JP6206671B2 - レーザ発振冷却装置 - Google Patents

レーザ発振冷却装置 Download PDF

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Publication number
JP6206671B2
JP6206671B2 JP2014058886A JP2014058886A JP6206671B2 JP 6206671 B2 JP6206671 B2 JP 6206671B2 JP 2014058886 A JP2014058886 A JP 2014058886A JP 2014058886 A JP2014058886 A JP 2014058886A JP 6206671 B2 JP6206671 B2 JP 6206671B2
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Japan
Prior art keywords
cryogenic liquid
storage tank
liquid
cryostat
pressure
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JP2014058886A
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English (en)
Japanese (ja)
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JP2015185601A (ja
JP2015185601A5 (enExample
Inventor
笠原　二郎
二郎 笠原
近藤　喜之
喜之 近藤
石井　伸也
伸也 石井
浩一 濱本
浩一 濱本
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Mitsubishi Heavy Industries Ltd
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Mitsubishi Heavy Industries Ltd
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Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP2014058886A priority Critical patent/JP6206671B2/ja
Priority to PCT/JP2015/055612 priority patent/WO2015141430A1/ja
Priority to US15/103,113 priority patent/US9825418B2/en
Priority to EP15765048.2A priority patent/EP3067999B1/en
Publication of JP2015185601A publication Critical patent/JP2015185601A/ja
Publication of JP2015185601A5 publication Critical patent/JP2015185601A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0407—Liquid cooling, e.g. by water
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/042—Arrangements for thermal management for solid state lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lasers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2014058886A 2014-03-20 2014-03-20 レーザ発振冷却装置 Active JP6206671B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014058886A JP6206671B2 (ja) 2014-03-20 2014-03-20 レーザ発振冷却装置
PCT/JP2015/055612 WO2015141430A1 (ja) 2014-03-20 2015-02-26 レーザ発振冷却装置
US15/103,113 US9825418B2 (en) 2014-03-20 2015-02-26 Laser-oscillation cooling device
EP15765048.2A EP3067999B1 (en) 2014-03-20 2015-02-26 Laser-oscillation cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014058886A JP6206671B2 (ja) 2014-03-20 2014-03-20 レーザ発振冷却装置

Publications (3)

Publication Number Publication Date
JP2015185601A JP2015185601A (ja) 2015-10-22
JP2015185601A5 JP2015185601A5 (enExample) 2016-10-06
JP6206671B2 true JP6206671B2 (ja) 2017-10-04

Family

ID=54144406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014058886A Active JP6206671B2 (ja) 2014-03-20 2014-03-20 レーザ発振冷却装置

Country Status (4)

Country Link
US (1) US9825418B2 (enExample)
EP (1) EP3067999B1 (enExample)
JP (1) JP6206671B2 (enExample)
WO (1) WO2015141430A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021044575A1 (enExample) * 2019-09-05 2021-03-11
US11919170B2 (en) * 2019-12-13 2024-03-05 Edda Technology, Inc. Fast method for robot path planning with obstacle avoidance
CN119362118B (zh) * 2024-12-23 2025-03-11 厦门纽立特电子科技有限公司 一种端泵多程板条激光放大器
CN120730705A (zh) * 2025-08-25 2025-09-30 浪潮电子信息产业股份有限公司 一种服务器机柜、服务器和服务器控制方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61501588A (ja) 1983-07-22 1986-07-31 オ−ストラリア国 キャビティ用冷却
FR2690286A1 (fr) * 1992-04-17 1993-10-22 Commissariat Energie Atomique Cavité laser à hétérostructure semi-conductrice dissymétrique et laser équipé de cette cavité.
JPH0668725A (ja) 1992-08-18 1994-03-11 Mitsubishi Electric Corp 超電導合金線材の製造方法
DE4437489C1 (de) * 1994-10-20 1996-03-28 Zeiss Carl Fa Kühlvorrichtung für einen impulsförmig angeregten Laser und Verfahren zum Betrieb einer derartigen Kühlvorrichtung
JP2961072B2 (ja) * 1995-06-23 1999-10-12 株式会社神戸製鋼所 酸素窒素液化装置
JP3067686B2 (ja) * 1997-04-21 2000-07-17 日本電気株式会社 固体レーザ装置
US6195372B1 (en) * 1997-08-19 2001-02-27 David C. Brown Cryogenically-cooled solid-state lasers
JP2002246522A (ja) 2001-02-21 2002-08-30 Mitsubishi Heavy Ind Ltd 固体レーザーの冷却装置、及び、ヒートシンク
JP3951782B2 (ja) 2002-04-17 2007-08-01 三菱電機株式会社 半導体レーザ励起固体レーザ増幅装置、半導体レーザ励起固体レーザ装置、および半導体レーザ励起固体レーザ増幅装置における半導体レーザの冷却方法
JP4627445B2 (ja) * 2005-02-23 2011-02-09 浜松ホトニクス株式会社 レーザ増幅装置
JP2008027780A (ja) * 2006-07-21 2008-02-07 Sumitomo Electric Ind Ltd 液冷媒循環冷却システム
JP2010135704A (ja) * 2008-12-08 2010-06-17 Mitsubishi Electric Corp 半導体レーザパッケージの冷却システム
US8509281B2 (en) * 2010-02-11 2013-08-13 The Boeing Company Disk laser
US20120113513A1 (en) * 2010-10-22 2012-05-10 The Regents Of The University Of Colorado, A Body Corporate Self-cleaning of optical surfaces in low-pressure reactive gas environments in advanced optical systems
US9209598B1 (en) * 2011-12-14 2015-12-08 Colorado State University Research Foundation Cooling system for high average power laser
JP5837523B2 (ja) * 2012-03-27 2015-12-24 富士フイルム株式会社 冷却システム、リザーバユニットおよびカートリッジ並びにそれらを備えた固体レーザ発振装置
JP2013228574A (ja) * 2012-04-26 2013-11-07 Seiko Epson Corp 位相差板、及び電子機器

Also Published As

Publication number Publication date
JP2015185601A (ja) 2015-10-22
EP3067999A1 (en) 2016-09-14
US9825418B2 (en) 2017-11-21
EP3067999A4 (en) 2017-02-01
WO2015141430A1 (ja) 2015-09-24
EP3067999B1 (en) 2021-04-14
US20160308326A1 (en) 2016-10-20

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