411A1 (en) 2006-12-23 2008-06-26 Heidelberger Druckmaschinen Ag Graphic Arts Machine, Such as a Printing Press, Having a Browser-Based Operator Control Device for Auxiliary Equipment

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001059569A2 (en) * 2000-02-09 2001-08-16 Apriva, Inc. Communication systems, components, and methods with programmable wireless devices
US6754551B1 (en) 2000-06-29 2004-06-22 Printar Ltd. Jet print apparatus and method for printed circuit board manufacturing
US7117504B2 (en) * 2001-07-10 2006-10-03 Microsoft Corporation Application program interface that enables communication for a network software platform
US7292900B2 (en) 2001-07-13 2007-11-06 Siemens Aktiengesellschaft Power distribution expert system
US7003871B2 (en) 2003-10-01 2006-02-28 Integrated Ideas & Technologies, Inc. Solder paste stencil manufacturing system
US7013802B2 (en) 2004-02-19 2006-03-21 Speedline Technologies, Inc. Method and apparatus for simultaneous inspection and cleaning of a stencil
US7324861B1 (en) * 2006-11-30 2008-01-29 Chun Bin Zheng Numerical control system and method for laser cutting SMT stencil
US8413577B2 (en) * 2008-11-19 2013-04-09 Illinois Tool Works Inc. Vertically separated pass through conveyor system and method in surface mount technology process equipment
TW201110022A (en) 2009-09-15 2011-03-16 Inventec Corp Plug-in downloading system for expanding functions of software and method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070046283A1 (en) 2005-08-25 2007-03-01 Omron Corporation Solder material test apparatus, and method of controlling the same
US20080152411A1 (en) 2006-12-23 2008-06-26 Heidelberger Druckmaschinen Ag Graphic Arts Machine, Such as a Printing Press, Having a Browser-Based Operator Control Device for Auxiliary Equipment

Also Published As

Publication number Publication date
EP2810542A1 (en) 2014-12-10
JP2015517197A (ja) 2015-06-18
EP2810542B1 (en) 2016-12-07
CN104221479B (zh) 2017-06-23
CN104221479A (zh) 2014-12-17
MY172390A (en) 2019-11-22
US9060437B2 (en) 2015-06-16
PL2810542T3 (pl) 2017-06-30
KR20140119804A (ko) 2014-10-10
US20130192482A1 (en) 2013-08-01
WO2013116278A1 (en) 2013-08-08
JP6272239B2 (ja) 2018-01-31

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