JP6267800B2 - 新規なシクロジシラザン誘導体およびその製造方法、並びにそれを用いたシリコン含有薄膜 - Google Patents
新規なシクロジシラザン誘導体およびその製造方法、並びにそれを用いたシリコン含有薄膜 Download PDFInfo
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- JP6267800B2 JP6267800B2 JP2016545305A JP2016545305A JP6267800B2 JP 6267800 B2 JP6267800 B2 JP 6267800B2 JP 2016545305 A JP2016545305 A JP 2016545305A JP 2016545305 A JP2016545305 A JP 2016545305A JP 6267800 B2 JP6267800 B2 JP 6267800B2
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- chemical formula
- thin film
- silicon
- derivative
- cyclodisilazane
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- 239000010409 thin film Substances 0.000 title claims description 75
- IVSQMSIRHKTHCB-UHFFFAOYSA-N 1,3,2,4-diazadisiletidine Chemical class N1[SiH2]N[SiH2]1 IVSQMSIRHKTHCB-UHFFFAOYSA-N 0.000 title claims description 47
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 37
- 229910052710 silicon Inorganic materials 0.000 title claims description 37
- 239000010703 silicon Substances 0.000 title claims description 37
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000000126 substance Substances 0.000 claims description 62
- 229910052739 hydrogen Inorganic materials 0.000 claims description 22
- 239000001257 hydrogen Substances 0.000 claims description 22
- 229910052736 halogen Inorganic materials 0.000 claims description 17
- 150000002367 halogens Chemical class 0.000 claims description 17
- 125000000217 alkyl group Chemical group 0.000 claims description 15
- 125000006729 (C2-C5) alkenyl group Chemical group 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 10
- 150000002431 hydrogen Chemical class 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 8
- 238000000427 thin-film deposition Methods 0.000 claims description 7
- FIRQYUPQXNPTKO-UHFFFAOYSA-N ctk0i2755 Chemical class N[SiH2]N FIRQYUPQXNPTKO-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 150000004756 silanes Chemical class 0.000 claims description 5
- 125000006701 (C1-C7) alkyl group Chemical group 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 125000003342 alkenyl group Chemical group 0.000 claims 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 38
- 238000006243 chemical reaction Methods 0.000 description 33
- 239000010408 film Substances 0.000 description 28
- 239000000706 filtrate Substances 0.000 description 27
- 238000003756 stirring Methods 0.000 description 18
- 238000005530 etching Methods 0.000 description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 238000000231 atomic layer deposition Methods 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 16
- 229910052814 silicon oxide Inorganic materials 0.000 description 16
- SMMKQHPDWHNVTM-UHFFFAOYSA-N 2,4-dimethyl-1,3-di(propan-2-yl)-1,3,2,4-diazadisiletidine Chemical compound C(C)(C)N1[SiH](N([SiH]1C)C(C)C)C SMMKQHPDWHNVTM-UHFFFAOYSA-N 0.000 description 15
- 238000001914 filtration Methods 0.000 description 14
- 239000003960 organic solvent Substances 0.000 description 14
- 239000002243 precursor Substances 0.000 description 14
- 239000002904 solvent Substances 0.000 description 14
- 239000007787 solid Substances 0.000 description 13
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 12
- OQPWZFZIPPTWAU-UHFFFAOYSA-N 2,2-dimethyl-1,3-di(propan-2-yl)-1,3,2,4-diazadisiletidine Chemical compound C(C)(C)N1[SiH2]N([Si]1(C)C)C(C)C OQPWZFZIPPTWAU-UHFFFAOYSA-N 0.000 description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 11
- 238000003786 synthesis reaction Methods 0.000 description 11
- 238000005481 NMR spectroscopy Methods 0.000 description 10
- 238000000151 deposition Methods 0.000 description 10
- 230000008021 deposition Effects 0.000 description 10
- 229910052581 Si3N4 Inorganic materials 0.000 description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 230000009257 reactivity Effects 0.000 description 8
- LJJSAEBJNYWIKJ-UHFFFAOYSA-N 4-chloro-2,2-dimethyl-1,3-di(propan-2-yl)-1,3,2,4-diazadisiletidine Chemical compound C(C)(C)N1[SiH](N([Si]1(C)C)C(C)C)Cl LJJSAEBJNYWIKJ-UHFFFAOYSA-N 0.000 description 7
- 238000009835 boiling Methods 0.000 description 7
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 description 6
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical group [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 6
- 238000004821 distillation Methods 0.000 description 6
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 5
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 5
- 229910000103 lithium hydride Inorganic materials 0.000 description 5
- 238000007736 thin film deposition technique Methods 0.000 description 5
- 229910052783 alkali metal Chemical class 0.000 description 4
- 150000001340 alkali metals Chemical class 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 4
- -1 silane chlorides Chemical class 0.000 description 4
- KNLYOIPBYANIIH-UHFFFAOYSA-N 1,3-di(propan-2-yl)-1,3,2,4-diazadisiletidine Chemical compound C(C)(C)N1[SiH2]N([SiH2]1)C(C)C KNLYOIPBYANIIH-UHFFFAOYSA-N 0.000 description 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 3
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 3
- 229910052987 metal hydride Inorganic materials 0.000 description 3
- 150000004681 metal hydrides Chemical class 0.000 description 3
- UNOQITWAUFOMKI-UHFFFAOYSA-N n-[dimethyl-(propan-2-ylamino)silyl]propan-2-amine Chemical compound CC(C)N[Si](C)(C)NC(C)C UNOQITWAUFOMKI-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 239000012495 reaction gas Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 239000012686 silicon precursor Substances 0.000 description 3
- 238000002411 thermogravimetry Methods 0.000 description 3
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 3
- 239000005052 trichlorosilane Substances 0.000 description 3
- 125000006592 (C2-C3) alkenyl group Chemical group 0.000 description 2
- ROBSEZCWFSHPBJ-UHFFFAOYSA-N 1,3-dimethyl-1,3,2,4-diazadisiletidine Chemical compound CN1[SiH2]N([SiH2]1)C ROBSEZCWFSHPBJ-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- DSIFQEONNJIUBP-UHFFFAOYSA-N C(C)(C)N1[Si](N([Si]1(Cl)C)C(C)C)(Cl)C Chemical compound C(C)(C)N1[Si](N([Si]1(Cl)C)C(C)C)(Cl)C DSIFQEONNJIUBP-UHFFFAOYSA-N 0.000 description 2
- JNZBEZUBRSQRLK-UHFFFAOYSA-N C(C)(C)N1[Si](N([Si]1(Cl)Cl)C(C)C)(Cl)Cl Chemical compound C(C)(C)N1[Si](N([Si]1(Cl)Cl)C(C)C)(Cl)Cl JNZBEZUBRSQRLK-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- 229910010082 LiAlH Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 229960001701 chloroform Drugs 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000004817 gas chromatography Methods 0.000 description 2
- 238000012844 infrared spectroscopy analysis Methods 0.000 description 2
- 238000003402 intramolecular cyclocondensation reaction Methods 0.000 description 2
- UBJFKNSINUCEAL-UHFFFAOYSA-N lithium;2-methylpropane Chemical compound [Li+].C[C-](C)C UBJFKNSINUCEAL-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- LQHCLCXITSFOLO-UHFFFAOYSA-N Cl[Si](NC(C)C)(C)Cl Chemical compound Cl[Si](NC(C)C)(C)Cl LQHCLCXITSFOLO-UHFFFAOYSA-N 0.000 description 1
- YGPLDDRYUUWKJG-UHFFFAOYSA-N Cl[Si](NC(C)C)(Cl)Cl Chemical compound Cl[Si](NC(C)C)(Cl)Cl YGPLDDRYUUWKJG-UHFFFAOYSA-N 0.000 description 1
- JKUKRNNPKWPILB-UHFFFAOYSA-N Cl[Si]1(N[Si](N1)(Cl)Cl)Cl Chemical compound Cl[Si]1(N[Si](N1)(Cl)Cl)Cl JKUKRNNPKWPILB-UHFFFAOYSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- BIVNKSDKIFWKFA-UHFFFAOYSA-N N-propan-2-yl-N-silylpropan-2-amine Chemical compound CC(C)N([SiH3])C(C)C BIVNKSDKIFWKFA-UHFFFAOYSA-N 0.000 description 1
- 229910007991 Si-N Inorganic materials 0.000 description 1
- 229910008051 Si-OH Inorganic materials 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- 229910006294 Si—N Inorganic materials 0.000 description 1
- 229910006358 Si—OH Inorganic materials 0.000 description 1
- VOSJXMPCFODQAR-UHFFFAOYSA-N ac1l3fa4 Chemical compound [SiH3]N([SiH3])[SiH3] VOSJXMPCFODQAR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001923 cyclic compounds Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- BUMGIEFFCMBQDG-UHFFFAOYSA-N dichlorosilicon Chemical compound Cl[Si]Cl BUMGIEFFCMBQDG-UHFFFAOYSA-N 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000004508 fractional distillation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000012280 lithium aluminium hydride Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- DVSDBMFJEQPWNO-UHFFFAOYSA-N methyllithium Chemical compound C[Li] DVSDBMFJEQPWNO-UHFFFAOYSA-N 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- OWKFQWAGPHVFRF-UHFFFAOYSA-N n-(diethylaminosilyl)-n-ethylethanamine Chemical compound CCN(CC)[SiH2]N(CC)CC OWKFQWAGPHVFRF-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000000682 scanning probe acoustic microscopy Methods 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 238000001577 simple distillation Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- LXEXBJXDGVGRAR-UHFFFAOYSA-N trichloro(trichlorosilyl)silane Chemical compound Cl[Si](Cl)(Cl)[Si](Cl)(Cl)Cl LXEXBJXDGVGRAR-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/21—Cyclic compounds having at least one ring containing silicon, but no carbon in the ring
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
- C23C16/345—Silicon nitride
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
- C23C16/402—Silicon dioxide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
- C23C16/45536—Use of plasma, radiation or electromagnetic fields
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02219—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and nitrogen
- H01L21/02222—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and nitrogen the compound being a silazane
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- H01L21/02107—Forming insulating materials on a substrate
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- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
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Description
R1〜R3は、互いに独立して、水素、ハロゲン、(C1‐C5)アルキルまたは(C2‐C5)アルケニルであり、
R4は、水素、(C1‐C3)アルキルまたは(C2‐C5)アルケニルである。
R1〜R3は、互いに独立して、水素、ハロゲン、(C1‐C5)アルキルまたは(C2‐C5)アルケニルであり、
R4は、水素、(C1‐C3)アルキルまたは(C2‐C5)アルケニルであり、Xはハロゲンである。
N(R6)(R7)(R8)
Mはアルカリ金属であり;
R10は、互いに独立して、水素または(C1‐C5)アルキルであり;
R1〜R3の少なくとも1つはハロゲンであり、残りは、水素、ハロゲン、(C1‐C5)アルキルまたは(C2‐C5)アルケニルであり;
R4は、水素、(C1‐C3)アルキルまたは(C2‐C5)アルケニルであり;
R1a〜R3aの少なくとも1つは水素であり、残りは、水素、(C1‐C5)アルキルまたは(C2‐C5)アルケニルであって、R1がハロゲンであるとR1aは水素であり、R2がハロゲンであるとR2aは水素であり、R3がハロゲンであるとR3aは水素である。
R1はハロゲンであり;
R2は、水素、ハロゲン、(C1‐C5)アルキルまたは(C2‐C5)アルケニルであり;
R4は、水素、(C1‐C3)アルキルまたは(C2‐C5)アルケニルであり;
Xはハロゲンであり;
Mはアルカリ金属であり;
R10は、水素または(C1‐C5)アルキルであり;
R1aは水素であり、
R2が水素またはハロゲンであると、R2aは水素であり、
R2が(C1‐C5)アルキルまたは(C2‐C5)アルケニルであると、R2aは(C1‐C5)アルキルまたは(C2‐C5)アルケニルである。
N(R6)(R7)(R8)
1)1,3‐ジイソプロピル‐2,4‐ジクロロジメチルシクロジシラザンの合成
無水および不活性雰囲気下で火炎乾燥された2000mLのシュレンクフラスコに、卜リクロロ(メチル)シラン(CH3SiCl3)127g(0.86mol)および有機溶媒n‐ヘキサン1200mlを入れて撹拌しながら、イソプロピルアミン(H2NCH(CH3)2)101.7g(1.72mol)を−10℃に維持しながらゆっくりと添加した。添加完了後、反応溶液を徐々に常温に昇温し、常温で3時間撹拌した。撹拌が完了した後、反応溶液を濾過し、濾過により得られた白色の固体を除去して濾過液を得た。この濾過液から減圧下で溶媒を除去し、回収されたジクロロ(メチル)(イソプロピルアミノ)シラン(Cl2CH3SiNHCH(CH3)2)に有機溶媒n‐ヘキサン200mlを入れて撹拌しながら、1.7M濃度のt‐ブチルリチウム(t‐C4H9Li)ヘキサン(C6H14)溶液367.0g(0.90mol)を40℃に維持しながらゆっくりと添加した。添加完了後、反応溶液を徐々に65℃に昇温し、12時間撹拌した。撹拌が完了した後、反応溶液を濾過し、濾過により得られた白色の固体を除去して濾過液を得た。この濾過液から減圧下で溶媒を除去し、減圧蒸留により1,3‐ジイソプロピル‐2,4‐ジクロロジメチルシクロジシラザン((ClCH3SiNCH(CH3)2)2)81.4g(0.30mol)を収率70%で得た。
無水および不活性雰囲気下で火炎乾燥された1000mLのシュレンクフラスコに、前記1)で合成された1,3‐ジイソプロピル‐2,4‐ジクロロジメチルシクロジシラザン((ClCH3SiNCH(CH3)2)2)100g(0.37mol)および有機溶媒THF200mlを入れて撹拌しながら、水素化リチウム(LiH)7.33g(0.92mol)を−15℃に維持しながらゆっくりと添加した。添加完了後、反応溶液を徐々に65℃に昇温し、12時間撹拌した。撹拌が完了した後、反応溶液を濾過し、濾過により得られた白色の固体を除去して濾過液を得た。この濾過液から減圧下で溶媒を除去し、減圧蒸留により1,3‐ジイソプロピル‐2,4‐ジメチルシクロジシラザン((HCH3SiNCH(CH3)2)2)60g(0.3mol)を収率80%で得た。
1)1,3‐ジイソプロピル‐2,2,4,4‐テトラクロロシクロジシラザンの合成
無水および不活性雰囲気下で火炎乾燥された2000mLのシュレンクフラスコに、テトラクロロシラン(SiCl4)150g(0.89mol)および有機溶媒n‐ヘキサン500mlを入れて撹拌しながら、イソプロピルアミン(H2NCH(CH3)2)104.76g(1.77mol)を−10℃に維持しながらゆっくりと添加した。添加完了後、反応溶液を徐々に常温に昇温し、常温で3時間撹拌した。撹拌が完了した後、反応溶液を濾過し、濾過により得られた白色の固体を除去して濾過液を得た。この濾過液から減圧下で溶媒を除去し、回収された卜リクロロ(イソプロピルアミノ)シラン(Cl3SiNHCH(CH3)2)に有機溶媒n‐ヘキサン200mlを入れて撹拌しながら、1.7M濃度のt‐ブチルリチウム(t‐C4H9Li)ヘキサン(C6H14)溶液368.38g(0.90mol)を40℃に維持しながらゆっくりと添加した。添加完了後、反応溶液を徐々に65℃に昇温し、12時間撹拌した。撹拌が完了した後、反応溶液を濾過し、濾過により得られた白色の固体を除去して濾過液を得た。この濾過液から減圧下で溶媒を除去し、減圧蒸留により1,3‐ジイソプロピル‐2,2,4,4‐テトラクロロシクロジシラザン((Cl2SiNCH(CH3)2)2)121.7g(0.35mol)を収率88%で得た。
無水および不活性雰囲気下で火炎乾燥された2000mLのシュレンクフラスコに、前記1)で合成された1,3‐ジイソプロピル‐2,2,4,4‐テトラクロロシクロジシラザン((Cl2SiNCH(CH3)2)2)80g(0.26mol)および有機溶媒ジエチルエーテル400mlを入れて撹拌しながら、水素化リチウムアルミニウム(LiAlH4)12.35g(1.55mol)を−15℃に維持しながらゆっくりと添加した。添加完了後、反応溶液を徐々に60℃に昇温し、12時間撹拌した。撹拌が完了した後、反応溶液を濾過し、濾過により得られた白色の固体を除去して濾過液を得た。この濾過液から減圧下で溶媒を除去し、減圧蒸留により1,3‐ジイソプロピルシクロジシラザン((H2SiNCH(CH3)2)2)26.8g(0.16mol)を収率60%で得た。
無水および不活性雰囲気下で火炎乾燥された2000mLのシュレンクフラスコに、ジクロロジメチルシラン(Si(CH3)2Cl2)214g(1.66mol)および有機溶媒n‐ヘキサン1000mlを入れて撹拌しながら、イソプロピルアミン(H2NCH(CH3)2)392.1g(6.63mol)を−10℃に維持しながらゆっくりと添加した。添加完了後、反応溶液を徐々に常温に昇温し、常温で3時間撹拌した。撹拌が完了した後、反応溶液を濾過し、濾過により得られた白色の固体を除去して濾過液を得た。この濾過液から減圧下で溶媒を除去し、回収されたジ(イソプロピルアミノ)ジメチルシラン((CH3)2Si(NHCH(CH3)2)2)に有機溶媒n‐ヘキサン300mlを入れて撹拌しながら、2.5M濃度のn‐ブチルリチウム(n‐C4H9Li)ヘキサン(C6H14)溶液1005.3g(3.32mol)を−15℃に維持しながらゆっくりと添加した。添加完了後、反応溶液を徐々に25℃に昇温し、12時間撹拌した後、卜リクロロシラン(SiHCl3)224.6g(1.66mol)をゆっくりと添加した。添加完了後、反応溶液を徐々に65℃に昇温し、12時間撹拌した。撹拌が完了した後、反応溶液を濾過し、濾過により得られた白色の固体を除去して濾過液を得た。この濾過液から減圧下で溶媒を除去し、減圧蒸留により1,3‐ジイソプロピル‐2‐クロロ‐4,4‐ジメチルシクロジシラザン(((CH3)2SiNCH(CH3)2)(ClSiHNCH(CH3)2))255.3g(1.08mol)を収率65%で得た。
無水および不活性雰囲気下で火炎乾燥された1000mLのシュレンクフラスコに、ジクロロジメチルシラン((CH3)2SiCl2)107g(0.83mol)および有機溶媒n‐ヘキサン400mlを入れて撹拌しながら、トリエチルアミン(C2H5)3N)167.7g(1.66mol)を−10℃に維持しながらゆっくりと添加した後、イソプロピルアミン(H2NCH(CH3)2)98.0g(1.65mol)を−10℃に維持しながらゆっくりと添加した。添加完了後、反応溶液を徐々に常温に昇温し、常温で3時間撹拌した。撹拌が完了した後、反応溶液を濾過し、濾過により得られた白色の固体を除去して濾過液を得た。この濾過液から減圧下で溶媒を除去し、回収されたジ(イソプロピルアミノ)ジメチルシラン((CH3)2Si(NHCH(CH3)2)2)に有機溶媒n‐ヘキサン200mlを入れて撹拌しながら、2.5M濃度のn‐ブチルリチウム(n‐C4H9Li)ヘキサン(C6H14)溶液351.8g(1.16mol)を−10℃に維持しながらゆっくりと添加した。添加完了後、反応溶液を徐々に常温に昇温し、12時間撹拌した後、卜リクロロシラン(SiHCl3)224.6g(1.66mol)をゆっくりと添加した。添加完了後、反応溶液を徐々に65℃に昇温し、12時間撹拌した。撹拌が完了した後、反応溶液を濾過し、濾過により得られた白色の固体を除去して濾過液を得た。この濾過液から減圧下で溶媒を除去し、減圧蒸留により1,3‐ジイソプロピル‐2‐クロロ‐4,4‐ジメチルシクロジシラザン(((CH3)2SiNCH(CH3)2)(ClSiHNCH(CH3)2))255.3g(1.08mol)を収率65%で得た。
無水および不活性雰囲気下で火炎乾燥された1000mLのシュレンクフラスコに、イソプロピルアミン(H2NCH(CH3)2)98.0g(1.65mol)および有機溶媒n‐ヘキサン400mlを入れて撹拌しながら、2.5M濃度のn‐ブチルリチウム(n‐C4H9Li)ヘキサン(C6H14)溶液500.4g(1.65mol)を−10℃に維持しながらゆっくりと添加した。添加完了後、反応溶液を徐々に常温に昇温し、常温で3時間撹拌した後、ジクロロジメチルシラン((CH3)2SiCl2)107g(0.83mol)を−10℃に維持しながらゆっくりと添加した。添加完了後、反応溶液を徐々に常温に昇温し、常温で3時間撹拌した。撹拌が完了した後、反応溶液を濾過し、濾過により得られた白色の固体を除去して濾過液を得た。この濾過液から減圧下で溶媒を除去し、回収されたジ(イソプロピルアミノ)ジメチルシラン((CH3)2Si(NHCH(CH3)2)2)に有機溶媒n‐ヘキサン200mlを入れて撹拌しながら、2.5M濃度のn‐ブチルリチウム(n‐C4H9Li)ヘキサン(C6H14)溶液351.8g(1.16mol)を−10℃に維持しながらゆっくりと添加した。添加完了後、反応溶液を徐々に常温に昇温し、12時間撹拌した後、卜リクロロシラン(SiHCl3)224.6g(1.66mol)をゆっくりと添加した。添加完了後、反応溶液を徐々に65℃に昇温し、12時間撹拌した。撹拌が完了した後、反応溶液を濾過し、濾過により得られた白色の固体を除去して濾過液を得た。この濾過液から減圧下で溶媒を除去し、減圧蒸留により1,3‐ジイソプロピル‐2‐クロロ‐4,4‐ジメチルシクロジシラザン(((CH3)2SiNCH(CH3)2)(ClSiHNCH(CH3)2))196.4g(0.83mol)を収率50%で得た。
無水および不活性雰囲気下で火炎乾燥された2000mLのシュレンクフラスコに、前記実施例3で合成された1,3‐ジイソプロピル‐2‐クロロ‐4,4‐ジメチルシクロジシラザン(((CH3)2SiNCH(CH3)2)(ClSiHNCH(CH3)2))200g(0.84mol)および有機溶媒THF600mlを入れて撹拌しながら、水素化リチウム(LiH)7.4g(0.93mol)を−15℃に維持しながらゆっくりと添加した。添加完了後、反応溶液を徐々に65℃に昇温し、12時間撹拌した。撹拌が完了した後、反応溶液を濾過し、濾過により得られた白色の固体を除去して濾過液を得た。この濾過液から減圧下で溶媒を除去し、減圧蒸留により1,3‐ジイソプロピル‐4,4‐ジメチルシクロジシラザン(((CH3)2SiNCH(CH3)2)(SiH2NCH(CH3)2))85.46g(0.42mol)を収率50%で得た。
公知のプラズマ強化原子層蒸着法(PEALD)を用いる通常のプラズマ強化原子層蒸着(PEALD)装置でシリコン酸化膜を形成するための組成物として、本発明の実施例1の1,3‐ジイソプロピル‐2,4‐ジメチルシクロジシラザンと実施例6の1,3‐ジイソプロピル‐4,4‐ジメチルシクロジシラザンを用いて、成膜評価を行った。反応ガスとしてはプラズマとともに酸素を使用し、不活性気体のアルゴンをパージのために使用した。以下、図5と表1に具体的なシリコン酸化薄膜の蒸着方法を示す。
下記表2に記載のように、公知のアミノシリルアミン化合物を使用したことを除き、実施例7で実施されたことと同一の蒸着条件下で、公知のプラズマ強化原子層蒸着法(PEALD)を用いて比較例の成膜評価を行った。蒸着した薄膜は、実施例7で実施したことと同一の分析方法および条件により分析して分析結果を得た。以下、図5と表2に具体的なシリコン酸化薄膜の蒸着方法を示す。
公知のプラズマ強化原子層蒸着法(PEALD)を用いる通常のプラズマ強化原子層蒸着(PEALD)装置でシリコン窒化膜を形成するための組成物として、本発明の実施例1の1,3‐ジイソプロピル‐2,4‐ジメチルシクロジシラザンを用いて、成膜評価を行った。反応ガスとしてはプラズマとともに窒素を使用し、同一の窒素ガスをパージのために使用した。以下、図10と表3に具体的なシリコン窒化薄膜の蒸着方法を示す。
Claims (6)
- 下記化学式1で表されるシクロジシラザン誘導体。
[化学式1]
R1〜R3は、互いに独立して、水素、ハロゲン、(C1‐C5)アルキルまたは(C2‐C5)アルケニルであり、
R4は、C3アルキルまたはC3アルケニルである。) - 下記化合物から選択されるものである、請求項1に記載のシクロジシラザン誘導体。
- 下記化学式2で表されるシラン誘導体と下記化学式3で表されるアミン誘導体とを反応させることで、下記化学式4で表されるジアミノシラン誘導体を製造するステップと、
(C1‐C7)アルキルリチウムの存在下で、下記化学式4で表されるジアミノシラン誘導体と化学式5で表されるシラン誘導体とを環化反応させることで、下記化学式1で表されるシクロジシラザン誘導体を製造するステップと、を含む、下記化学式1で表されるシクロジシラザン誘導体の製造方法。
[化学式1]
R1〜R3は、互いに独立して、水素、ハロゲン、(C1‐C5)アルキルまたは(C2‐C5)アルケニルであり、
R4は、C3アルキルまたはC3アルケニルであり、Xはハロゲンである。) - 前記化学式4で表されるジアミノシラン誘導体を製造するステップは、下記化学式10で表される塩基または(C1‐C7)アルキルリチウムの存在下で行われることを特徴とする、請求項3に記載の方法。
[化学式10]
N(R6)(R7)(R8)
(前記化学式10中、R6〜R8は、互いに独立して、(C1‐C7)アルキルである。) - 請求項1または2に記載のシクロジシラザン誘導体を含むシリコン含有薄膜蒸着用組成物。
- 請求項1または2に記載のシクロジシラザン誘導体を用いてシリコン含有薄膜を製造する方法。
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US10822458B2 (en) | 2017-02-08 | 2020-11-03 | Versum Materials Us, Llc | Organoamino-functionalized linear and cyclic oligosiloxanes for deposition of silicon-containing films |
US10640523B2 (en) * | 2018-01-12 | 2020-05-05 | Entegris, Inc. | Aminoiodosilanes and methods of synthesizing these aminoiodosilanes |
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US20200247830A1 (en) * | 2019-02-01 | 2020-08-06 | Versum Materials Us, Llc | Compositions And Methods Using Same for Silicon Containing Films |
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US20210017198A1 (en) | 2019-04-05 | 2021-01-21 | Versum Materials Us, Llc | Organoamino-Functionalized Cyclic Oligosiloxanes For Deposition Of Silicon-Containing Films |
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