JP6308377B2 - マイクロフォン - Google Patents
マイクロフォン Download PDFInfo
- Publication number
- JP6308377B2 JP6308377B2 JP2016567748A JP2016567748A JP6308377B2 JP 6308377 B2 JP6308377 B2 JP 6308377B2 JP 2016567748 A JP2016567748 A JP 2016567748A JP 2016567748 A JP2016567748 A JP 2016567748A JP 6308377 B2 JP6308377 B2 JP 6308377B2
- Authority
- JP
- Japan
- Prior art keywords
- lid
- microphone
- transducer element
- acoustic
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- 230000000903 blocking effect Effects 0.000 claims description 27
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 230000001681 protective effect Effects 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 31
- 238000004519 manufacturing process Methods 0.000 description 15
- 239000012528 membrane Substances 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000007779 soft material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
- H04R1/083—Special constructions of mouthpieces
- H04R1/086—Protective screens, e.g. all weather or wind screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
- H04R1/2884—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0109—Bonding an individual cap on the substrate
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Otolaryngology (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Description
2 : 変換器素子
3 : メンブレン
4 : バックプレート
5 : フロントキャビティ
6 : バックキャビティ
7 : 音響入口開口部
8 : 基板
9 : はんだバンプ
10 : 別のデバイス
11 : 蓋
12 : 接着部
13 : 開口部
14 : 音響遮断部
15 : 保護グリッド
16 : 側壁
17 : 上面
18 : 第1の領域
19 : 第2の領域
20 : 沈下部
21 : フィルム
22 : 金属層
23 : 保護フィルム
24 : フォトレジストパターン
25 : 切開部
26 : 内側領域
Claims (15)
- マイクロフォン(1)であって、
1つの基板(8)と、
前記基板(8)上に配設されている、1つの変換器素子(2)と、
1つの開口部(13)を有する1つの蓋(11)であって、当該蓋(11)の開口部(13)が、前記変換器素子(2)を完全に覆っている蓋(11)と、
前記蓋(11)を前記変換器素子(2)に固定する1つの音響遮断部(14)と、
を備えることを特徴とするマイクロフォン。 - 請求項1に記載のマイクロフォンにおいて、
前記変換器素子(2)は、1つのフロントキャビティ(5)および1つのバックキャビティ(6)を形成し、
前記フロントキャビティ(5)は、前記蓋(11)の前記開口部(13)を介して、前記マイクロフォン(1)の外部環境と音響的に結合されており、
前記蓋(11)および前記音響遮断部(14)は、前記蓋(11),前記音響遮断部(14),前記変換器素子(2),および前記基板(8)が、前記変換器素子(2)のバックキャビティ(6)を閉じている、
ことを特徴とするマイクロフォン。 - 前記蓋(11)は金属から成っていることを特徴とする、請求項1または2に記載のマイクロフォン。
- 前記音響遮断部(14)は、前記蓋(11)よりも小さな弾性率を有する材料を備えることを特徴とする、請求項1乃至3のいずれか1項に記載のマイクロフォン。
- 前記音響遮断部(14)は、接着剤を備えることを特徴とする、請求項1乃至4のいずれか1項に記載のマイクロフォン。
- 請求項1乃至5のいずれか1項に記載のマイクロフォン(1)において、
前記蓋(11)は、前記基板(8)に対して平行に配設されている1つの上面(17)を備え、
前記蓋(11)の前記開口部(13)は、前記上面(17)に配設されている、
ことを特徴とするマイクロフォン。 - 請求項6に記載のマイクロフォン(1)において、
前記蓋(11)の前記上面(17)は、1つの第1の領域(18)および1つの第2の領域(19)を備え、
前記開口部(13)は、前記第1の領域(18)に配設されており、
前記第1の領域(18)は、前記基板(8)に対して、前記第2の領域(19)よりも小さな距離で配設されている、
ことを特徴とするマイクロフォン。 - 前記上面(17)は、前記基板(8)に向いた1つの沈下部(20)を備えることを特徴とする、請求項6または7に記載のマイクロフォン。
- 前記音響遮断部(14)は、1つのフィルム(21)を備え、当該フィルムは、前記蓋(11)および前記変換器素子(2)を部分的に覆っていることを特徴とする、請求項1乃至8のいずれか1項に記載のマイクロフォン。
- 前記フィルム(21)は、ポリマーから成っていることを特徴とする、請求項9に記載のマイクロフォン。
- 1つの金属層(22)が、前記フィルム(21)の上に配設されていることを特徴とする、請求項9または10に記載のマイクロフォン。
- 前記変換器素子(2)は、前記音響遮断部(14)の無い、1つの音響入口開口部(7)を備えることを特徴とする、請求項1乃至11のいずれか1項に記載のマイクロフォン。
- 前記変換器素子(2)は、前記音響遮断部(14)によって部分的に覆われている、1つの音響入口開口部(7)を備えることを特徴とする、請求項1乃至11のいずれか1項に記載のマイクロフォン。
- 前記音響遮断部(14)は、前記音響入口開口部(7)を部分的に覆っている、1つのグリッド形状の領域を備えることを特徴とする、請求項13に記載のマイクロフォン。
- 前記蓋(11)の前記開口部(13)の上に、1つの音響透過可能な保護グリッド(15)が配設されていることを特徴とする、請求項1乃至14のいずれか1項に記載のマイクロフォン。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014106818.1 | 2014-05-14 | ||
DE102014106818.1A DE102014106818B3 (de) | 2014-05-14 | 2014-05-14 | Mikrofon |
PCT/EP2015/059203 WO2015173009A1 (de) | 2014-05-14 | 2015-04-28 | Mikrofonanordnung mit vergrösserter öffnung und entkoppelung zum deckel |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017519419A JP2017519419A (ja) | 2017-07-13 |
JP6308377B2 true JP6308377B2 (ja) | 2018-04-11 |
Family
ID=52997460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016567748A Expired - Fee Related JP6308377B2 (ja) | 2014-05-14 | 2015-04-28 | マイクロフォン |
Country Status (4)
Country | Link |
---|---|
US (1) | US20170223441A1 (ja) |
JP (1) | JP6308377B2 (ja) |
DE (1) | DE102014106818B3 (ja) |
WO (1) | WO2015173009A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3360340B1 (en) * | 2015-10-07 | 2019-12-04 | TDK Corporation | Top port microphone with enlarged back volume |
CN110958519A (zh) * | 2019-11-22 | 2020-04-03 | 歌尔股份有限公司 | 一种主动降噪声学单元及发声单体 |
JP7483110B1 (ja) | 2023-08-25 | 2024-05-14 | 善彦 加藤 | スピーカー装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4206599B2 (ja) * | 2000-02-29 | 2009-01-14 | 康浩 蜂須賀 | マイクロホン |
DE102004011148B3 (de) * | 2004-03-08 | 2005-11-10 | Infineon Technologies Ag | Mikrophon und Verfahren zum Herstellen eines Mikrophons |
DE102006046292B9 (de) * | 2006-09-29 | 2014-04-30 | Epcos Ag | Bauelement mit MEMS-Mikrofon und Verfahren zur Herstellung |
WO2008134530A2 (en) * | 2007-04-25 | 2008-11-06 | University Of Florida Research Foundation, Inc. | A capacitive microphone with integrated cavity |
DE102008032319B4 (de) * | 2008-07-09 | 2012-06-06 | Epcos Ag | Verfahren zur Herstellung eines MST Bauteils |
JP5258030B2 (ja) * | 2008-07-25 | 2013-08-07 | Necカシオモバイルコミュニケーションズ株式会社 | 防水音響構造、及び電子機器 |
US8199939B2 (en) * | 2009-01-21 | 2012-06-12 | Nokia Corporation | Microphone package |
US7790492B1 (en) * | 2009-06-13 | 2010-09-07 | Mwm Acoustics, Llc | Method for fabricating a transducer package with the transducer die unsupported by a substrate |
JP2011049752A (ja) * | 2009-08-26 | 2011-03-10 | Star Micronics Co Ltd | コンデンサマイクロホン |
US8551799B2 (en) * | 2010-05-06 | 2013-10-08 | Stmicroelectronics S.R.L. | Encapsulated micro-electro-mechanical device, in particular a MEMS acoustic transducer |
DE102010026519B4 (de) * | 2010-07-08 | 2016-03-10 | Epcos Ag | Gehäuse mit MEMS-Mikrofon, elektrisches Gerät mit Gehäuse mit MEMS-Mikrofon und Verfahren zur Herstellung |
US20140064546A1 (en) * | 2012-08-01 | 2014-03-06 | Knowles Electronics, Llc | Microphone assembly |
-
2014
- 2014-05-14 DE DE102014106818.1A patent/DE102014106818B3/de active Active
-
2015
- 2015-04-28 JP JP2016567748A patent/JP6308377B2/ja not_active Expired - Fee Related
- 2015-04-28 US US15/311,090 patent/US20170223441A1/en not_active Abandoned
- 2015-04-28 WO PCT/EP2015/059203 patent/WO2015173009A1/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
DE102014106818B3 (de) | 2015-11-12 |
US20170223441A1 (en) | 2017-08-03 |
JP2017519419A (ja) | 2017-07-13 |
WO2015173009A1 (de) | 2015-11-19 |
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