JP6265283B2 - 2つのセンサ機能を備えたセンサ構造素子 - Google Patents
2つのセンサ機能を備えたセンサ構造素子 Download PDFInfo
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Description
本発明のある実施形態では、第2センサ素子は湿度センサとして形成されている
本発明のある実施形態では、第2センサ素子は温度センサとして形成されている。
ある実施形態では、蓋と壁部材との間にブシュが形成され、これによって周辺との空気交換、および、したがって中空空間の内部での周辺パラメータの測定がすでに可能になるように、蓋は、壁部材上に距離をとって固定されている。
筐体であって、
BE 底面部材
WE 枠形状で形成された壁部材および
DE 蓋
を有する筐体
CV 筐体中の中空空間
ASICであって、
SA 能動センサ面、SE2の一部分
を備えたASIC
AK 筐体における電気外側接点
MEMSセンサ(第1センサ素子)であって、
FKE バネ接点部材
を備えたMEMSセンサ
DF 筐体中のMEMSセンサ用のブシュ
KS 接着剤層
UF アンダーフィル
OE 第2センサ素子用の開口
DK ヴィア
VL 配線
BU バンプ
CL 配線面
SC はんだ接合部
SF 被覆箔または保護箔
GP DEとSE2との間の間隙
SR 密閉リング
KP 交点
Claims (9)
- センサ構造素子であって、
・それぞれ1つのセンサ機能のための、第1および第2センサ素子(SE1、SE2)を備えていて、
・共になって中空空間(CV)を取り囲む、底面部材(BE)と、枠形状で形成された壁部材(WE)と、蓋(DE)とを有する筐体を備えていて、
・前記第1センサ素子(SE1)はMEMSセンサであり、前記中空空間の内側で、前記筐体の前記底面部材に取り付けられていて、
・前記第2センサ素子(SE2)は、ASICとして、能動センサ面(SA)を備えて形成されていて、かつ、前記蓋の上または下に取り付けられていて、または、前記蓋中に埋め込まれていて、
・電気外側接点(AK)が、前記筐体の外側面に設けられていて、
・前記中空空間が、少なくとも1つの開口(OE)またはブシュ(DF)を有し、
前記第1センサ素子(SE1)はMEMS圧力センサであり、
前記第2センサ素子(SE2)が、温度センサおよび/または湿度センサであり、
第1および第2センサ素子は、周辺に対して異なる方法でアクセスをし、
前記第1センサ素子(SE1)のアクセスは、湿度に対する保護方策を用いて保護されていて、
前記第2センサ素子(SE2)についてのアクセスにより、前記第2センサ素子の能動センサ面に湿度が妨げられないで入ってくるように形成されており、
前記電気外側接点(AK)は、前記底面部材(BE)の下面に配置され、前記底面部材を通るヴィア(DK)によって前記第1センサ素子に接続され、
前記電気外側接点(AK)は、前記壁部材(WE)を通る配線(VL)によって前記第2センサ素子に接続される、センサ構造素子。 - 前記MEMSセンサ(SE1)は、張力なしにバネ接点部材(FKE)上に取り付けられていて、前記バネ接点部材は、前記MEMSセンサの接触面を、前記底面部材の内側上にある内側接続面と接続する、請求項1に記載のセンサ構造素子。
- 前記ASICの上または中に、少なくとも1つのセンサ機能が統合されていて、前記ASICは、出力値を生成する、請求項1または2に記載のセンサ構造素子。
- 前記蓋(DE)は、集積された相互接続部を備えた導体基板を具備し、
前記導体基板上の前記ASICと前記電気外側接点(AK)との間の電気接続は、前記壁部材(WE)の内側で、かつ、前記底面部材(BE)を貫通して延在する、請求項1〜3のいずれか1項に記載のセンサ構造素子。 - ・前記上に置かれた蓋(DE)は、開口(OE)を有し、
・前記第2センサ素子(SE2)の前記能動センサ面(SA)は、前記開口の下方に配置されている、請求項1〜4のいずれか1項に記載のセンサ構造素子。 - ・前記第2センサ素子(SE2)は、前記蓋(DE)中の前記開口(OE)を下から閉鎖するが、
・この閉鎖は、接着剤を用いて、前記第2センサ素子が下から前記蓋上に接着されることにより、または
・前記第2センサ素子が、距離をとって、下方で前記蓋に固定されていて、前記第2センサ素子の上面と、前記蓋の下面との間の空間は、少なくとも前記第2センサ素子の縁に沿って、アンダーフィルで充填されていて、
・前記能動センサ面(SA)には、接着剤またはアンダーフィル(UF)がついていない、請求項5に記載のセンサ構造素子。 - 前記筐体はブシュを有し、前記ブシュは、前記筐体の内側を、ひいては前記MEMSセンサを、前記筐体の外側にある周辺と接続させる、請求項1〜6のいずれか1項に記載のセンサ構造素子。
- 前記蓋(DE)は前記壁部材(WE)上に距離をとって固定されていて、その結果、前記ブシュ(DF)が、蓋と壁部材との間に形成されている、請求項7に記載のセンサ構造素子。
- 開口(OE)が1つのみまたはブシュ(DF)が1つのみ存在していて、これが、前記双方のセンサ素子(SE)を前記筐体の外側にある周辺と接続する、請求項7または8に記載のセンサ構造素子。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102014106220.5A DE102014106220B4 (de) | 2014-05-05 | 2014-05-05 | Sensorbauelement mit zwei Sensorfunktionen |
DE102014106220.5 | 2014-05-05 | ||
PCT/EP2015/058814 WO2015169615A1 (de) | 2014-05-05 | 2015-04-23 | Sensorbauelement mit zwei sensorfunktionen |
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JP2017516989A JP2017516989A (ja) | 2017-06-22 |
JP6265283B2 true JP6265283B2 (ja) | 2018-01-24 |
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US (1) | US10544035B2 (ja) |
EP (1) | EP3140245B1 (ja) |
JP (1) | JP6265283B2 (ja) |
DE (1) | DE102014106220B4 (ja) |
WO (1) | WO2015169615A1 (ja) |
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US9820920B2 (en) * | 2014-09-30 | 2017-11-21 | L'oreal | High UV protection alcohol-free emulsion system, that is clear on application |
US9706294B2 (en) | 2015-03-18 | 2017-07-11 | Infineon Technologies Ag | System and method for an acoustic transducer and environmental sensor package |
WO2017157938A1 (en) * | 2016-03-14 | 2017-09-21 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with integrated wall structure for subsequent assembly of an electronic component |
WO2017176506A1 (en) * | 2016-04-05 | 2017-10-12 | University Of Florida Research Foundation, Incorporated | Flush-mount micromachined transducers |
EP3261366B1 (en) * | 2016-06-21 | 2021-09-22 | Sciosense B.V. | Microphone and pressure sensor package and method of producing the microphone and pressure sensor package |
DE102017129611B4 (de) * | 2017-12-12 | 2021-04-22 | RF360 Europe GmbH | Elektrische Vorrichtung mit zwei oder mehr Chipkomponenten |
DE102019201228B4 (de) * | 2019-01-31 | 2023-10-05 | Robert Bosch Gmbh | Verfahren zum Herstellen einer Mehrzahl von Sensoreinrichtungen und Sensoreinrichtung |
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US6221750B1 (en) * | 1998-10-28 | 2001-04-24 | Tessera, Inc. | Fabrication of deformable leads of microelectronic elements |
US20060185429A1 (en) * | 2005-02-21 | 2006-08-24 | Finemems Inc. | An Intelligent Integrated Sensor Of Tire Pressure Monitoring System (TPMS) |
US8288180B2 (en) | 2005-07-04 | 2012-10-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing light emitting device |
US7635077B2 (en) * | 2005-09-27 | 2009-12-22 | Honeywell International Inc. | Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby |
US20070164378A1 (en) | 2006-01-13 | 2007-07-19 | Honeywell International Inc. | Integrated mems package |
DE102006046292B9 (de) | 2006-09-29 | 2014-04-30 | Epcos Ag | Bauelement mit MEMS-Mikrofon und Verfahren zur Herstellung |
DE102007010711B4 (de) * | 2007-02-28 | 2018-07-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Schaltanordnung, Messvorrichtung damit und Verfahren zu deren Herstellung |
DE102008025599B4 (de) * | 2007-05-14 | 2013-02-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Gehäuste aktive Mikrostrukturen mit Direktkontaktierung zu einem Substrat |
GB2467776A (en) * | 2009-02-13 | 2010-08-18 | Wolfson Microelectronics Plc | Integrated MEMS transducer and circuitry |
DE102010006132B4 (de) * | 2010-01-29 | 2013-05-08 | Epcos Ag | Miniaturisiertes elektrisches Bauelement mit einem Stapel aus einem MEMS und einem ASIC |
DE102010007605B4 (de) | 2010-02-11 | 2015-04-16 | Epcos Ag | Miniaturisiertes Bauelement mit zwei Chips und Verfahren zu dessen Herstellung |
DE102010012042A1 (de) * | 2010-03-19 | 2011-09-22 | Epcos Ag | Bauelement mit einem Chip in einem Hohlraum und einer spannungsreduzierten Befestigung |
KR101381438B1 (ko) * | 2010-04-30 | 2014-04-04 | 유보틱 인텔릭츄얼 프라퍼티 컴퍼니 리미티드 | 인쇄회로기판에 전기적으로 결합되도록 구성된 에어 캐비티 패키지 및 상기 에어 캐비티 패키지의 제공 방법 |
JP5983912B2 (ja) | 2012-02-09 | 2016-09-06 | セイコーエプソン株式会社 | 電子デバイスおよびその製造方法、並びに電子機器 |
WO2013156539A1 (en) * | 2012-04-17 | 2013-10-24 | Stmicroelectronics S.R.L. | Assembly of a semiconductor integrated device including a mems acoustic transducer |
DE102012215235A1 (de) * | 2012-08-28 | 2013-05-23 | Robert Bosch Gmbh | Sensorbauteil |
-
2014
- 2014-05-05 DE DE102014106220.5A patent/DE102014106220B4/de active Active
-
2015
- 2015-04-23 EP EP15719195.8A patent/EP3140245B1/de active Active
- 2015-04-23 WO PCT/EP2015/058814 patent/WO2015169615A1/de active Application Filing
- 2015-04-23 US US15/302,128 patent/US10544035B2/en active Active
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Publication number | Publication date |
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EP3140245A1 (de) | 2017-03-15 |
JP2017516989A (ja) | 2017-06-22 |
WO2015169615A1 (de) | 2015-11-12 |
EP3140245B1 (de) | 2018-04-18 |
US20170113924A1 (en) | 2017-04-27 |
DE102014106220A1 (de) | 2015-11-05 |
DE102014106220B4 (de) | 2020-06-18 |
US10544035B2 (en) | 2020-01-28 |
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