JP6245887B2 - 基板製造方法及び基板製造装置 - Google Patents

基板製造方法及び基板製造装置 Download PDF

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Publication number
JP6245887B2
JP6245887B2 JP2013165739A JP2013165739A JP6245887B2 JP 6245887 B2 JP6245887 B2 JP 6245887B2 JP 2013165739 A JP2013165739 A JP 2013165739A JP 2013165739 A JP2013165739 A JP 2013165739A JP 6245887 B2 JP6245887 B2 JP 6245887B2
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Prior art keywords
linear pattern
thin film
film material
repetitions
procedure
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JP2013165739A
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Japanese (ja)
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JP2015035498A (ja
Inventor
裕司 岡本
裕司 岡本
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Sumitomo Heavy Industries Ltd
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Sumitomo Heavy Industries Ltd
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Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to JP2013165739A priority Critical patent/JP6245887B2/ja
Priority to TW103123630A priority patent/TWI528879B/zh
Priority to KR1020140088443A priority patent/KR101663193B1/ko
Priority to CN201410338718.1A priority patent/CN104345549B/zh
Publication of JP2015035498A publication Critical patent/JP2015035498A/ja
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Publication of JP6245887B2 publication Critical patent/JP6245887B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2013165739A 2013-08-09 2013-08-09 基板製造方法及び基板製造装置 Active JP6245887B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013165739A JP6245887B2 (ja) 2013-08-09 2013-08-09 基板製造方法及び基板製造装置
TW103123630A TWI528879B (zh) 2013-08-09 2014-07-09 Substrate manufacturing method
KR1020140088443A KR101663193B1 (ko) 2013-08-09 2014-07-14 기판제조방법 및 기판제조장치
CN201410338718.1A CN104345549B (zh) 2013-08-09 2014-07-16 基板制造方法及基板制造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013165739A JP6245887B2 (ja) 2013-08-09 2013-08-09 基板製造方法及び基板製造装置

Publications (2)

Publication Number Publication Date
JP2015035498A JP2015035498A (ja) 2015-02-19
JP6245887B2 true JP6245887B2 (ja) 2017-12-13

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JP2013165739A Active JP6245887B2 (ja) 2013-08-09 2013-08-09 基板製造方法及び基板製造装置

Country Status (4)

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JP (1) JP6245887B2 (ko)
KR (1) KR101663193B1 (ko)
CN (1) CN104345549B (ko)
TW (1) TWI528879B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI639364B (zh) 2015-12-24 2018-10-21 藤倉股份有限公司 配線基板的製造方法以及配線基板
CN106735222B (zh) * 2016-11-04 2019-01-08 西北工业大学 均匀金属微滴选域择向沉积3d打印方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3744967B2 (ja) * 1995-06-14 2006-02-15 キヤノン株式会社 インクジェット方式によるプリント回路板の作成方法及びその装置
CN1738517A (zh) * 2004-08-20 2006-02-22 精工爱普生株式会社 多层结构形成方法、配线基板和电子仪器的制造方法
JP2008073647A (ja) * 2006-09-22 2008-04-03 Fujifilm Corp 液体吐出装置及びレジストパターン形成方法
JP4503063B2 (ja) * 2006-11-20 2010-07-14 シャープ株式会社 インク吐出装置、その方法、プログラムおよびコンピュータ読み取り可能な記録媒体
JP2009178674A (ja) * 2008-01-31 2009-08-13 Seiko Epson Corp 薄膜形成方法、カラーフィルタの製造方法
JP2010169890A (ja) * 2009-01-22 2010-08-05 Fujifilm Corp 線描画装置及び線描画方法
CN103688602B (zh) * 2011-07-08 2016-10-26 住友重机械工业株式会社 基板制造方法及基板制造装置

Also Published As

Publication number Publication date
KR20150018375A (ko) 2015-02-23
CN104345549A (zh) 2015-02-11
KR101663193B1 (ko) 2016-10-06
TWI528879B (zh) 2016-04-01
JP2015035498A (ja) 2015-02-19
CN104345549B (zh) 2019-04-16
TW201509254A (zh) 2015-03-01

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