JP6251274B2 - 導電性を改善するための電気的接続粉末およびペースト - Google Patents
導電性を改善するための電気的接続粉末およびペースト Download PDFInfo
- Publication number
- JP6251274B2 JP6251274B2 JP2015535080A JP2015535080A JP6251274B2 JP 6251274 B2 JP6251274 B2 JP 6251274B2 JP 2015535080 A JP2015535080 A JP 2015535080A JP 2015535080 A JP2015535080 A JP 2015535080A JP 6251274 B2 JP6251274 B2 JP 6251274B2
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- JP
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- Prior art keywords
- foam
- powder
- paste
- electrical connection
- skeleton
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000843 powder Substances 0.000 title claims description 37
- 239000004020 conductor Substances 0.000 claims description 41
- 239000006260 foam Substances 0.000 claims description 25
- 239000002245 particle Substances 0.000 claims description 18
- 238000007747 plating Methods 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 239000006262 metallic foam Substances 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 239000002923 metal particle Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 230000003078 antioxidant effect Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 238000003780 insertion Methods 0.000 description 9
- 230000037431 insertion Effects 0.000 description 9
- 230000006866 deterioration Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 210000004027 cell Anatomy 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 210000003850 cellular structure Anatomy 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 235000021110 pickles Nutrition 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000009628 steelmaking Methods 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
- B22F2009/045—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by other means than ball or jet milling
- B22F2009/046—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by other means than ball or jet milling by cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
- H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
- H01R4/20—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping using a crimping sleeve
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/30—Clamped connections, spring connections utilising a screw or nut clamping member
- H01R4/304—Clamped connections, spring connections utilising a screw or nut clamping member having means for improving contact
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12181—Composite powder [e.g., coated, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Non-Insulated Conductors (AREA)
Description
Claims (10)
- 連続気泡からなる発泡体粒子で構成される電気的接続粉末であって、前記発泡体が、鉄、コバルト、ニッケルおよびこれらの合金からなる群から選択される金属発泡体の骨格を有し、錫、インジウムまたはこれらの合金のうちの少なくとも1種類からなるメッキで被覆されることを特徴とする電気的接続粉末。
- 前記発泡体がニッケル発泡体の骨格を含むことを特徴とする請求項1に記載の粉末。
- 前記ニッケル発泡体の骨格が錫メッキで被覆されることを特徴とする請求項2に記載の粉末。
- 請求項1、2または3のうちのいずれか1項に記載の粉末と該粉末が分散されたバインダーを含むことを特徴とする電気的接続ペースト。
- 前記バインダーが脂肪を含有することを特徴とする請求項4に記載のペースト。
- 前記バインダーが抗酸化生成物および数ミクロンの金属粒子を含むことでその使用寿命を延ばすことを特徴とする請求項4または5に記載のペースト。
- 前記金属粒子が銀、金または良好な電気導体である金属粒子であることを特徴とする請求項6に記載のペースト。
- 気泡で構成された発泡体の骨格を発達させるステップと、次いで、該発泡体の気泡構造を維持する手段を用いて同骨格を0.5mmから5mmまでの変動範囲の粒径を有する粒子に裁断するステップとを備える、請求項1、2、または3のいずれか1項に記載の粉末を製造する方法。
- 前記粒子が1mmから2mmの変動範囲の粒径を有することを特徴とする請求項8に記載の方法。
- 該発泡体を裁断するための前記手段がレーザー装置であることを特徴とする請求項8または9に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1202631 | 2012-10-03 | ||
FR1202631A FR2996348B1 (fr) | 2012-10-03 | 2012-10-03 | Poudre et pate pour ameliorer la conductance des connexions electriques |
PCT/FR2013/000258 WO2014053715A1 (fr) | 2012-10-03 | 2013-10-02 | Poudre et pâte pour améliorer la conductance des connexions électriques |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015537115A JP2015537115A (ja) | 2015-12-24 |
JP6251274B2 true JP6251274B2 (ja) | 2017-12-20 |
Family
ID=47664346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015535080A Active JP6251274B2 (ja) | 2012-10-03 | 2013-10-02 | 導電性を改善するための電気的接続粉末およびペースト |
Country Status (10)
Country | Link |
---|---|
US (1) | US9748014B2 (ja) |
EP (1) | EP2904615B1 (ja) |
JP (1) | JP6251274B2 (ja) |
KR (1) | KR102103964B1 (ja) |
CN (1) | CN104903972A (ja) |
AU (1) | AU2013326368B2 (ja) |
CA (1) | CA2886818C (ja) |
FR (1) | FR2996348B1 (ja) |
HK (1) | HK1214885A1 (ja) |
WO (1) | WO2014053715A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202015103789U1 (de) * | 2015-07-17 | 2015-07-31 | Abb Technology Ag | Oberflächentemperaturfühler |
FR3050579B1 (fr) * | 2016-04-25 | 2018-04-20 | A M C | Dispositif et procede de reparation des cosses de connexion electrique |
FR3073677B1 (fr) | 2017-11-13 | 2019-10-11 | A M C | Dispositif de contact adapte pour faciliter la reparation des connexions electriques boulonnees |
EP4416800A1 (en) * | 2021-10-14 | 2024-08-21 | Alotek Technology Limited Liability Company | Electrical contact connection |
Family Cites Families (32)
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US3539973A (en) | 1968-02-12 | 1970-11-10 | Hughes Aircraft Co | Electrical connector |
US3649954A (en) | 1970-06-26 | 1972-03-14 | John O Kurtz | Clamp-type electrical terminals |
US4023882A (en) | 1974-04-25 | 1977-05-17 | Borge Hugo Pettersson | Electrical connector device securable to metal member |
JPS5380589A (en) | 1976-12-24 | 1978-07-17 | Hitachi Ltd | Connecting method for electric conductor |
JPS6177278A (ja) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | 回路の接続部材 |
US4923739A (en) | 1987-07-30 | 1990-05-08 | American Telephone And Telegraph Company | Composite electrical interconnection medium comprising a conductive network, and article, assembly, and method |
US5153818A (en) | 1990-04-20 | 1992-10-06 | Rohm Co., Ltd. | Ic memory card with an anisotropic conductive rubber interconnector |
DE59206955D1 (de) | 1992-05-08 | 1996-09-26 | Multi Contact Ag | Kontaktvorrichtung |
US6114645A (en) | 1995-04-27 | 2000-09-05 | Burgess; Lester E. | Pressure activated switching device |
US5620290A (en) | 1995-08-23 | 1997-04-15 | Illinois Tool Works Inc. | Ground retainer |
US5865638A (en) | 1995-12-21 | 1999-02-02 | Alcoa Fujikura Ltd. | Electrical connector |
US5857858A (en) | 1996-12-23 | 1999-01-12 | General Electric Company | Demountable and repairable low pitch interconnect for stacked multichip modules |
US6309742B1 (en) | 2000-01-28 | 2001-10-30 | Gore Enterprise Holdings, Inc. | EMI/RFI shielding gasket |
CN1356699A (zh) * | 2001-01-16 | 2002-07-03 | 刘明芳 | 一种导电膏及降低室内强电接头电阻的方法 |
LU90721B1 (en) * | 2001-01-25 | 2002-07-26 | Circuit Foil Luxembourg Trading Sarl | Method for producing metal foams and furnace for producing same |
US6799977B2 (en) | 2002-07-11 | 2004-10-05 | Hewlett-Packard Development Company, L.P. | Socket having foam metal contacts |
FR2847391A1 (fr) | 2002-11-20 | 2004-05-21 | A M C | Dispositif de contact pour ameliorer la duree de vie des connexions electriques |
JP2004298962A (ja) * | 2003-03-17 | 2004-10-28 | Mitsubishi Materials Corp | はんだ接合材及びこれを用いたパワーモジュール基板 |
JP2004319382A (ja) | 2003-04-18 | 2004-11-11 | Kyoshin Kogyo Co Ltd | アース端子 |
DE10326788B4 (de) | 2003-06-13 | 2005-05-25 | Robert Bosch Gmbh | Kontaktoberflächen für elektrische Kontakte und Verfahren zur Herstellung |
AU2006205885B2 (en) * | 2005-01-12 | 2009-05-14 | Technical University Of Denmark | A method for shrinkage and porosity control during sintering of multilayer structures |
US7294020B2 (en) | 2005-05-25 | 2007-11-13 | Alcoa Fujikura Ltd. | Canted coil spring power terminal and sequence connection system |
JP2007026776A (ja) * | 2005-07-13 | 2007-02-01 | Sumitomo Electric Ind Ltd | 導電性微粒子およびそれを用いた接着剤 |
JP2008200728A (ja) * | 2007-02-21 | 2008-09-04 | Mitsubishi Materials Corp | はんだ接合材及びその製造方法並びにこれを用いたパワーモジュール基板 |
KR20100009540A (ko) * | 2007-05-15 | 2010-01-27 | 히다치 가세고교 가부시끼가이샤 | 회로 접속 재료 및 회로 부재의 접속 구조 |
JP4985129B2 (ja) * | 2007-06-12 | 2012-07-25 | 三菱電機株式会社 | 接合体および電子モジュールならびに接合方法 |
KR101448594B1 (ko) * | 2007-12-20 | 2014-10-13 | 재단법인 포항산업과학연구원 | 비정질 합금 분말 제조장치 및 그 제조방법 |
DE102008017157B4 (de) | 2008-04-03 | 2022-10-06 | Vitesco Technologies GmbH | Kontaktelement und Leiterplattenordnung |
FR2962856B1 (fr) * | 2010-07-16 | 2012-08-17 | Amc Holding | Dispositif de connexion electrique a conductance amelioree |
US9132514B2 (en) * | 2010-11-18 | 2015-09-15 | Dowa Holdings Co., Ltd. | Solder powder and method of producing solder powder |
TW201409848A (zh) | 2012-08-21 | 2014-03-01 | Adv Flexible Circuits Co Ltd | 軟性電路排線插接結構 |
JP2014097529A (ja) * | 2012-10-18 | 2014-05-29 | Fuji Electric Co Ltd | 発泡金属による接合方法、半導体装置の製造方法、半導体装置 |
-
2012
- 2012-10-03 FR FR1202631A patent/FR2996348B1/fr active Active
-
2013
- 2013-10-02 WO PCT/FR2013/000258 patent/WO2014053715A1/fr active Application Filing
- 2013-10-02 EP EP13780184.1A patent/EP2904615B1/fr active Active
- 2013-10-02 US US14/433,568 patent/US9748014B2/en active Active
- 2013-10-02 CN CN201380063239.7A patent/CN104903972A/zh active Pending
- 2013-10-02 AU AU2013326368A patent/AU2013326368B2/en active Active
- 2013-10-02 JP JP2015535080A patent/JP6251274B2/ja active Active
- 2013-10-02 KR KR1020157008323A patent/KR102103964B1/ko active IP Right Grant
- 2013-10-02 CA CA2886818A patent/CA2886818C/fr active Active
-
2016
- 2016-03-09 HK HK16102737.6A patent/HK1214885A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2014053715A1 (fr) | 2014-04-10 |
US9748014B2 (en) | 2017-08-29 |
HK1214885A1 (zh) | 2016-08-05 |
FR2996348B1 (fr) | 2015-05-15 |
CA2886818C (fr) | 2021-02-16 |
FR2996348A1 (fr) | 2014-04-04 |
US20150262723A1 (en) | 2015-09-17 |
EP2904615A1 (fr) | 2015-08-12 |
CN104903972A (zh) | 2015-09-09 |
KR20150092084A (ko) | 2015-08-12 |
KR102103964B1 (ko) | 2020-04-23 |
AU2013326368A1 (en) | 2015-05-07 |
AU2013326368B2 (en) | 2017-05-04 |
EP2904615B1 (fr) | 2019-05-08 |
CA2886818A1 (fr) | 2014-04-10 |
JP2015537115A (ja) | 2015-12-24 |
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