JP2013012663A - Heat radiation component and semiconductor module apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent removal of a heat radiation metal member 31 and a circuit metal layer 21 which sandwich a joining surface and the occurence of an opening at an outer peripheral end edge of the joining surface of a ceramic and a heat radiation metal member metal or the circuit metal layer without causing the structural complication and an electric insulation problem in a heat radiation component having the joining structure formed by brazing the heat radiation metal member 31 and the circuit metal layer 21 to front and rear surfaces of a ceramic substrate 11 so as to sandwich the ceramic substrate 11.SOLUTION: A resin sandwiching body 41, sandwiching a ceramic substrate 11 and a heat radiation metal member 31 at an outer peripheral end edge of the joining surface of the two members 14a or an area located near the outer peripheral end edge in the thickness direction, is formed. The resin sandwiching body 41 inhibits the occurence of the removal of members and the like in a heat cycle.

Description

  The present invention relates to a heat radiating component used in a semiconductor module device (power module) and the like, and more specifically, a heat dissipation metal member (metal heat sink) is disposed on one surface of a ceramic substrate, and the other surface. The present invention relates to a heat dissipation component having a joint structure in which circuit metal layers (or metal plates) are brazed to each other, and a semiconductor module device including the heat dissipation component.

  For heat dissipation components used for mounting semiconductor devices and electronic components such as semiconductor module devices (power modules), a metal layer for circuits (or for mounting semiconductor devices) on one surface of a ceramic substrate A metal plate) is formed, and a metal member for heat dissipation (heat sink) for cooling those heating elements is joined to the surface opposite to the metal plate. As a joining means for the metal layer for circuit (or metal plate, hereinafter also referred to as circuit metal layer) and the metal member for heat radiation constituting such a heat radiation component, they are joined to each surface of the ceramic substrate by brazing. (For example, patent document 1 (FIG. 3), patent document 2 (FIG. 4)).

Here, ceramics such as alumina (Al ₂ O ₃ ), ticker aluminum (AlN), and ticker silicon (Si ₃ N ₄ ) are used for the ceramic substrate. On the other hand, materials suitable for thermal conductivity, heat dissipation, and workability are used for the circuit metal layer (or its metal plate) and the heat dissipation metal member. For example, aluminum, copper, or an alloy of these metals is exemplified. In addition, as a heat radiating metal member, a member made of only a metal plate, a member with fins in which a large number of fins (air-cooled or water-cooled fins or irregularities) are erected and formed on a metal substrate part (metal plate) Is used.

JP 2010-27735 A JP 2010-177529 A

  Such a heat radiating component is used to radiate heat generated by the semiconductor device mounted on the circuit metal layer on the ceramic substrate, and therefore is continuously exposed to a heat cycle in which the temperature changes from a low temperature below the freezing point to over 100 ° C. . On the other hand, such a heat radiating component has a joined body structure formed by brazing a ceramic substrate and a metal. For this reason, due to the large difference in the thermal expansion coefficient between these materials, if exposed to such a thermal cycle, peeling occurs at the outer peripheral edge of the joint surface between the ceramic substrate and the metal plate forming the metal member for heat dissipation. Or opening. That is, a minute separation (gap) is generated between the ceramic substrate and the metal plate at the outer peripheral edge of the joint surface (the brazing material layer) of the two members, and this opens as a starting point. May occur. In such a case, the heat transferability is hindered by the amount of peeling and the like, leading to a decrease in heat dissipation, and hence a decrease in performance of the heat dissipation component. Furthermore, the occurrence of such delamination can cause cracks in the ceramic and sometimes cause serious problems. The cause of the occurrence of such peeling and opening is based on the difference in thermal expansion coefficient between materials, and the specific mechanism is considered as follows.

  The thermal expansion coefficient (rate) of the metal member for heat dissipation is orders of magnitude greater than that of ceramic. For this reason, when the heat dissipation component is exposed to a large temperature change, the heat dissipation metal member expands and contracts more than the ceramic. On the other hand, of the metal member for heat dissipation, the joint surface with the ceramic substrate is brazed to the ceramic substrate (fixed integrally), and thus cannot be freely expanded and contracted along the surface. On the other hand, the surface (exposed surface) on the opposite side to the joint surface of the metal member for heat dissipation is not restricted by such brazing, and therefore is relatively along the surface compared to the joint surface side. It expands and contracts greatly.

  For this reason, when the heat radiating component having such a structure is subjected to a large temperature change from high temperature to low temperature, for example, the heat radiating metal member tends to deform as follows. That is, in such a case, both the heat radiating metal member and the ceramic substrate shrink along the joint surface. However, the amount of shrinkage of the heat radiating metal member itself is such that the surface opposite to the joint surface (exposed surface). Shrink greatly. Due to the stress generated for this purpose, the metal member for heat dissipation tends to deform so that the opposite surface (exposed surface) is warped in a concave shape as a whole. Thereby, the effect | action which the edge (outer peripheral edge) of the metal member for heat dissipation tries to float up from a ceramic substrate acts. On the contrary, when a large temperature change is received from the low temperature to the high temperature, the metal member for heat dissipation tends to be deformed on the contrary. As a result of continuing to undergo such a heat cycle, peeling or the like occurs at the outer peripheral edge of the joint surface (the brazing material layer) of both members, and it is considered that it progresses over time. As described above, aluminum or copper alloy is often used for the heat dissipating metal member. However, the thermal expansion coefficient of these metals is much larger than that of ceramics, so these problems are likely to occur. It is done. Such a problem occurs not only between the ceramic substrate and the heat dissipating metal member but also between the bonding surfaces of the ceramic substrate and the circuit metal layer.

  As a means for solving such a problem, for example, a screw (bolt, nut) is used to tighten or press between the ceramic substrate and the heat radiating metal member between the bonding surfaces. It may be possible to hold down structurally. However, in this case, the number of parts increases, the structure becomes complicated, and there are difficulties in ensuring electrical insulation.

  The present invention has been made to solve such problems, and there is no problem of structural complexity and electrical insulation, and the ceramic in the heat dissipation component and the metal member for heat dissipation or the metal layer for circuit (or metal plate). ) In the outer peripheral edge of the joint surface, and the separation of both members sandwiching the joint surface and the generation of openings can be effectively prevented.

The invention according to claim 1 is an arrangement in which a ceramic substrate is sandwiched and a heat dissipation metal member is brazed on one surface and a circuit metal layer or metal plate is brazed on the other surface. In heat dissipation parts,
A resin sandwiched body is formed in which the ceramic substrate and the metal member for heat dissipation are sandwiched with resin in the thickness direction at an outer peripheral edge or a portion near the outer peripheral edge of the joint surface of the two members. Heat dissipation parts.

The invention according to claim 2 has a joining structure in which a ceramic substrate is sandwiched and a metal member for heat dissipation is brazed on one side and a metal layer for circuit or a metal plate is brazed on the other side. In heat dissipation parts,
Resin sandwiching of the ceramic substrate, the metal member for heat dissipation, and the metal layer for circuit or metal plate with resin in the thickness direction at the outer peripheral edge or the peripheral edge portion of the joint surface of the three members A body is formed.

The invention according to claim 3 is characterized in that the resin sandwiched body is formed on the entire periphery along the outer peripheral edge of the ceramic substrate. It is.
According to a fourth aspect of the present invention, the ceramic substrate has a substantially square shape in a plan view, and the resin sandwiched body is formed at a portion including a corner of the square. Or it is a thermal radiation component of 2.
The invention according to claim 5 is characterized in that the resin sandwiched body is formed by injection molding with the heat dissipating part before the resin sandwiched body is formed as an insert. Or a heat dissipating component according to item 1. According to a sixth aspect of the present invention, there is provided a semiconductor module device comprising the heat dissipating component according to any one of the first to fifth aspects.

  In the present invention, since the resin sandwiched body is formed as described above, there is no problem such as complicated structure and electrical insulation, and the two members or the three members are joined by brazing. It is possible to suppress or prevent the peeling or opening of the joint surfaces from occurring at the outer peripheral edges of the surfaces. Therefore, even if a semiconductor device used in a semiconductor module device or the like that continues to be exposed to a thermal cycle with a large temperature change is mounted and used as a heat dissipation component that plays the role of heat dissipation and cooling, its reliability is improved. Can be increased. In addition, the resin sandwiched body is composed of an outer meat portion continuous in the thickness direction of the ceramic substrate on the side portion (outer portion) of the ceramic substrate on which it is formed, and an inner side of the substrate at both end sides in the thickness direction of the outer meat portion. And a sandwiching portion that covers (overlaps) the surface of the mating member to be sandwiched. The thickness (thickness) of the resin in each of these parts provides a strength that can suppress or prevent the occurrence of deformation such as peeling or opening at the joint surface between the ceramic substrate and the thermal metal member. Thus, it may be set according to the material (physical properties) of the resin. Note that according to the semiconductor module device including the heat dissipation component of the present invention, a highly reliable semiconductor module device can be provided in terms of heat dissipation.

  The resin constituting the resin sandwiched body included in the heat dissipation component of the present invention has electrical insulation and has heat resistance, water resistance, and oil resistance for the purpose of the heat dissipation component and the resin sandwich body constituting the heat dissipation component. It is preferable to select a material having excellent durability such as high mechanical strength at a high temperature and a material having a high elastic modulus (high strength, high rigidity). For example, PPS resin (polyphenylene sulfide), PC resin (polycarbonate), PBT resin (polybutylene terephthalate) and the like are exemplified. However, in order to increase the strength, it is preferable to include a reinforcing material such as glass (for example, glass fiber or carbon fiber). In the present invention, “resin” includes those containing such a reinforcing material in the resin. Hereinafter, the term “resin” includes both a material made only of a resin and a material in which a reinforcing material such as a fiber is contained in the resin. In addition, in order to prevent the occurrence of peeling at the outer peripheral edge of the joint surface due to the low temperature drop of the heat dissipating metal member (or circuit metal layer or metal plate), in order to enhance the pinching effect at the low temperature drop, resin It is preferable to use a material having a large thermal expansion coefficient that can provide a large amount of shrinkage, not just the mechanical strength.

  In addition, from the viewpoint of preventing peeling in the entire circumferential direction, the resin sandwiched body is preferably provided (formed) so as to be continuous along the entire circumference along the circumferential direction. There may be, and you may selectively provide in the site | part with high risk of peeling. For example, if the ceramic substrate has a rectangular shape (square or rectangular) in plan view and the diagonal dimension is large, the corners of the ceramic substrate are particularly high in the risk of peeling. It is also possible to provide a resin sandwiched body only in the case.

  In addition, the resin sandwiched body is set by injection molding in a molding die as an insert (or outsert) with the heat dissipating part (work in process; hereinafter simply referred to as heat dissipating part) before being formed. It is preferable to form (mold). The reason is as follows. In the case of insert molding, the resin can be brought into close contact with the heat dissipating part that is the counterpart, and assembly in a separate process is not required. Moreover, it is easy to form an annular shape continuously around the heat dissipating component, and the degree of freedom in forming the resin sandwich is high. Further, due to the shrinkage of the resin in the process from injection molding to cooling and solidification, a clamping force (compression force) is already applied in the thickness direction of the heat dissipation component at room temperature. However, the resin sandwiched body is separately formed as a part, for example, in the shape of a grooved strip having a U-shaped (concave) cross section (transverse cross section). It can also be formed by relatively press-fitting and adhering the side edges of each side (four sides in the case of a square in plan view) so as to enter the recess.

BRIEF DESCRIPTION OF THE DRAWINGS It is the figure which showed the embodiment (Example 1) which actualized the thermal radiation component of this invention, Comprising: The left figure is a partially broken plan view, The right figure is S1-S1 arrow sectional drawing (center) in the left figure Longitudinal section). The S2-S2 arrow sectional view (central transverse sectional view) in the plan view of FIG. 1, and its partial enlarged view. The further enlarged view of the partial enlarged view of FIG. 2, and the enlarged view of the principal part. Explanatory drawing of the process of the example of formation of the resin clamping bodies in the heat radiating component of FIG. Explanatory drawing of the process of another example of formation of the resin clamping bodies in the heat radiating component of FIG. The perspective view of the modification of the heat radiating component of FIG. S4-S4 arrow sectional drawing of FIG. The perspective view of the embodiment (Example 2) which actualized the thermal radiation component of this invention, and its partial part enlarged view. The partially broken top view of FIG. FIG. 10 is a sectional view taken along arrow S5-S5 in FIG. The perspective view of the embodiment (Example 3) which actualized the thermal radiation component of this invention. FIG. 12 is a sectional view taken along arrows S6-S6 in FIG. The figure which showed typically what mounted the semiconductor device on the surface of the metal layer for circuits in the thermal radiation component of FIG. 2, and was set as the semiconductor module apparatus.

  Hereinafter, an embodiment (Example 1) embodying the heat dissipation component of the present invention will be described in detail with reference to FIGS. The heat dissipating component 10 of the present example includes a circuit metal layer (conductive metal layer) bonded to a surface 12 with a ceramic substrate (hereinafter also simply referred to as a substrate) 11 sandwiched in the thickness direction as shown in each drawing. ) 21 and a heat radiating metal member 31 joined to the back surface 13 side. In this example, the ceramic substrate 11 and the heat dissipating metal member 31 are disposed in the thickness direction at the outer peripheral edge 14 of the substrate 11 that is the outer peripheral edge 14a of the joint surface of the ceramic substrate 11 and the outer peripheral edge 14a. And a resin sandwiching body 41 sandwiched with resin. Details are as follows. The ceramic substrate 11 is made of ticker silicon, the metal is made of aluminum, and the resin sandwiching body 41 is made of a glass fiber (40 vol%)-containing resin containing PPS resin as a main component (60 vol%).

  That is, the heat dissipating component 10 of this example is a circuit metal having the same shape in plan view on the surface (on top of FIG. 2 (cross-sectional view)) 12 of a square (or a rectangle close to a square) ceramic substrate 11. A layer (conductive metal layer) 21 is brazed with, for example, an aluminum alloy brazing so that each side of the layer 21 is parallel to each side of the ceramic substrate 11 and concentric with the side. However, the circuit metal layer 21 has a square that is slightly smaller than the ceramic substrate 11, and the surface 12 of the ceramic substrate 11 is exposed at a predetermined (constant) width along each side. . Such exposure of the ceramic is realized, for example, by brazing a metal plate (thin plate) forming the circuit metal layer 21 and then removing the periphery by etching.

  On the other hand, the heat dissipating metal member 31 bonded to the back surface 13 of the ceramic substrate 11 (below FIG. 2 (cross-sectional view)) is located on the back surface 13 side of the ceramic substrate 11 and is bonded to the back surface 13 in this example. The metal substrate portion 33 and the heat radiation fins 35 formed on the side surface opposite to the ceramic substrate 11 in the metal substrate portion 33. Note that an aluminum alloy braze is also used for brazing the back surface 13 of the ceramic substrate 11 and the metal substrate portion 33 of the metal member 31 for heat dissipation. Note that a brazing material layer exists between the front surface 12 and the back surface 13 of the ceramic substrate 11 and the mating member, but this brazing material layer is not shown.

  In this example, the metal substrate portion 33 forming the heat radiating metal member 31 is slightly larger than the ceramic substrate 11 and has the same shape in plan view, and each side is parallel to each side around the ceramic substrate 11. And it is brazed concentrically with it. However, the metal substrate portion 33 is brazed so that the outer peripheral edge 34 along each side has a predetermined width and protrudes outward from the outer peripheral edge 14 of the ceramic substrate 11. Note that the fins 35 may be formed by a cutting and raising method in which a metal plate is brazed to the back surface of the ceramic substrate 11, and then a blade is obliquely inserted into the surface of the metal plate and cut up. For brazing, a brazing material is placed between the joining surfaces of both of the objects to be joined, these three members are positioned and stacked, and a weight is placed so that an appropriate surface pressure (for example, 0.2 MPa) is applied. It is performed by heating and melting to a temperature and cooling.

  As described above, the heat dissipating component 10 of this example has a three-layer structure having the circuit metal layer 21 and the heat dissipating metal member 31 on the front and back surfaces (upper and lower surfaces) 12 and 13 of the ceramic substrate 11. have. In this example, the outer peripheral edge 14a of the joining surface of the ceramic substrate 11 and both members of the metal substrate portion 33 of the heat radiating metal member 31 are surrounded by the entire periphery (entire circumference) so as to surround the four sides. Alternatively, a resin sandwiching body 41 that is sandwiched with resin in the thickness direction is formed near the outer peripheral edge. The resin sandwiching body 41 has a rectangular frame shape with a predetermined width in a plan view, and has a rectangular cross section as shown in the state in which the outer peripheral edges 14 and 34 of both members are sandwiched in the cross section. ing. That is, as shown in the cross section, the resin sandwiching body 41 includes the outer meat portion 43 that is continuous in the thickness direction and the outer side thereof in the portion near the outer peripheral edge of the ceramic substrate 11 and the metal substrate portion 33 on which the resin sandwiched body 41 is formed. There are sandwiching portions 45, 47 that extend inside the substrate 11 at both ends in the thickness direction of the meat portion 43 and cover (overlap) the surfaces of the mating member to be sandwiched.

  The sandwiching portions 45 and 47 of the resin sandwiching body 41 are sandwiched in the thickness direction with predetermined widths W1 and W2, respectively, at the outer peripheral edge 14 of the ceramic substrate 11 or near the outer peripheral edge. Yes. That is, in this example, as shown in the enlarged views in FIGS. 2 and 3, the portions near the outer peripheral edges (side surfaces) 14 and 34 of both members are sandwiched by the sandwiching portions 45 and 47 of the resin sandwiching body 41. It is formed so as to be sandwiched and in close contact with the surrounding surfaces. However, the height of the resin sandwiched body 41 in the thickness direction of the substrate 11 is such that the upper end surface 44a on the circuit metal layer 21 side is substantially flush with the upper surface of the circuit metal layer 21. Moreover, the lower end surface 44b which makes the metal member 31 for heat dissipation has a height which protrudes from the front-end | tip 37 of the fin 35, and both the upper end surface 44a and the lower end surface 44b have the same height in the perimeter of a square frame. Presents. For this reason, in this example, the thicknesses W1 and W2 of the sandwiching portions 45 and 47 are thicker on the side in close contact with the heat dissipating metal member 31 than on the side in close contact with the ceramic substrate 11 (W2 > W1). These thicknesses and the thickness of the outer flesh portion 43 are appropriately set according to the strength of the resin so that the strength capable of preventing the occurrence of peeling at the outer peripheral edge of the joint surface of these two members can be obtained or increased. What is necessary is just thickness. In this example, since the height in the thickness direction of the lower sandwiching portion 47 is a height protruding from the tip of the fin 35, the lower surface thereof, that is, the lower end surface 44b of the square frame in the resin sandwiching body 41 is separately provided. By attaching a resin plate (not shown) by bonding or the like, the fins 35 are enclosed in the rectangular frame portion, and a cooling fluid (for example, water) is provided in the interior thereof, thereby providing a cooling channel (refrigerant passage). A flow path) can be formed.

  In such a heat radiating component 10, Ni and Au plating is formed on the circuit metal layer 21, and an electronic component such as a semiconductor device is mounted by being brazed and assembled. Used below. At this time, according to the heat dissipating component 10 of this example, the ceramic substrate 11 and the metal substrate portion 33 in the heat dissipating metal member 31 are arranged at the outer peripheral edge 14a of the joint surface of both members or a portion near the outer peripheral edge. A sandwiching body 41 sandwiched with resin in the thickness direction is provided in a square frame shape along the periphery of the substrate 11. For this reason, even if an attempt is made to cause a deformation such as peeling or opening at the outer peripheral edge of the joint surface of the two members 11 and 31 based on the large difference between the thermal expansion coefficients of the two members, this is not suppressed. Is prevented. That is, in the heat radiating component that does not include the resin sandwiching body 41 of the present example as in the conventional heat radiating component, the brazed ceramic substrate 11 and the heat radiating metal member 31 are the outer periphery of the joint surface. In particular, due to the large difference in thermal expansion coefficient between the two at the edge, peeling and opening of both members tended to occur under a thermal cycle, whereas this occurrence was suppressed or prevented. The

  In addition, in this example, the ceramic substrate 11 and the metal substrate portion 33 in the heat radiating metal member 31 are sandwiched by the resin sandwiching body 41 on the entire circumference. Therefore, the occurrence of such peeling or the like is prevented at any position on the entire circumference. Moreover, in this example, a PPS resin (polyphenylene sulfide) in which glass fibers are mixed in the resin constituting the resin sandwiched body 41 is used. Since this resin has high mechanical strength at a high temperature and a large elastic coefficient, in this example, it can be a heat dissipation module suitable for a power module that is extremely effective in preventing the occurrence of peeling and the like. Note that the heat dissipating metal member 31 undergoes greater thermal expansion and contraction than the ceramic substrate, and at a low temperature, the side opposite to the brazing surface side is greatly contracted, resulting in a stress state that warps so that the edge is bent. Therefore, peeling or the like is likely to be induced at the edge, so that the resin has a large coefficient of thermal expansion and can contract more than the metal member 31 for heat dissipation in a low temperature change, thereby increasing the pinching force. For this reason, it is preferable to use a high-strength, high-rigidity material having a large thermal expansion coefficient and contracting greatly at low temperatures as the resin constituting the resin sandwiching body 41.

  In addition, formation of the resin sandwiched body 41 in the above-described heat radiating component 10 is performed by, for example, using a brazed joined body (a heat dissipating component work-in-process) that does not include the resin sandwiched body 41 as an insert part. It is preferable to manufacture by injection molding so as to be integrated. That is, using a mold for injection molding as shown in FIG. 4, a brazed joined body 10a not provided with a resin sandwiching body 41 is formed as shown in FIG. The mold is placed as an insert in the mold 100, and the upper mold 120 is closed. Then, as shown in FIG. 4-B, a raw material resin (in this example, a glass fiber-containing PPS resin) is formed against a cavity (vacant space) 140 corresponding to the resin sandwich body 41 formed by closing the mold. ) Is molded. Thus, after the cooling and solidification, the mold is opened and the molded body is taken out, whereby the heat radiating component 10 in which the resin sandwiching body 41 is integrally formed is obtained. When inserting and injection molding in this way, it is possible to easily obtain the heat radiating component 10 in which the resin sandwiched body 41 is closely and closely molded.

  The formation of the resin sandwiched body 41 in the heat radiating component 10 is not limited to injection molding, but it can be separately manufactured and assembled. For example, as shown in FIG. 5, the resin sandwiched body 41 as in the above example is cut separately in the diagonal direction of the ceramic substrate 11, and is separately manufactured as four resin-made trapezoidal products 41a to 41a. The groove 41b on the inner side of the ceramic substrate 11 and the outer peripheral edge 14, 34 of the metal substrate part 33 of the metal member 31 for heat dissipation are mutually connected to the side of the brazed assembly 10a. Press-fit so as to be press-fit, or press-fit so as to be press-fit to each other via an adhesive (insulating adhesive such as resin), and thereafter, if necessary, between the inclined end surfaces 41t of the trapezoidal shaped product 41a The gap may be fixed with an adhesive or the like.

  In the above example, the resin sandwiched body 41 has a square frame shape in plan view, and the height of the square frame portion in the resin sandwiched body 41 is such that the upper end surface 44a on the circuit metal layer 21 side is The lower end surface 44b which is substantially flush with the upper surface of the circuit metal layer 21 and which is on the side of the heat dissipating metal member 31 protrudes from the tip of the fin 35, and has a plane which circulates at the same height on the entire circumference. It has a square frame shape. However, as in the heat dissipating component 210 of the modification shown in FIG. 6 and FIG. That is, the opening part 48 may be formed by notching a part of the rectangular frame portion facing the gap between the fins 35, and the notch opening part 48 may be used as a gate for entering and exiting the cooling fluid. If it does in this way, it arrange | positions so that this several heat radiating components 210 may be arranged in series so that this gate may continue, and the lower end surface 44b which is the front end side of the fin 35 is shown with a dashed-two dotted line in the figure. As described above, by closing the plate 60 with the plate 60, a flow path capable of obtaining efficient cooling can be easily formed. The heat radiating component 210 shown in FIGS. 6 and 7 is different from the heat radiating component 10 only in that it has an opening portion 48 provided by cutting out the resin sandwiched body 41. Are given the same reference numerals.

  In each of the above examples, the ceramic substrate 11 and the metal substrate portion 33 of the heat dissipation metal member 31 are illustrated as being sandwiched by the resin sandwiching body 41 along the entire circumference of both members. Depending on the heat dissipating component, it is not always necessary to continuously pinch the entire periphery. When the risk of occurrence of peeling or the like is small, it may be configured to be sandwiched discontinuously.

  Next, the heat radiating component 310 of the second embodiment configured to be sandwiched in this manner will be described with reference to FIGS. However, this is different from the first embodiment only in that the resin sandwiched body 41 is configured so as to sandwich both the members 11 and 31 discontinuously, and there is no essential difference. Only the differences will be described, and the same parts are designated by the same reference numerals.

  In each of the above examples, both the ceramic substrate 11 and the metal substrate portion 33 of the heat radiating metal member 31 are configured to be sandwiched by the resin sandwiching body 41 in the entire periphery (entire circumference). In this example, this resin sandwiched body 41 is composed of the ceramic substrate 11 and the metal substrate portion 33 of the metal member 31 for heat dissipation, the corner 19 of the ceramic substrate 11 and the four corners of the mating joint member. It is made to pinch | interpose with the resin (corner part) 41c in the site | part (corner site | part) containing. That is, among the resin corner portions 41c, the ceramic substrate 11 and the portion on the side of the circuit metal layer 21 brazed to the surface thereof are notched compared to the above examples, and the bottom surface 49a is flat and recessed. A recessed portion 49 is formed, and the portion of the recessed portion 49 does not sandwich the ceramic substrate 11 and the metal substrate portion 33 of the heat dissipating metal member 31. In this example, the bottom surface 49 a of the recess 49 is set to be flush with the back surface 13 of the ceramic substrate 11. Therefore, the recess 49 is formed from the back surface of the ceramic substrate 11 to the 13 circuit metal layer 21. Open to the side.

  Thus, in this example, the part including the four corners around the ceramic substrate 11 and the metal substrate part 33 of the metal member 31 for heat dissipation includes the four corners of the resin sandwiched body 41. It is sandwiched by the resin corner portion 41c. Such an example is effective in a heat radiating component that is likely to cause peeling or the like of the brazed joint surface at the corner of the ceramic substrate 11 or to be concentrated. This is because, according to such a resin sandwiching body 41, the weight of the resin can be reduced as much as the amount of resin is reduced. In addition, when discontinuously sandwiching with the resin sandwiching body 41, although not shown, it is formed so as to be sandwiched at a portion other than the corner portion of the ceramic substrate 11 (for example, an appropriate portion between the corners). Also good.

  In each of the above examples, the heat dissipating metal member 31 is embodied with the fins 35. However, in the present invention, the heat dissipating metal member (heat sink) 31 and the ceramic substrate 11 are brazed regardless of the presence or absence of the fins 35. In joining, the two members can be embodied to form a resin sandwiched body in which the two members are sandwiched with resin in the thickness direction at the outer peripheral edge or near the outer peripheral edge of the joint surface of the two members. Furthermore, the present invention is not limited to the joining of the heat dissipating metal member 31 and the ceramic substrate 11, but the circuit metal layer (or mounting of a semiconductor device or the like) is provided on the opposite surface of the ceramic substrate 11 where the heat dissipating metal member 31 is joined. In the three-layer joined body to which the metal plate 21) is joined, a resin sandwiched body in which the three members are sandwiched with resin in the thickness direction at the outer peripheral edge or the portion near the outer peripheral edge of the joint surface. It can also be embodied as a product formed by forming.

  11 and 12 show an embodiment (third embodiment) in which the heat dissipating component 410 having such a configuration is embodied. Since this is essentially the same as the above examples, only the differences will be described, and the same reference numerals will be given to the same parts. That is, in this heat dissipation component 410, the heat dissipating metal member 31 is brazed on one surface and the circuit metal layer (or metal plate) 21 is brazed on the other surface, with the ceramic substrate 11 sandwiched therebetween. It has the joining structure which becomes. This point is the same as that in each of the above examples in that it has a three-layer assembly. However, the present example is different only in that the heat dissipating metal member 31 is of a flat plate shape composed only of a metal substrate portion having no fins. On the other hand, the resin sandwiched body 41 is a resin sandwiched body 41 in which these three members are sandwiched with resin in the thickness direction at the outer peripheral edge 14a, 24a of the joint surface of the three members or at a portion near the outer peripheral edge. Is formed and sandwiched. That is, the resin sandwiching body 41 covers the portion near the outer peripheral edge 24 of the circuit metal layer (or metal plate) 21 with a predetermined width W3 on the exposed surface side of the circuit metal layer (or metal plate) 21. In addition, on the exposed surface side of the metal member 31 for heat radiation on the opposite side, it is formed so as to have sandwiching portions 45 and 47 so as to cover the portion near the outer peripheral edge 34 with a predetermined width W2, respectively. It is formed in a sandwiched form. In this example, W3 <W2.

  In this case, the ceramic is not exposed due to the structure of the resin sandwiching body 41. Also, in this heat radiating component 410, when the occurrence of peeling of the brazed joint surface is likely to occur intensively at the corner of the ceramic substrate 11, the resin so as to sandwich only the corner as described above. A sandwiched body may be formed. In addition, even in this case, even if the metal member 31 for heat dissipation has a fin, it can be similarly embodied.

  In addition, it can be set as the semiconductor module apparatus which comprises a heat radiating component by mounting a semiconductor device in the heat radiating component shown in each said example. FIG. 13 is a schematic view of the semiconductor module device 500 shown in FIG. 2 of the first embodiment in which a semiconductor device 50 such as a semiconductor chip is mounted (mounted) on the surface of the circuit metal layer 21 in the heat dissipation component 10. It is shown in. In the drawing, a plate 60 is attached and closed on the tip side of the fin 35, and cooling pipes (for example, water) in and out of the sandwiching body 47 on the left and right sides of the sandwiching section 47 are provided. The attached state is shown. According to such a semiconductor module device, it is possible to provide a highly reliable semiconductor module device in terms of heat dissipation.

In the heat dissipating component shown in each of the above examples, the ceramic substrate 11 is exemplified by using ticker silicon (SiN), but the ceramic applicable to the heat dissipating component of the present invention is not limited to these, and alumina It is obvious that (Al ₂ O ₃ ), ticker aluminum (AlN), or other ceramics may be used. Further, the metal forming the heat radiation metal member 31 or the circuit metal layer (or metal plate) brazed to the ceramic substrate 11 is not limited to Al or Cu. Furthermore, the resin constituting the resin sandwiched body has a high heat resistance (mechanical strength at high temperature) and can be used by selecting an appropriate one from those having a large elastic modulus (high strength, high rigidity material). As described above. Further, as described above, the specific shape and structure of the resin sandwiched body and the molding method are not limited to those described above. The resin constituting the resin sandwiching means is a means for sandwiching and joining the ceramic substrate and the metal member for heat dissipation, or the resin constituting the resin sandwiching body is the ceramic substrate, the metal member for heat dissipation, and the circuit metal. The means for sandwiching and joining the three members of the layers or metal plates may be any conventionally known means.

10, 210, 310, 410 Heat-dissipating component 11 Ceramic substrate 12, 13 Surface 14 of ceramic substrate Outer peripheral edge 14a, 24a of ceramic substrate Outer peripheral edge 19 of bonding surface Ceramic substrate corner 21 Circuit metal layer 31 Metal member for heat dissipation 41 Plastic sandwich

Claims (6)

In a heat dissipating component having a joining structure in which a heat dissipating metal member is brazed on one surface and a circuit metal layer or metal plate is brazed on the other surface in an arrangement sandwiching a ceramic substrate
A resin sandwiched body is formed in which the ceramic substrate and the metal member for heat dissipation are sandwiched with resin in the thickness direction at an outer peripheral edge or a portion near the outer peripheral edge of the joint surface of the two members. Heat dissipation parts. In a heat dissipating component having a joining structure in which a heat dissipating metal member is brazed on one surface and a circuit metal layer or metal plate is brazed on the other surface in an arrangement sandwiching a ceramic substrate
Resin sandwiching of the ceramic substrate, the metal member for heat dissipation, and the metal layer for circuit or metal plate with resin in the thickness direction at the outer peripheral edge or the peripheral edge portion of the joint surface of the three members A heat dissipating component characterized in that a body is formed.   The heat-radiating component according to claim 1, wherein the resin sandwiched body is formed along the entire outer peripheral edge of the ceramic substrate.   The heat dissipation component according to claim 1 or 2, wherein the ceramic substrate has a substantially square shape in a plan view, and the resin sandwiched body is formed at a portion including a corner of the rectangle.   The heat radiating component according to any one of claims 1 to 4, wherein the resin sandwiched body is formed by injection molding with a heat radiating component before forming the resin sandwiched body as an insert.   A semiconductor module device comprising the heat dissipating component according to claim 1.

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