JP6218660B2 - コンデンサ - Google Patents
コンデンサ Download PDFInfo
- Publication number
- JP6218660B2 JP6218660B2 JP2014069328A JP2014069328A JP6218660B2 JP 6218660 B2 JP6218660 B2 JP 6218660B2 JP 2014069328 A JP2014069328 A JP 2014069328A JP 2014069328 A JP2014069328 A JP 2014069328A JP 6218660 B2 JP6218660 B2 JP 6218660B2
- Authority
- JP
- Japan
- Prior art keywords
- external electrode
- electrode layer
- layer
- capacitor
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 239000003990 capacitor Substances 0.000 title claims description 103
- 239000000463 material Substances 0.000 claims description 26
- 239000011810 insulating material Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000002048 anodisation reaction Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 321
- 239000004020 conductor Substances 0.000 description 84
- 239000011241 protective layer Substances 0.000 description 49
- 238000010586 diagram Methods 0.000 description 19
- 230000002093 peripheral effect Effects 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 15
- 238000007747 plating Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 11
- 239000012212 insulator Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 239000003989 dielectric material Substances 0.000 description 7
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000007743 anodising Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910052745 lead Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 238000000866 electrolytic etching Methods 0.000 description 3
- 238000006703 hydration reaction Methods 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/10—Metal-oxide dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014069328A JP6218660B2 (ja) | 2014-03-28 | 2014-03-28 | コンデンサ |
| PCT/JP2015/057663 WO2015146667A1 (ja) | 2014-03-28 | 2015-03-16 | コンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014069328A JP6218660B2 (ja) | 2014-03-28 | 2014-03-28 | コンデンサ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015192083A JP2015192083A (ja) | 2015-11-02 |
| JP2015192083A5 JP2015192083A5 (enrdf_load_stackoverflow) | 2016-04-07 |
| JP6218660B2 true JP6218660B2 (ja) | 2017-10-25 |
Family
ID=54195190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014069328A Active JP6218660B2 (ja) | 2014-03-28 | 2014-03-28 | コンデンサ |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6218660B2 (enrdf_load_stackoverflow) |
| WO (1) | WO2015146667A1 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102610201B1 (ko) * | 2016-12-01 | 2023-12-06 | 삼성전자주식회사 | 전자 장치의 케이스 및 그 제조 방법 |
| US10867752B2 (en) | 2017-09-28 | 2020-12-15 | Samsung Electro-Mechanics Co., Ltd. | Capacitor and method of manufacturing the same |
| KR102004806B1 (ko) * | 2017-09-28 | 2019-07-29 | 삼성전기주식회사 | 커패시터 및 그 제조 방법 |
| JP6981476B2 (ja) * | 2017-11-30 | 2021-12-15 | 株式会社村田製作所 | キャパシタ |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4907594B2 (ja) * | 2007-06-14 | 2012-03-28 | 太陽誘電株式会社 | コンデンサ及びその製造方法 |
| JP4493686B2 (ja) * | 2007-09-27 | 2010-06-30 | 太陽誘電株式会社 | コンデンサ及びその製造方法 |
| JP5665618B2 (ja) * | 2011-03-17 | 2015-02-04 | 太陽誘電株式会社 | コンデンサ構成用ユニット及びコンデンサ |
| JP5665617B2 (ja) * | 2011-03-17 | 2015-02-04 | 太陽誘電株式会社 | コンデンサ構成用ユニット及びコンデンサ |
| JP5904765B2 (ja) * | 2011-11-10 | 2016-04-20 | 太陽誘電株式会社 | コンデンサ及びその製造方法 |
| JP5931594B2 (ja) * | 2012-06-07 | 2016-06-08 | 太陽誘電株式会社 | コンデンサ |
| JP2014011419A (ja) * | 2012-07-03 | 2014-01-20 | Taiyo Yuden Co Ltd | コンデンサ |
-
2014
- 2014-03-28 JP JP2014069328A patent/JP6218660B2/ja active Active
-
2015
- 2015-03-16 WO PCT/JP2015/057663 patent/WO2015146667A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015192083A (ja) | 2015-11-02 |
| WO2015146667A1 (ja) | 2015-10-01 |
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