JP6213291B2 - Manufacturing method of power module substrate with heat sink - Google Patents

Description

  The present invention relates to a method for manufacturing a power module substrate with a heat sink used in a semiconductor device that controls a large current and a high voltage.

  As a power module, a power module substrate with a heat sink in which an aluminum plate is bonded to one surface of a ceramic substrate such as aluminum nitride and an aluminum heat sink is bonded to the other surface via an aluminum plate is used. It has been.

Conventionally, a power module substrate with a heat sink has been manufactured as follows.
First, an aluminum plate is laminated on one surface and the other surface of the ceramic substrate via a brazing material suitable for joining the ceramic substrate and the aluminum plate to the surface of the ceramic substrate, and the brazing material is pressed with a predetermined pressure. The power module substrate is manufactured by joining the ceramic substrate and the aluminum plates on both sides by heating and cooling to a temperature equal to or higher than the temperature at which the material melts.

Next, a heat sink is laminated on the aluminum plate on the other side of the power module substrate via a brazing material suitable for joining the aluminum plate and the heat sink, and the brazing material is melted while being pressed at a predetermined pressure. Heat to above temperature and cool. Thereby, an aluminum plate and a heat sink can be joined and a power module substrate with a heat sink can be manufactured.
In addition, the aluminum plate bonded to one surface side of the power module substrate with a heat sink thus configured is formed as a circuit layer, and electronic components such as power elements are placed on the circuit layer via a solder material. Installed.

  However, in the joining of members having different thermal expansion coefficients such as a ceramic substrate and an aluminum plate, warpage occurs due to thermal contraction during cooling after joining. As described above, when the power module substrate with a heat sink is warped, the solder and the electronic component are likely to be misaligned when the electronic component is soldered to the circuit layer. In addition, there is a risk that the reliability of the solder joint portion or the substrate due to the destruction of the electronic component itself or the thermal cycle may be caused.

  Therefore, as a countermeasure against such warpage, in Patent Document 1, when the power module substrate (metal-ceramic bonding substrate) and the heat sink (heat radiator) are brazed, a concave R is formed on the other surface of the heat sink. A jig having a surface is disposed so as to face each other, and a jig having a convex R surface protruding toward the metal circuit board is brought into contact with the other surface of the metal circuit board. It is described that heat bonding is performed while pressure is applied to the heat sink and the amount of warpage of the power module substrate with heat sink (heat sink integrated substrate) after bonding is reduced.

  On the other hand, as shown in Patent Document 2, for example, in a fin-integrated heat sink in which a plurality of fins are erected on a plate-like member, the peripheral portion of the plate-like member on which the fins are erected is used as a structural member of various devices. Installed in close contact. For this reason, in the fin-integrated heat sink, it is required to reduce warpage for satisfying the required specifications as a power module, and the peripheral portion is an attachment portion to the structural member of various devices. In order to ensure the sealing performance between the rim and the structural member, it is necessary to form the peripheral edge with a flat surface.

JP 2013-197246 A JP 2012-227365 A

  As described in Patent Document 1, the amount of warpage can be reduced by sandwiching a power module substrate and a heat sink with a jig having an R surface and applying pressure while heating, but the heat sink can reduce the amount of warpage. When it is larger than the substrate for the heat sink, the peripheral portion of the heat sink is not pressurized by the jig, so that deformation occurs due to a difference in thermal contraction between the upper portion and the lower portion of the heat sink, and the peripheral portion cannot be maintained flat. For this reason, after joining the power module substrate and the heat sink, it is necessary to provide another process to correct the peripheral edge of the heat sink to a flat surface.

  The present invention has been made in view of such circumstances, and can reduce the warpage generated when the power module substrate and the fin-integrated heat sink are joined together, and can bring the fin-integrated heat sink and the structural members of various devices into close contact with each other. It is an object of the present invention to provide a method for manufacturing a power module substrate with a heat sink that can be held by a heat sink.

  The present invention provides a power module substrate in which a circuit layer is disposed on one surface of a ceramic substrate and a metal layer is disposed on the other surface of the ceramic substrate. A method of manufacturing a power module substrate with a heat sink that is joined to a fin-integrated heat sink in which a plurality of fins are erected on the surface of the power module, wherein the heat sink is placed on the metal layer of the power module substrate. A brazing step of brazing the power module substrate and the heat sink by heating the substrate while sandwiching the body between the pair of pressure plates in the laminating direction, and in the brazing step, The pressure plate includes an upper pressure plate having a curved convex surface that presses the surface of the circuit layer, and a curved surface that presses the tip of the fin of the heat sink. A lower pressure plate having a concave surface, and a peripheral portion of the lower pressure plate is provided with a receiving portion having a flat surface that receives the lower surface of the peripheral portion of the plate-like member during cooling. And

During normal joining, a convex warp occurs with the circuit layer on the upper side due to a difference in thermal expansion between the power module substrate and the heat sink. In this regard, in the method for manufacturing a power module substrate with a heat sink according to the present invention, the laminate of the heat sink and the power module substrate has a curved convex surface or concave surface when the heat sink and the power module substrate are joined. Since the pair of pressure plates is used for clamping, a concave warpage with the circuit layer side in the stacking direction on the upper side can be generated in the sandwiched portion.
Then, by cooling the laminated body of the heat sink and the power module substrate for a predetermined time at a temperature equal to or higher than the temperature at which the brazing material melts, the heat sink and the power module substrate have a shape along the concave shape on the joint surface. The brazing material can be hardened, and even after the pressure state in the stacking direction is released, a joined body having a circuit layer on the upper side and warping in a concave shape or having a small warping amount even in a convex shape can be obtained.
Further, when cooling is not performed on the peripheral portion of the heat sink provided extending from the joint surface between the metal layer and the heat sink during cooling, the conventional power module substrate 1A with a heat sink shown in FIG. 6 is used. Further, the peripheral edge portion 21 of the heat sink 20 is deformed to be bent downward. This is because when the power module substrate 10 is bonded to the upper side of the heat sink 20, a thermal expansion / contraction difference occurs between the upper surface 20 a side and the lower surface 20 b side of the heat sink 20, and the lower surface 20 b side of the heat sink 20 becomes more easily deformed. It is.
In this regard, in the present invention, the lower surface of the peripheral portion of the heat sink is supported and supported by the receiving portion, so that deformation due to thermal contraction accompanying cooling can be prevented, and the flat state of the peripheral portion can be improved. Can be maintained.
In addition, when joining the heat sink and the power module substrate, the receiving portion is dimensioned so as not to contact the peripheral portion of the plate member of the heat sink during heating so that the peripheral portion is not deformed by an external load. It is preferable that
Therefore, it is possible to reduce the warpage that occurs when joining the power module substrate and the heat sink, improve the workability in the element soldering process, and maintain the peripheral portion of the heat sink in a flat state. The substrate and the structural members of various devices can be attached in close contact, and can be held well.

In the manufacturing method of the substrate for a power module with a heat sink according to the present invention, a pressing portion having a flat surface facing the flat surface of the receiving portion is provided on a peripheral portion of the upper pressure plate, and the pressing member is flat. The surface may be configured to receive an upper surface of a peripheral portion of the plate-like member that is deformed during cooling in the brazing step.
By providing the pressing portion, even when the edge of the peripheral portion of the heat sink is warped upward during cooling, deformation of the peripheral portion of the heat sink can be suppressed by contacting the pressing portion. Moreover, the variation in the deformation amount of the peripheral portion of the heat sink in the plurality of power module substrates with heat sinks can be suppressed.

  ADVANTAGE OF THE INVENTION According to this invention, while reducing the curvature which arises at the time of joining the board | substrate for power modules and a fin integrated heat sink, workability | operativity at the time of power module manufacture can be improved, the structure of a fin integrated heat sink and various apparatuses Good heat dissipation performance can be ensured by closely contacting the member.

It is sectional drawing which shows the power module using the board | substrate for power modules with a heat sink. It is sectional drawing explaining the manufacturing method of the board | substrate for power modules with a heat sink which concerns on this invention, (a) is before joining of a board | substrate for power modules and a heat sink, (b) shows the state after joining. It is a side view explaining the jig | tool used for the manufacturing method of the board | substrate for power modules with a heat sink of 1st Embodiment which concerns on this invention. It is a side view explaining the jig | tool used for the manufacturing method of the board | substrate for power modules with a heat sink of 2nd Embodiment which concerns on this invention. It is a disassembled perspective view which shows the example of attachment to the water cooling box of a power module. It is sectional drawing of the board | substrate for power modules with a heat sink manufactured by the conventional method.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
As shown in FIG. 1, a power module substrate 1 with a heat sink manufactured by the method for manufacturing a power module substrate with a heat sink according to the present invention includes a fin 1 in which a plurality of fins are erected on a power module substrate 10. In the method for manufacturing a power module substrate with a heat sink according to the present embodiment, a power module substrate 10 is first manufactured as shown in FIG. 2A, and this power module is joined. A power module substrate 1 with a heat sink as shown in FIG. 2B is manufactured by brazing the substrate 10 and the heat sink 20 together.

Then, the power module 100 is manufactured by mounting the electronic component 30 such as a semiconductor chip on the surface of the power module substrate 1 with heat sink manufactured as described above.
The power module 100 including the fin-integrated heat sink 20 is used in a state of being attached to a cooling box 40 as shown in FIG. 5, for example. The cooling box 40 has an opening 41 for attaching the pin-like fins 22 of the heat sink 20 in an inserted state, and a packing receiving groove 42 so as to surround the opening 41. . And the screw hole 43 is formed in the outer side of the packing accommodation groove | channel 42, and it inserts in the opening part 41 by arrange | positioning the heat sink 20 so that the pin-shaped fin 22 may face downward, and the peripheral part of the plate-shaped member 21 Is made in close contact with the periphery of the opening 41 via a packing 50 and fixed by screwing.
In the illustrated example, two power module substrates 1 with a heat sink are attached, and as indicated by white arrows, a cooling medium circulates inside the cooling box 40 and the pin-like fins in the inserted state are inserted. 22 is cooled.

  The power module substrate 10 constituting the power module substrate 10 with a heat sink includes a ceramic substrate 11, a circuit layer 12 laminated on one surface of the ceramic substrate 11, and a metal laminated on the other surface of the ceramic substrate 11. Layer 13. The electronic component 30 is soldered to the surface of the circuit layer 12 of the power module substrate 10, and the heat sink 20 is attached to the surface of the metal layer 13.

The ceramic substrate 11 is made of, for example, nitride ceramics such as AlN (aluminum nitride), Si ₃ N ₄ (silicon nitride), or oxide ceramics such as Al ₂ O ₃ (alumina). In this embodiment, AlN is used. Was used. Further, the thickness of the ceramic substrate 11 is set within a range of 0.2 to 1.5 mm, and in this embodiment is set to 0.635 mm.

The circuit layer 12 is made of aluminum having a purity of 99% by mass or more. According to JIS standards, aluminum in the 1000s, particularly 1N90 (purity 99.9% by mass or more: so-called 3N aluminum) or 1N99 (purity 99.99% by mass or more: So-called 4N aluminum) can be used. The circuit layer 12 may be made of aluminum alloy, copper, or copper alloy in addition to aluminum.
The metal layer 13 is made of aluminum or an aluminum alloy having a purity of 99% by mass or more, and can be made of aluminum in the 1000s, particularly 1N99 (purity 99.99% by mass or more: so-called 4N aluminum) according to JIS standards.
In this embodiment, the circuit layer 12 and the metal layer 13 are aluminum plates made of a rolled plate of aluminum (so-called 4N aluminum) having a purity of 99.99% or more, and the thickness thereof is 0.2 mm to 3.0 mm. The circuit layer 12 has a thickness of 0.6 mm, and the metal layer 13 has a thickness of 2.1 mm.

  The circuit layer 12, the metal layer 13, and the ceramic substrate 11 are joined by, for example, brazing. As the brazing material, an alloy such as Al-Si, Al-Ge, Al-Cu, Al-Mg, or Al-Mn is used.

  The electronic component 30 constituting the power module 100 is formed on a Ni plating (not shown) formed on the surface of the circuit layer 12 with a Sn—Ag—Cu, Zn—Al, Sn—Ag, Sn— Bonding is performed using a solder material such as Cu, Sn—Sb, or Pb—Sn. Reference numeral 31 in FIG. 1 indicates the solder joint layer. The electronic component 30 and the terminal portion of the circuit layer 12 are connected by a bonding wire (not shown) made of aluminum.

Moreover, the heat sink 20 joined to the power module substrate 10 is formed of aluminum, copper, an aluminum alloy, a copper alloy, an AlSiC-based composite material, or the like. As shown in FIGS. A flat upper surface 20a to which the power module substrate 10 is bonded is formed on one surface side, and a plurality of pin-shaped fins 22 are erected on the lower surface 20b opposite to the upper surface 20a. It is a heat sink. Further, the pin-shaped fins 22 are erected at the central portion excluding the peripheral edge portion of the lower surface 20b, and the tip positions of the pin-shaped fins 22 are aligned on the horizontal plane, and have a substantially equal erected height from the surface of the lower surface 20b. It is formed to become. Further, as shown in FIG. 5, for example, as shown in FIG. 5, a through hole 23 is formed in the peripheral portion of the plate-like member 21 for screwing when attaching to various devices such as the cooling box 40.
The shape of the fin standing on the heat sink 20 is not particularly limited, and in addition to the pin-like fin 22 as in the present embodiment, a band-like fin or the like can be formed.

Next, a method for manufacturing the power module substrate 1 with a heat sink according to the first embodiment of the present invention will be described.
First, as the circuit layer 12 and the metal layer 13, 99.99 mass% or more of pure aluminum rolled sheets are prepared, and these pure aluminum rolled sheets are brazed on one surface and the other surface of the ceramic substrate 11, respectively. The power module substrate 10 in which a pure aluminum rolled plate is bonded to one surface and the other surface of the ceramic substrate 11 is manufactured by laminating the film through the pressure and heating. In addition, this brazing temperature is set to 600 degreeC-655 degreeC.

  In order to join the heat sink 20 to the power module substrate 10 configured as described above, first, as shown in FIG. 3, a jig constituted by a pair of pressure plates 110A and 110B and columns 111 provided at the four corners thereof. Using the tool 112, the heat sink 20 and the power module substrate 10 are laminated between the pressure plates 110A and 110B, and these are brazed (brazing step).

  The pair of pressure plates 110A and 110B of the jig 112 are obtained by laminating a carbon plate on the surface of a stainless steel material, and have a curved convex surface 110a that presses the surface of the circuit layer 12 of the power module substrate 10. The pressure plate 110 </ b> A and a lower pressure plate 110 </ b> B having a curved concave surface 110 b that presses the tip of the pin-shaped fin 22 of the heat sink 20. The convex surface 110 a and the concave surface 110 b of the pressure plates 110 </ b> A and 110 </ b> B are opposed to each other. The curvature radius R that makes the joint surface with the power module substrate 10 concave is 500 mm or more and 6000 mm or less, and is formed as a concave or convex surface having a curved surface. Further, the peripheral portion of the lower pressure plate 110B surrounds the periphery of the pin-like fins 22 of the heat sink 20, and has a receiving portion 101 having a flat surface that receives the lower surface of the peripheral portion of the heat sink 20 (plate member 21) during cooling. Is provided.

  And the screw | thread is cut at the both ends of the support | pillar 111, and the nut 113 is fastened so that pressure plate 110A, 110B may be pinched | interposed. Further, an urging means 115 such as a spring for urging the upper pressure plate 110A downward is provided between the top plate 114 supported by the support column 111 and the upper pressure plate 110A. Adjustment is made by tightening the biasing means 115 and the nut 113.

In the brazing step of the power module substrate 1 with a heat sink of the present embodiment, first, the heat sink 20 is placed on the lower pressure plate 110B having the concave surface 110b disposed on the lower side, and Al— The power module substrate 10 is placed on top of each other through a Si-based brazing foil (not shown), and the laminate of the heat sink 20 and the power module substrate 10 is placed on the upper pressure plate 110A having the convex surface 110a. The state is sandwiched between them. At this time, the laminate of the heat sink 20 and the power module substrate 10 is pressed in the thickness direction by the convex surfaces 110a and 110b of the pair of pressure plates 110A and 110B, and in the pressed (clamped) portion, the heat sink It restrains in the state which produced the deformation | transformation which makes 20 joint surfaces a concave curvature. Then, the heat sink 20 and the metal layer 13 of the power module substrate 10 are brazed by heating the laminate of the heat sink 20 and the power module substrate 10 in a pressurized state by the pair of pressure plates 110A and 110B. Stick.
In addition, as Al-Si type | system | group brazing material foil, Al-5 mass% Si-Al-20 mass% Si brazing material foil can be used. Brazing is performed in a vacuum atmosphere under conditions of a load of 0.1 MPa to 10 MPa and a heating temperature of 580 ° C. to 650 ° C.

Next, the joined body of the heat sink 20 and the power module substrate 10 is cooled to room temperature (25 ° C.) in a state where it is attached to the jig 112, that is, in a state where deformation is caused.
In this case, the joined body of the heat sink 20 and the power module substrate 10 is sandwiched (pressed) in the thickness direction by the pair of pressure plates 110A and 110B of the jig 112, and the joint surface of the heat sink 20 is concave. It is constrained in a state in which a deformation that causes warping occurs. For this reason, in the sandwiched portion, it seems that the shape of the joined body of the heat sink 20 and the power module substrate 10 accompanying the cooling does not seem to change. However, during normal bonding, a convex warp occurs with the circuit layer 12 as the upper side due to a difference in thermal expansion between the power module substrate 10 and the heat sink 20. However, since the sandwiched portion is constrained in a state where it cannot be deformed, plastic deformation occurs against a stress that causes a convex warp.

  The heat sink 20 and the power module sandwiched between the pair of pressure plates 110A and 110B are cooled by holding the laminated body of the heat sink 20 and the power module substrate 10 at a temperature equal to or higher than the temperature at which the brazing material melts for a predetermined time. On the bonding surface with the substrate 10 for soldering, the brazing material can be hardened in a shape along the concave shape, and even after releasing the pressure state in the stacking direction, as shown in FIG. The upper side warps in a concave shape, or even a convex shape reduces the amount of warpage, reducing the warpage that occurs during manufacturing.

On the other hand, the peripheral portion of the heat sink 20 is supported and supported by the receiving portion 101 provided at the peripheral portion of the lower pressure plate 110B during cooling, so that deformation occurs due to thermal expansion and contraction accompanying cooling. This can be prevented. For this reason, the planar state of the peripheral part of the heat sink 20 (plate-like member 21) can be favorably maintained.
In order to prevent the peripheral portion of the plate-shaped member 21 from being deformed by an external load during the heating of the brazing joint, the receiving portion 101 of the plate-shaped member 21 of the heat sink 20 is heated during the heating. It is preferable to set the dimensions so as not to contact the peripheral edge.

  Therefore, in the power module substrate 1 with a heat sink manufactured in this way, warpage occurring when the power module substrate 10 and the heat sink 20 are joined can be reduced, and workability in the element soldering process can be improved. . Moreover, since the peripheral part of the heat sink 20 (plate-like member 21) can be maintained in a flat state, the power module substrate 1 with a heat sink and the structural members of various devices can be attached in close contact and can be held well. it can.

In the first embodiment, the laminated body of the heat sink 20 and the power module substrate 10 is sandwiched by a pair of pressure plates 110A and 110B having curved convex surfaces or concave surfaces. On the other hand, in the peripheral portion of the plate-like member 21 provided to extend from the joint surface between the metal layer 13 and the heat sink 20, a concave warp with the circuit layer 12 side in the stacking direction as an upper side is generated. The planar state is maintained so that no pressing force is applied by the pressure plates 110A and 110B.
On the other hand, as in the manufacturing method of the second embodiment shown in FIG. 4, a receiving surface 101 is provided at the peripheral edge of the lower pressure plate 120B, and a flat surface facing the receiving portion 101 at the peripheral edge of the upper pressure plate 120A. It is also possible to provide a pressing portion 102 having a squeeze, and the deformation of the peripheral portion of the heat sink 20 can be suppressed by the receiving portion 101 and the pressing portion 102.

  In this case, since the lower surface of the peripheral portion of the heat sink 20 is supported and supported by the receiving portion 101 during cooling from the heating temperature during brazing, the peripheral portion of the heat sink 20 is deformed by thermal expansion and contraction. It is possible to prevent deformation toward the lower side. However, if stress due to thermal expansion / contraction continues to be applied during cooling, the lower surface of the peripheral portion of the heat sink 20 is received by the receiving portion 101, and the end of the peripheral portion may be warped upward. is there. In this case, in this embodiment, since the pressing portion 102 is provided, even when the edge of the peripheral portion of the heat sink 20 is warped upward during cooling, the upper surface of the peripheral portion is the pressing portion. Deformation can be suppressed by contacting 102. And since it is supposed that the deformation | transformation of the peripheral part of the heat sink 20 will be suppressed between the receiving part 101 and the holding | suppressing part 102, the dispersion | variation in the deformation amount of the peripheral part of the heat sink 20 in the board | substrate 1 for power modules with several heat sinks is carried out. It can also be suppressed.

In addition, when the brazing between the power module substrate 10 and the heat sink 20 is heated, there is a possibility that the pressure applied to these laminates may not be sufficiently transmitted. It is preferable to set the dimensions so as not to contact the peripheral edge of the 20 plate-like members 21, that is, to set the dimensions so that the lower surface of the peripheral edge and the pressing portion 102 are in contact only during cooling.
For this reason, in the brazing process, the laminated body of the heat sink 20 and the power module substrate 10 is sandwiched (pressed) in the thickness direction by the pair of pressure plates 120A and 120B and heated. The distance between the flat surface and the flat surface of the pressing portion 102 is preferably set slightly larger than the thickness of the plate-like member 21 of the heat sink 20. For example, when the thickness of the plate-like member 21 is 5 mm, the flat surface of the receiving portion 101 and the flat surface of the pressing portion 102 are secured in order to secure a gap with the peripheral portion of the plate-like member 21 during heating. It is desirable to set the interval of about 5.1 mm.
Other configurations are the same as those of the first embodiment, and the same reference numerals are given and description thereof is omitted.

In addition, this invention is not limited to the thing of the structure of the said embodiment, In a detailed structure, it is possible to add a various change in the range which does not deviate from the meaning of this invention.
For example, a method of joining using an active metal brazing material may be employed for brazing a copper circuit layer and a ceramic substrate. For example, an active metal brazing material containing Ti which is an active metal (for example, Ag-27.4 mass% Cu-2.0 mass% Ti) was used to pressurize a laminate of a copper circuit layer and a ceramic substrate. The circuit layer and the ceramic substrate can be joined via the Ag-Cu alloy by heating in a vacuum in the state.

In the above-described embodiment, the heat sink and the power module substrate are bonded using the Al—Si brazing material, but may be bonded using an Al—Si—Mg brazing material. In this case, it is not necessary to perform bonding in a vacuum atmosphere, brazing can be performed in an inert atmosphere such as nitrogen, and the heat sink and the power module substrate can be simply bonded.
Furthermore, the heat sink and the power module substrate can be joined by brazing in an inert atmosphere such as nitrogen using an Al—Si brazing material and a flux.
Moreover, when the material of a heat sink is copper or a copper alloy, it can also join by solid phase diffusion bonding. Solid phase diffusion bonding can be performed in a vacuum atmosphere by holding a load of 0.3 MPa to 10 MPa and a heating temperature of 400 ° C. or more and less than 548 ° C. for 5 minutes to 240 minutes.

Further, the bonding between the ceramic substrate and the circuit layer, the bonding between the ceramic substrate and the metal layer, and the bonding between the metal layer and the heat sink made of aluminum or an aluminum alloy is a transient liquid phase called TLP bonding method (Transient Liquid Phase Diffusion Bonding). You may join by the joining method.
In this transient liquid phase bonding method, the copper layer deposited on the surface of the circuit layer or the metal layer is interposed between the interface of the circuit layer or the metal layer and the ceramic substrate, or the interface of the metal layer and the heat sink. By heating, copper diffuses in the circuit layer or metal layer and aluminum, the copper concentration in the vicinity of the copper layer of the circuit layer or metal layer increases, the melting point decreases, and the bonding interface in the eutectic region of aluminum and copper A metal liquid phase is formed. If the temperature is kept constant in a state in which this metal liquid phase is formed, the metal liquid phase reacts with the ceramic substrate or the heat sink, and copper further diffuses into the aluminum. The copper concentration gradually decreases, the melting point increases, and solidification proceeds with the temperature kept constant. As a result, a strong bond between the circuit layer or metal layer and the ceramic substrate or between the metal layer and the heat sink can be obtained.

DESCRIPTION OF SYMBOLS 1 Power module substrate 10 with heat sink Power module substrate 11 Ceramic substrate 12 Circuit layer 13 Metal layer 20 Heat sink 21 Plate member 22 Pin-shaped fin (fin)
23 Through-hole 30 Electronic component 31 Solder joint layer 40 Cooling box 41 Opening portion 42 Packing accommodating groove 43 Screw hole 50 Packing 100 Power module 101 Receiving portion 102 Pressing portion 110A, 110B, 120A, 120B Pressure plate 110a Convex surface 110b Concave surface 111 Prop 112 Jig 113 Nut 114 Top plate 115 Biasing means

Claims (2)

  A plurality of power module substrates in which a circuit layer is disposed on one surface of a ceramic substrate and a metal layer is disposed on the other surface of the ceramic substrate are disposed on the surface of the central portion excluding the peripheral portion of the plate-like member. A method of manufacturing a power module substrate with a heat sink that is bonded to a fin-integrated heat sink in which the fins are erected, wherein a pair of laminated bodies in which the heat sink is arranged to overlap the metal layer of the power module substrate It has a brazing step of brazing the power module substrate and the heat sink by heating while pressing in the laminating direction sandwiched between pressure plates, and in the brazing step, the pair of pressure plates are: An upper pressure plate having a curved convex surface that presses the surface of the circuit layer, and a curved concave surface that presses the tip of the fin of the heat sink. And a receiving part having a flat surface for receiving the lower surface of the peripheral part of the plate-like member during cooling. Method for manufacturing a power module substrate.   A pressing part having a flat surface facing the flat surface of the receiving part is provided at the peripheral part of the upper pressure plate, and the flat surface of the pressing part is deformed during cooling in the brazing process. 2. The method for manufacturing a power module substrate with a heat sink according to claim 1, wherein the upper surface of the peripheral portion of the plate member is received.

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