JP6198312B2 - ３次元測定装置、３次元測定方法および基板の製造方法 - Google Patents

３次元測定装置、３次元測定方法および基板の製造方法 Download PDF

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JP6198312B2
JP6198312B2 JP2013205182A JP2013205182A JP6198312B2 JP 6198312 B2 JP6198312 B2 JP 6198312B2 JP 2013205182 A JP2013205182 A JP 2013205182A JP 2013205182 A JP2013205182 A JP 2013205182A JP 6198312 B2 JP6198312 B2 JP 6198312B2
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measurement
height
unit
measurement object
dimensional shape
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Japanese (ja)
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JP2015068779A (ja
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崇正 杉浦
崇正 杉浦
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Ｊｕｋｉオートメーションシステムズ株式会社
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Priority to JP2013205182A priority Critical patent/JP6198312B2/ja
Priority to KR1020140124912A priority patent/KR102224699B1/ko
Priority to TW103132648A priority patent/TWI661176B/zh
Priority to CN201410520476.8A priority patent/CN104515477B/zh
Publication of JP2015068779A publication Critical patent/JP2015068779A/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2504—Calibration devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/04—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness specially adapted for measuring length or width of objects while moving
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B30/00—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images
    • G02B30/50—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images the image being built up from image elements distributed over a 3D volume, e.g. voxels

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Analysis (AREA)
JP2013205182A 2013-09-30 2013-09-30 ３次元測定装置、３次元測定方法および基板の製造方法 Active JP6198312B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013205182A JP6198312B2 (ja) 2013-09-30 2013-09-30 ３次元測定装置、３次元測定方法および基板の製造方法
KR1020140124912A KR102224699B1 (ko) 2013-09-30 2014-09-19 3차원 측정 장치, 3차원 측정 방법 및 기판의 제조 방법
TW103132648A TWI661176B (zh) 2013-09-30 2014-09-22 三次元測定裝置、三次元測定方法及基板之製造方法
CN201410520476.8A CN104515477B (zh) 2013-09-30 2014-09-30 三维测定装置、三维测定方法以及基板的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013205182A JP6198312B2 (ja) 2013-09-30 2013-09-30 ３次元測定装置、３次元測定方法および基板の製造方法

Publications (2)

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JP2015068779A JP2015068779A (ja) 2015-04-13
JP6198312B2 true JP6198312B2 (ja) 2017-09-20

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JP2013205182A Active JP6198312B2 (ja) 2013-09-30 2013-09-30 ３次元測定装置、３次元測定方法および基板の製造方法

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JP (1) JP6198312B2 (zh)
KR (1) KR102224699B1 (zh)
CN (1) CN104515477B (zh)
TW (1) TWI661176B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6682809B2 (ja) * 2015-11-09 2020-04-15 大日本印刷株式会社 検査システムおよび検査方法
CN111434202B (zh) * 2017-12-07 2021-06-22 雅马哈发动机株式会社 被安装物作业装置
JP7118776B2 (ja) * 2018-06-29 2022-08-16 キヤノン株式会社 撮像装置、画像処理方法、画像処理プログラムおよび記録媒体
JP7246943B2 (ja) * 2019-01-24 2023-03-28 キヤノン株式会社 画像処理方法、画像処理装置、画像処理システム、撮像装置、プログラム、および、記憶媒体
WO2022244367A1 (ja) * 2021-05-21 2022-11-24 株式会社 レイマック 非接触血管解析方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10267628A (ja) * 1997-01-23 1998-10-09 Hitachi Ltd ３次元形状検出方法およびその装置並びに基板の製造方法
US7019826B2 (en) * 2003-03-20 2006-03-28 Agilent Technologies, Inc. Optical inspection system, apparatus and method for reconstructing three-dimensional images for printed circuit board and electronics manufacturing inspection
WO2006100077A1 (de) * 2005-03-24 2006-09-28 OBE OHNMACHT & BAUMGäRTNER GMBH & CO. KG Vorrichtung zur optischen formerfassung von gegenständen und oberflächen
CN100460807C (zh) * 2005-06-17 2009-02-11 欧姆龙株式会社 进行三维计测的图像处理装置及图像处理方法
JP2007114071A (ja) * 2005-10-20 2007-05-10 Omron Corp 三次元形状計測装置、プログラム、コンピュータ読み取り可能な記録媒体、及び三次元形状計測方法
JP5159594B2 (ja) * 2008-12-24 2013-03-06 キヤノン株式会社 画像形成装置
JP4744610B2 (ja) * 2009-01-20 2011-08-10 シーケーディ株式会社 三次元計測装置
JP5251678B2 (ja) * 2009-03-31 2013-07-31 ソニー株式会社 外観検査用照明装置および外観検査装置
JP5170154B2 (ja) * 2010-04-26 2013-03-27 オムロン株式会社 形状計測装置およびキャリブレーション方法
JP5482411B2 (ja) * 2010-04-30 2014-05-07 ソニー株式会社 立体形状測定装置、検査装置及び立体形状測定用調整方法
JP5721072B2 (ja) * 2011-03-31 2015-05-20 Ｊｕｋｉオートメーションシステムズ株式会社 部品実装装置、情報処理装置、位置検出方法及び基板製造方法
JP2013186100A (ja) * 2012-03-12 2013-09-19 Hitachi Ltd 形状検査方法およびその装置
JP6124237B2 (ja) * 2012-01-31 2017-05-10 Ｊｕｋｉオートメーションシステムズ株式会社 検査装置、検査方法及び基板の製造方法
JP5955574B2 (ja) * 2012-02-03 2016-07-20 株式会社東光高岳 立体形状計測装置
JP5984284B2 (ja) * 2012-02-28 2016-09-06 Ｊｕｋｉオートメーションシステムズ株式会社 部品実装装置及び基板の製造方法

Also Published As

Publication number Publication date
CN104515477B (zh) 2019-03-08
TW201520511A (zh) 2015-06-01
CN104515477A (zh) 2015-04-15
JP2015068779A (ja) 2015-04-13
KR20150037545A (ko) 2015-04-08
TWI661176B (zh) 2019-06-01
KR102224699B1 (ko) 2021-03-05

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