JP6202905B2 - 回路基板およびその製造方法 - Google Patents
回路基板およびその製造方法 Download PDFInfo
- Publication number
- JP6202905B2 JP6202905B2 JP2013134691A JP2013134691A JP6202905B2 JP 6202905 B2 JP6202905 B2 JP 6202905B2 JP 2013134691 A JP2013134691 A JP 2013134691A JP 2013134691 A JP2013134691 A JP 2013134691A JP 6202905 B2 JP6202905 B2 JP 6202905B2
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- Prior art keywords
- copper foil
- liquid crystal
- circuit board
- crystal polymer
- polymer film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013134691A JP6202905B2 (ja) | 2013-06-27 | 2013-06-27 | 回路基板およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013134691A JP6202905B2 (ja) | 2013-06-27 | 2013-06-27 | 回路基板およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015012055A JP2015012055A (ja) | 2015-01-19 |
| JP2015012055A5 JP2015012055A5 (enExample) | 2016-02-25 |
| JP6202905B2 true JP6202905B2 (ja) | 2017-09-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013134691A Expired - Fee Related JP6202905B2 (ja) | 2013-06-27 | 2013-06-27 | 回路基板およびその製造方法 |
Country Status (1)
| Country | Link |
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| JP (1) | JP6202905B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220052860A (ko) | 2019-08-29 | 2022-04-28 | 도요 고한 가부시키가이샤 | 동장 적층체 및 그 제조 방법 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6929555B2 (ja) * | 2018-10-18 | 2021-09-01 | 共同技研化学株式会社 | 金属張積層板の製造方法 |
| US12402253B2 (en) | 2020-08-07 | 2025-08-26 | Toyo Kohan Co., Ltd. | Copper clad laminate and method for producing the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4471795B2 (ja) * | 2004-09-21 | 2010-06-02 | 古河電気工業株式会社 | 電解銅箔の製造方法およびプリント配線板 |
| JP2008127618A (ja) * | 2006-11-20 | 2008-06-05 | Furukawa Circuit Foil Kk | 交流給電による銅箔の表面処理方法 |
| JP2011016962A (ja) * | 2009-07-10 | 2011-01-27 | Sekisui Chem Co Ltd | 熱伝導性樹脂組成物及び電子回路用基板 |
| JP2011216598A (ja) * | 2010-03-31 | 2011-10-27 | Kuraray Co Ltd | 高周波回路基板 |
| KR101913368B1 (ko) * | 2010-08-12 | 2018-10-30 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 금속장 적층판 |
-
2013
- 2013-06-27 JP JP2013134691A patent/JP6202905B2/ja not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220052860A (ko) | 2019-08-29 | 2022-04-28 | 도요 고한 가부시키가이샤 | 동장 적층체 및 그 제조 방법 |
| KR20250111385A (ko) | 2019-08-29 | 2025-07-22 | 도요 고한 가부시키가이샤 | 동장 적층체 및 그 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015012055A (ja) | 2015-01-19 |
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