JP6267171B2 - 複数のPCIeコネクタを有するペリフェラルコンポーネントインターコネクトエクスプレス(PCIe)カード - Google Patents

複数のPCIeコネクタを有するペリフェラルコンポーネントインターコネクトエクスプレス(PCIe)カード Download PDF

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JP6267171B2
JP6267171B2 JP2015202631A JP2015202631A JP6267171B2 JP 6267171 B2 JP6267171 B2 JP 6267171B2 JP 2015202631 A JP2015202631 A JP 2015202631A JP 2015202631 A JP2015202631 A JP 2015202631A JP 6267171 B2 JP6267171 B2 JP 6267171B2
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Prior art keywords
pcie
connector
conductors
circuit board
pcie connector
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Japanese (ja)
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JP2016115922A (ja
Inventor
タマルキン、ブラジミア
ジェネッティ、ワイネ
シュベイツァー、デイビッド
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Intel Corp
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Intel Corp
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/4068—Electrical coupling
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
    • G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
    • G06F13/4204—Bus transfer protocol, e.g. handshake; Synchronisation on a parallel bus
    • G06F13/4221—Bus transfer protocol, e.g. handshake; Synchronisation on a parallel bus being an input/output bus, e.g. ISA bus, EISA bus, PCI bus, SCSI bus
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/185—Mounting of expansion boards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/185—Mounting of expansion boards
    • G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/382—Information transfer, e.g. on bus using universal interface adapter
    • G06F13/385—Information transfer, e.g. on bus using universal interface adapter for adaptation of a particular data processing system to different peripheral devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4004—Coupling between buses
    • G06F13/4022—Coupling between buses using switching circuits, e.g. switching matrix, connection or expansion network
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/409—Mechanical coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/727—Coupling devices presenting arrays of contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/735—Printed circuits including an angle between each other
    • H01R12/737—Printed circuits being substantially perpendicular to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/0286—Receptacles therefor, e.g. card slots, module sockets, card groundings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F2213/0024—Peripheral component interconnect [PCI]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F2213/0026—PCI express
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Power Engineering (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Bus Control (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP2015202631A 2014-12-12 2015-10-14 複数のPCIeコネクタを有するペリフェラルコンポーネントインターコネクトエクスプレス(PCIe)カード Active JP6267171B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/569,041 US9710421B2 (en) 2014-12-12 2014-12-12 Peripheral component interconnect express (PCIe) card having multiple PCIe connectors
US14/569,041 2014-12-12

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017245141A Division JP2018046305A (ja) 2014-12-12 2017-12-21 複数のPCIeコネクタを有するペリフェラルコンポーネントインターコネクトエクスプレス(PCIe)カード

Publications (2)

Publication Number Publication Date
JP2016115922A JP2016115922A (ja) 2016-06-23
JP6267171B2 true JP6267171B2 (ja) 2018-01-24

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Application Number Title Priority Date Filing Date
JP2015202631A Active JP6267171B2 (ja) 2014-12-12 2015-10-14 複数のPCIeコネクタを有するペリフェラルコンポーネントインターコネクトエクスプレス(PCIe)カード
JP2017245141A Pending JP2018046305A (ja) 2014-12-12 2017-12-21 複数のPCIeコネクタを有するペリフェラルコンポーネントインターコネクトエクスプレス(PCIe)カード

Family Applications After (1)

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JP2017245141A Pending JP2018046305A (ja) 2014-12-12 2017-12-21 複数のPCIeコネクタを有するペリフェラルコンポーネントインターコネクトエクスプレス(PCIe)カード

Country Status (5)

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US (2) US9710421B2 (enExample)
EP (2) EP3032427B1 (enExample)
JP (2) JP6267171B2 (enExample)
KR (2) KR101826397B1 (enExample)
CN (1) CN105701050B (enExample)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9710421B2 (en) 2014-12-12 2017-07-18 Intel Corporation Peripheral component interconnect express (PCIe) card having multiple PCIe connectors
WO2016118607A1 (en) 2015-01-20 2016-07-28 Ultrata Llc Distributed index for fault tolerant object memory fabric
WO2016118624A1 (en) 2015-01-20 2016-07-28 Ultrata Llc Object memory instruction set
US9886210B2 (en) 2015-06-09 2018-02-06 Ultrata, Llc Infinite memory fabric hardware implementation with router
US9971542B2 (en) 2015-06-09 2018-05-15 Ultrata, Llc Infinite memory fabric streams and APIs
US10698628B2 (en) 2015-06-09 2020-06-30 Ultrata, Llc Infinite memory fabric hardware implementation with memory
CN115061971A (zh) 2015-12-08 2022-09-16 乌尔特拉塔有限责任公司 使用容错对象的存储器结构操作和一致性
US10241676B2 (en) 2015-12-08 2019-03-26 Ultrata, Llc Memory fabric software implementation
US10235063B2 (en) 2015-12-08 2019-03-19 Ultrata, Llc Memory fabric operations and coherency using fault tolerant objects
CA3006773A1 (en) 2015-12-08 2017-06-15 Ultrata, Llc Memory fabric software implementation
WO2017131741A1 (en) * 2016-01-29 2017-08-03 Hewlett Packard Enterprise Development Lp Expansion bus devices
US10050362B2 (en) * 2016-03-03 2018-08-14 International Business Machines Corporation Electronic circuit card with connector edge having alternated TX and RX pins assignment
EP3500165B1 (en) * 2016-08-17 2021-10-06 Koninklijke Philips N.V. Adapter for coupling with medical coupling unit and sensor
JP6571617B2 (ja) * 2016-09-07 2019-09-04 ファナック株式会社 プリント板
US10028402B1 (en) * 2017-03-22 2018-07-17 Seagate Technology Llc Planar expansion card assembly
US10509759B2 (en) 2017-03-31 2019-12-17 Intel Corporation Multiple storage devices implemented using a common connector
US11336043B2 (en) 2017-03-31 2022-05-17 Intel Corporation Peripheral component coupler method and apparatus
US11177606B2 (en) * 2017-09-22 2021-11-16 Hewlett-Packard Development Company, L.P. Housing with lateral hooks
CN110275848B (zh) * 2018-03-15 2023-06-09 环达电脑(上海)有限公司 转接卡
CN108763771B (zh) * 2018-05-30 2021-11-02 郑州云海信息技术有限公司 一种PCIe链路性能优化方法和系统
TW202005485A (zh) * 2018-06-01 2020-01-16 緯穎科技服務股份有限公司 擴充快捷外設互聯標準兼容性的電路
US10782749B2 (en) * 2018-10-10 2020-09-22 Hewlett Packard Enterprise Development Lp Compute assembly for high speed ultra dense compute blades
WO2020214150A1 (en) * 2019-04-15 2020-10-22 Hewlett-Packard Development Company, L.P. Printed circuit boards with processors, voltage regulators, and solder joints of higher melting temperatures
WO2020214149A1 (en) * 2019-04-15 2020-10-22 Hewlett-Packard Development Company, L.P. Printed circuit boards with solder joints of higher melting temperatures and traces coupling electrical contacts at differing positions
US11412617B2 (en) 2019-04-23 2022-08-09 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Methods and apparatuses for interfacing microwave circuits
US11016538B2 (en) 2019-05-20 2021-05-25 Microsoft Technology Licensing, Llc Interchangeable housing panel with rechargeable power, network connectivity, and memory for use with portable computing devices
CN110808492A (zh) * 2019-10-25 2020-02-18 天津航空机电有限公司 一种基于pcb的航空功率继电器安装模块
TWI711236B (zh) 2019-11-19 2020-11-21 宸曜科技股份有限公司 具有M12連接器之PCIe或PCI擴充卡組件
US10958005B1 (en) * 2020-01-31 2021-03-23 Dell Products L.P. Apparatus for direct cabled connection of fabric signals
TWI721791B (zh) 2020-02-21 2021-03-11 緯穎科技服務股份有限公司 電子裝置
US11936142B2 (en) * 2021-04-10 2024-03-19 Palo Alto Innovation, LLC Graphics-card power connector
US11714775B2 (en) 2021-05-10 2023-08-01 Zenlayer Innovation LLC Peripheral component interconnect (PCI) hosting device
CN113381211A (zh) * 2021-06-16 2021-09-10 英业达科技有限公司 缆线型转接卡
US11683887B2 (en) 2021-07-26 2023-06-20 Dell Products L.P. Add-in card connector edge finger optimization for high-speed signaling
GB2609982B (en) * 2021-08-20 2024-10-09 Amulet Hotkey Ltd Data processor cartridge
CN113986809A (zh) * 2021-11-30 2022-01-28 海光信息技术股份有限公司 深度计算处理器板卡和深度计算处理器板卡的互联系统
JP2023085942A (ja) * 2021-12-09 2023-06-21 株式会社東芝 主制御基板およびライザーカード
US20230320010A1 (en) * 2022-03-31 2023-10-05 Intel Corporation Multi slot add-in card with first and second cooling air movers and extended heat sink fins
US12695223B2 (en) * 2022-06-03 2026-07-28 Intel Corporation Differential I/O card using CMT connector
US12266877B2 (en) * 2022-07-01 2025-04-01 Dell Products L.P. CXL memory expansion riser card
US11809361B1 (en) * 2022-07-15 2023-11-07 Micron Technology, Inc. Network data storage devices having external access control
US12702062B2 (en) 2022-09-02 2026-08-04 Intel Corporation Memory on package (MOP) with reverse CAMM (compression attached memory module) and CMT connector
KR102752730B1 (ko) 2022-09-16 2025-01-10 주식회사 큐레몬 어드레스 변환 제어 회로를 포함하는 양자 난수 발생 장치 및 이를 포함하는 컴퓨팅 시스템
US12444869B2 (en) * 2022-12-14 2025-10-14 International Business Machines Corporation Coplanar card-edge connector
CN116225177B (zh) * 2023-05-06 2023-08-15 苏州浪潮智能科技有限公司 内存系统、内存资源调节方法、装置、电子设备和介质
US20260228156A1 (en) * 2023-12-13 2026-08-06 Unifabrix Ltd. Scale-Up Memory Access over IEEE 802.3 PMA in Processors and Accelerators including ARM-Based SoCs
US20260228158A1 (en) * 2023-12-13 2026-08-06 Unifabrix Ltd. Intent-Based CXL Translations for Inter-Entity Cache State Coordination in Heterogeneous Computing Platforms
US20260220065A1 (en) * 2023-12-13 2026-07-30 Unifabrix Ltd. Fabric Resource Orchestrator with Bidirectional Requester and Responder Capabilities for Scalable CXL Fabrics
US20260228155A1 (en) * 2023-12-13 2026-08-06 Unifabrix Ltd. Processor with CXL Scale-Up Networking over IEEE 802.3 PMA for Memory Pooling and KV Caching in AI Infrastructures
US20260228159A1 (en) * 2023-12-13 2026-08-06 Unifabrix Ltd. Transparent and Non-Transparent Bridging Between CXL.mem and CXL.io for Scalable Memory Infrastructure
US12602094B2 (en) 2024-07-16 2026-04-14 Hewlett Packard Enterprise Development Lp Direction changeable riser card for an information processing device
US12650947B2 (en) * 2024-08-05 2026-06-09 International Business Machines Corporation Universal interface for cable connectors
US20260079545A1 (en) * 2024-09-18 2026-03-19 Hewlett Packard Enterprise Development Lp Riser card supporting both internal and pluggable storage drives

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5572688A (en) 1994-09-30 1996-11-05 Tyan Computer Corporation Primary bus processing element with multifunction interconnection to secondary bus
JP2002007314A (ja) * 2000-06-21 2002-01-11 Japan Science & Technology Corp 汎用バス接続装置及びそれを用いたマルチcpuコンピュータ
JP5348813B2 (ja) 2000-11-06 2013-11-20 株式会社アイ・オー・データ機器 ブートrom搭載ボード
JP2005190297A (ja) 2003-12-26 2005-07-14 Toshiba Corp サーバ、情報処理装置及び筐体
US8423695B2 (en) 2005-01-19 2013-04-16 Broadcom Corporation Dual PCI-X/PCI-E card
US7793029B1 (en) * 2005-05-17 2010-09-07 Nvidia Corporation Translation device apparatus for configuring printed circuit board connectors
US20060294279A1 (en) * 2005-06-28 2006-12-28 Mckee Kenneth G Mechanism for peripheral component interconnect express (PCIe) connector multiplexing
TW200734887A (en) 2006-03-08 2007-09-16 Tyan Computer Corp Computing system and I/O board thereof
JP2007316722A (ja) 2006-05-23 2007-12-06 Nec Electronics Corp 回路ボード
TWM307793U (en) * 2006-09-04 2007-03-11 Iei Technology Corp Half-sized PCI central processing unit interface and computer device with PCIe extensible capability
WO2010123502A1 (en) * 2009-04-23 2010-10-28 Hewlett-Packard Development Company, L.P. Adapter
JP5812502B2 (ja) 2010-08-24 2015-11-17 マーベル ワールド トレード リミテッド デバイスインターフェース及び装置
CN102841643A (zh) * 2011-06-20 2012-12-26 鸿富锦精密工业(深圳)有限公司 转接卡装置
CN102931546A (zh) * 2011-08-10 2013-02-13 鸿富锦精密工业(深圳)有限公司 连接器组合
CN102955497A (zh) * 2011-08-18 2013-03-06 鸿富锦精密工业(深圳)有限公司 安装有固态硬盘的主板
US9128662B2 (en) 2011-12-23 2015-09-08 Novachips Canada Inc. Solid state drive memory system
US20130179621A1 (en) * 2012-01-06 2013-07-11 Glenn Willis Smith Extensible daisy-chain topology for compute devices
CN102650978B (zh) * 2012-03-27 2015-02-11 北京航空航天大学 一种用于PCI Express X16至CPCI Express X16的转接卡
US9122810B2 (en) * 2012-05-18 2015-09-01 Dell Products, Lp System and method for providing input/output functionality to a processing node
US20140047156A1 (en) * 2012-08-09 2014-02-13 Emillo BILLI Hybrid computing system
US9189441B2 (en) * 2012-10-19 2015-11-17 Intel Corporation Dual casting PCIE inbound writes to memory and peer devices
US8996781B2 (en) * 2012-11-06 2015-03-31 OCZ Storage Solutions Inc. Integrated storage/processing devices, systems and methods for performing big data analytics
US9436630B2 (en) * 2013-06-11 2016-09-06 Western Digital Technologies, Inc. Using dual phys to support multiple PCIe link widths
US9444827B2 (en) * 2014-02-15 2016-09-13 Micron Technology, Inc. Multi-function, modular system for network security, secure communication, and malware protection
US9591757B2 (en) * 2014-03-31 2017-03-07 Bally Gaming, Inc. Printed circuit board assembly for a gaming machine
US9798636B2 (en) * 2014-06-23 2017-10-24 Liqid Inc. Front end traffic handling in modular switched fabric based data storage systems
US9325086B2 (en) * 2014-08-05 2016-04-26 International Business Machines Corporation Doubling available printed wiring card edge for high speed interconnect in electronic packaging applications
US9842075B1 (en) * 2014-09-12 2017-12-12 Amazon Technologies, Inc. Presenting multiple endpoints from an enhanced PCI express endpoint device
US9710421B2 (en) 2014-12-12 2017-07-18 Intel Corporation Peripheral component interconnect express (PCIe) card having multiple PCIe connectors

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US20170286353A1 (en) 2017-10-05
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