JP2016115922A - 複数のPCIeコネクタを有するペリフェラルコンポーネントインターコネクトエクスプレス(PCIe)カード - Google Patents
複数のPCIeコネクタを有するペリフェラルコンポーネントインターコネクトエクスプレス(PCIe)カード Download PDFInfo
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
- G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/4068—Electrical coupling
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
- G06F13/4204—Bus transfer protocol, e.g. handshake; Synchronisation on a parallel bus
- G06F13/4221—Bus transfer protocol, e.g. handshake; Synchronisation on a parallel bus being an input/output bus, e.g. ISA bus, EISA bus, PCI bus, SCSI bus
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/382—Information transfer, e.g. on bus using universal interface adapter
- G06F13/385—Information transfer, e.g. on bus using universal interface adapter for adaptation of a particular data processing system to different peripheral devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4004—Coupling between buses
- G06F13/4022—Coupling between buses using switching circuits, e.g. switching matrix, connection or expansion network
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/409—Mechanical coupling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/727—Coupling devices presenting arrays of contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/735—Printed circuits including an angle between each other
- H01R12/737—Printed circuits being substantially perpendicular to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
- H05K5/0286—Receptacles therefor, e.g. card slots, module sockets, card groundings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F2213/0024—Peripheral component interconnect [PCI]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F2213/0026—PCI express
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
Claims (22)
- 回路基板と、
前記回路基板上に位置付けられるデバイスと、
前記回路基板上に位置付けられ、前記デバイスに連結される第1のペリフェラルコンポーネントインターコネクトエクスプレスコネクタ(第1のPCIeコネクタ)と、
前記回路基板上に位置付けられ、前記デバイスに連結される第2のPCIeコネクタと
を備え、
前記第1のPCIeコネクタは、追加の回路基板の第1のコネクタに連結されるように配置され、
前記第2のPCIeコネクタは、前記追加の回路基板の第2のコネクタに連結するように配置される、装置。 - 前記追加の回路基板の前記第1のコネクタは、第1のPCIeスロットを含み、前記追加の回路基板の前記第2のコネクタは、第2のPCIeスロットを含む、請求項1に記載の装置。
- 前記回路基板は、第1のエッジ及び第2のエッジを含み、前記第1のPCIeコネクタは、前記第1のエッジに位置付けられる複数の導体を含み、前記第2のPCIeコネクタは、前記第2のエッジに位置付けられる複数の導体を含む、請求項1又は2に記載の装置。
- 前記第1のエッジは、前記第2のエッジに対向する、請求項3に記載の装置。
- 前記第1及び第2のPCIeコネクタのそれぞれは、複数の導体を含み、
第1のPCIeコネクタの前記複数の導体は、前記回路基板の第1の面上の複数の導体を含む第1のグループと、前記回路基板の第2の面上の複数の導体を含む第2のグループとを含み、
前記第2のPCIeコネクタの前記複数の導体は、前記回路基板の前記第2の面上の複数の導体を含む第1のグループと、前記回路基板の前記第1の面上の複数の導体を含む第2のグループとを含み、
前記第1及び第2のPCIeコネクタのそれぞれの複数の導体を含む前記第1のグループは、プリント回路基板(PCB)の第1の面のためのPCIeコネクタピン配列仕様に基づいて配置され、前記第1及び第2のPCIeコネクタのそれぞれの複数の導体を含む前記第2のグループは、前記PCBの第2の面のためのPCIeコネクタピン配列仕様に基づいて配置される、請求項1から4のいずれか一項に記載の装置。 - 前記回路基板上に位置付けられ、前記デバイスに連結される第1の追加のコネクタと、
前記回路基板上に位置付けられ、前記デバイスに連結される第2の追加のコネクタと
をさらに備え、
前記第1の追加のコネクタは、第1のコンピュータネットワーク規格に基づいて複数の信号を伝導するように配置され、前記第2の追加のコネクタは、第2のコンピュータネットワーク規格に基づいて複数の信号を伝導するように配置される、請求項1から5のいずれか一項に記載の装置。 - 前記回路基板は、第1のエッジ、第2のエッジ及び第3のエッジを含み、前記第1のPCIeコネクタは、前記第1のエッジに位置付けられる複数の導体を含み、前記第2のPCIeコネクタは、前記第2のエッジに位置付けられる複数の導体を含み、前記第1及び第2の追加のコネクタは、前記第3のエッジに位置付けられる、請求項6に記載の装置。
- 前記回路基板、前記デバイス、並びに、前記第1及び第2のPCIeコネクタは、拡張カードの一部である、請求項1から7のいずれか一項に記載の装置。
- 前記拡張カードは、ホストアダプタデバイス、ネットワークインタフェースコントローラ(NIC)デバイス又はコンバージドネットワークアダプタデバイスのうちの1つを含む、請求項8に記載の装置。
- 前記拡張カードは、PCIeフォームファクタに準拠する、請求項8に記載の装置。
- 集積回路チップ(ICチップ)と、
ペリフェラルコンポーネントインターコネクトエクスプレスカード(PCIeカード)の第1のPCIeコネクタに連結するように配置される前記ICチップの第1の導電性コンタクトと、
前記PCIeカードの第2のPCIeコネクタに連結するように配置される前記ICチップの第2の導電性コンタクトと
を備える、装置。 - 前記第1の導電性コンタクトは、前記ICチップと、前記第1のPCIeコネクタを通じて前記ICチップに連結される回路基板上の複数のコンポーネントのうちの1つとの間の第1のポイントツーポイントPCIe接続を通じて複数の信号を伝導するように配置され、前記第2の導電性コンタクトは、前記ICチップと、前記第2のPCIeコネクタを通じて前記ICチップに連結される前記回路基板上の前記複数のコンポーネントのうちの1つと間の第2のポイントツーポイントPCIe接続を通じて複数の信号を伝導するように配置される、請求項11に記載の装置。
- 前記PCIeカードの第1の入出力コネクタ(第1のI/Oコネクタ)連結するように配置される第3の導電性コンタクトと、
前記PCIeカードの第2のI/Oコネクタに連結するように配置される第4の導電性コンタクトと
をさらに備える、請求項11又は12に記載の装置。 - 前記第3の導電性コンタクトは、第1のコンピュータネットワークから前記PCIeカードの前記第1のI/Oコネクタを通じて複数の信号を伝導するように配置され、前記第4の導電性コンタクトは、第2のコンピュータネットワークから前記PCIeカードの前記第2のI/Oコネクタを通じて複数の信号を伝導するように配置される、請求項13に記載の装置。
- 前記第1、第2、第3及び第4の導電性コンタクトは、複数のはんだボール及び複数の導電性ピンのうちの一方を含む、請求項13又は14に記載の装置。
- 第1のペリフェラルコンポーネントインターコネクトエクスプレススロット(第1のPCIeスロット)及び第2のPCIeスロットを含む回路基板と、
デバイスと、前記デバイス及び前記第1のPCIeスロットに連結される第1のPCIeコネクタと、前記デバイス及び前記第2のPCIeスロットに連結される第2のPCIeコネクタと、前記デバイスに連結される第1の入出力コネクタ(第1のI/Oコネクタ)と、前記デバイスに連結される第2のI/Oコネクタと含むPCIeカードと
を備える、電子システム。 - 前記第1のPCIeコネクタは、PCIeライザを通じて前記第1のPCIeスロットに連結され、前記第2のPCIeコネクタは、PCIe延長ケーブルを通じて前記第2のPCIeスロットに連結される、請求項16に記載の電子システム。
- 前記PCIeカードは、前記回路基板に沿って配置される、請求項16又は17に記載の電子システム。
- 前記PCIeカードは、前記回路基板に対して鉛直に配置される、請求項16又は17に記載の電子システム。
- 回路基板の第1の面上に第1のペリフェラルコンポーネントインターコネクトエクスプレスコネクタ(第1のPCIeコネクタ)の複数の導体を含む第1のグループを形成する段階と、
前記回路基板の第2の面上に前記第1のPCIeコネクタの複数の導体を含む第2のグループを形成する段階と、
前記回路基板の前記第2の面上に第2のPCIeコネクタの複数の導体を含む第1のグループを形成する段階と、
前記回路基板の前記第1の面上に前記第2のPCIeコネクタの複数の導体を含む第2のグループを形成する段階と
を備える、方法。 - 前記第1及び第2のPCIeコネクタのそれぞれの複数の導体を含む前記第1のグループは、プリント回路基板(PCB)の第1の面のためのPCIeコネクタピン配列仕様に基づいて形成され、前記第1及び第2のPCIeコネクタのそれぞれの複数の導体を含む前記第2のグループは、前記PCBの第2の面のためのPCIeコネクタピン配列仕様に基づいて形成される、請求項20に記載の方法。
- 前記第1のPCIeコネクタの複数の導体を含む前記第1及び第2のグループは、前記回路基板の第1のエッジに形成され、前記第2のPCIeコネクタの複数の導体を含む前記第1及び第2のグループは、前記回路基板の第2のエッジに形成され、前記第2のエッジは、前記第1のエッジに対向する、請求項20又は21に記載の方法。
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