JP6194155B2 - RESIN COMPOSITION FOR REFLECTOR, RESIN FRAME FOR REFLECTOR, REFLECTOR, SEMICONDUCTOR LIGHT EMITTING DEVICE, AND MOLDING METHOD - Google Patents

Description

  The present invention relates to a resin composition for reflectors, a resin frame for reflectors, a reflector, a semiconductor light emitting device, and a molding method using the resin composition for reflectors.

  An LED element, which is one of semiconductor light emitting devices, is widely used as a light source for an indicator lamp or the like because it is small and has a long lifetime and is excellent in power saving. In recent years, LED elements with higher brightness have been manufactured at a relatively low cost, and therefore, use as a light source to replace fluorescent lamps and incandescent bulbs has been studied. When applying to such a light source, in order to obtain a large illuminance, a plurality of LED elements are arranged on a surface-mounted LED package, that is, a metal substrate (LED mounting substrate) such as aluminum, and each LED element. A system is often used in which a reflector (reflector) that reflects light in a predetermined direction is disposed around the.

  However, since the LED element generates heat during light emission, in such a type of LED lighting device, the reflector deteriorates due to the temperature rise during light emission of the LED element or direct light from the LED element, and the reflectance decreases. As a result, the luminance is lowered, and the life of the LED element is shortened. Therefore, the reflector is required to have heat resistance and light resistance.

In order to meet the above requirements for heat resistance and light resistance, Patent Document 1 proposes a polymer composition used for a reflector of a light emitting diode, specifically, polyphthalamide, carbon black, titanium dioxide, glass fiber, and oxidation. Disclosed is a polymer composition comprising an inhibitor. And the reflectance after heat aging is measured about the said composition, Compared with the polymer composition which does not contain carbon black, the favorable reflectance is obtained with the said composition, and it has shown that there is also little yellowing.
Patent Document 2 discloses a polymer composition containing a triazine derivative epoxy resin, alumina, and spherical silica particles. It shows that good reflectance is obtained and yellowing is small.

JP-T-2006-503160 JP 2009-149845 A

However, the heat aging test of the polymer composition described in Patent Document 1 is an evaluation in 170 hours at a short time of 3 hours, and a good result can be obtained by changing the reflectance under a longer practical condition. Whether it is unknown.
The heat aging test of the polymer composition described in Patent Document 2 has been verified under a more practical condition of 150 hours at 150 ° C., but has a long curing molding time of 90 seconds and a post-cure 150 ° C. of 2 hours. There was a problem in mass production such as burrs.

  In light of the above, an object of the present invention is to provide a resin composition for a reflector that can produce a reflector having high heat resistance and light resistance and excellent productivity. Moreover, it aims at providing the molding method using the resin frame for reflectors using the said resin composition, a reflector, a semiconductor light-emitting device, and the said resin composition.

  As a result of intensive studies to achieve the above object, the present inventor has found that the object can be achieved by the following invention. That is, the present invention is as follows.

[1] comprising polyarylate, a white pigment, and inorganic particles excluding the white pigment,
A resin composition for a reflector, wherein the white pigment is at least one selected from titanium oxide, boron nitride, and melamine cyanurate that are surface-treated with an organic siloxane and / or an inorganic compound.
[2] The resin composition for reflectors according to [1], wherein the inorganic particles other than the white pigment are glass fibers.
[3] A reflector resin frame obtained by molding the reflector resin composition according to [1] or [2].
[4] The reflector resin frame according to [3], which has a thickness of 0.1 to 3.0 mm.
[5] A reflector obtained by curing the resin composition for reflectors according to [1] or [2].
[6] An optical semiconductor element and a reflector that is provided around the optical semiconductor element and reflects light from the optical semiconductor element in a predetermined direction are provided on the substrate.
The semiconductor light-emitting device whose light reflection surface of the said reflector is a hardened | cured material of the resin composition for reflectors as described in [1] or [2].
[7] A molding method of injection-molding the reflector resin composition according to [1] or [2] at an injection temperature of 200 to 400 ° C. and a mold temperature of 20 to 200 ° C.

  ADVANTAGE OF THE INVENTION According to this invention, the resin composition for reflectors which can produce the reflector which is high in heat resistance and light resistance and excellent in productivity can be provided. Moreover, the resin frame for reflectors using the said resin composition, a reflector, a semiconductor light-emitting device, and the shaping | molding method using the said resin composition can be provided.

It is a schematic sectional drawing which shows an example of the semiconductor light-emitting device of this invention. It is a schematic sectional drawing which shows an example of the semiconductor light-emitting device of this invention.

[1. Reflector resin composition and molding method]
The resin composition for reflectors of the present invention comprises polyarylate, a white pigment, and inorganic particles excluding the white pigment.

The polyarylate is a copolymer comprising an aromatic dicarboxylic acid and a bisphenol diacetate. Aromatic dicarboxylic acids include terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid and the like, and these may be used alone or in combination. Examples of diacetates of bisphenols include diacetates of 2,2-bis (4′-hydroxyphenyl) -propane, that is, diacetates of bisphenol A.
The number average molecular weight of the polyarylate is about 300 to 3 × 10 ⁵ , preferably about 500 to 1 × 10 ⁵ , and more preferably about 500 to ⁵ × 10 ^{4 in} terms of polystyrene by gel permeation chromatography.
In general, polyarylate is colored by light fleece rearrangement in which the molecular structure of the resin by ultraviolet light rearranges to a benzophenone structure, but it cannot occur because the emission wavelength of the current LED element is in the visible light region. Even if optical fleece dislocation occurs, the initial color is slightly colored and the reflectivity temporarily decreases. However, since it absorbs ultraviolet rays, it suppresses deterioration of material properties, transmittance, etc., resulting in excellent results. It becomes a reflector showing high light resistance.
As white pigments described later, boron nitride and melamine cyanurate effectively reflect ultraviolet light, so that the light fleece rearrangement of polyarylate can be reduced.

As the white pigment according to the present invention, any one of “titanium oxide surface-treated with organosiloxane and / or inorganic compound”, “boron nitride”, and “melamine cyanurate” is used.
The content of the white pigment is preferably 5 to 200 parts by mass, more preferably 10 to 100 parts by mass, and still more preferably 20 to 60 parts by mass with respect to 100 parts by mass of polyarylate.

  The average particle diameter of the white pigment is preferably 0.10 to 0.50 μm, more preferably 0.10 to 0.40 μm in the primary particle size distribution from the viewpoint of obtaining high reflectance in consideration of moldability, More preferably, it is 0.21-0.25 micrometer. An average particle diameter can be calculated | required as mass average value D50 in the particle size distribution measurement by a laser beam diffraction method.

In addition, titanium oxide not subjected to surface treatment easily decomposes the polyarylate resin. However, since the titanium oxide according to the present invention is subjected to predetermined surface treatment, such decomposition is suppressed.
For example, when the surface treatment is performed with an inorganic compound, the surface treatment of titanium oxide is performed by using alumina hydrate alone or a combination of the alumina hydrate and silica hydrate and / or zirconia compound (zirconia hydrate). It is preferable.
When the surface treatment is performed with an organosiloxane, it is preferable to perform the surface treatment with a polyorganosiloxane or a polyol compound, or a combination of a polyorganosiloxane and a polyol compound (polyorganosiloxane-based surface treatment agent).
Further, since the decomposition of the polyarylate resin can be suppressed while maintaining a good dispersion state of the titanium oxide in the resin, it is preferable to use a surface treatment with an inorganic compound and a surface treatment with an organic siloxane in combination.

Examples of the surface treatment method include a wet method and a dry method.
In the wet method, for example, alumina hydrate, and if necessary, titanium dioxide pretreated with silica hydrate and / or zirconia compound are added to a mixture of a polyorganosiloxane-based surface treatment agent and a solvent, In this method, the solvent is removed after stirring, followed by heat treatment at 100 to 300 ° C.
In the dry method, the pretreated titanium oxide and the polyorganosiloxane surface treatment agent are mixed with a Henschel mixer or the like in the same manner as described above, and the pretreated titanium oxide is mixed with the polyorganosiloxane surface treatment agent. In this method, the organic solution is sprayed and adhered, and heat treatment is performed at 100 to 300 ° C.
In addition, as the titanium oxide subjected to the surface treatment as described above, a commercially available one can be used.

  The amount of treatment by alumina hydrate alone or a combination of the alumina hydrate and silica hydrate and / or zirconia compound is determined by considering the light reflectivity of titanium oxide and the moldability of the resin composition. About 0.1-10.0 mass% is suitable with respect to it.

  Examples of the polyorganosiloxane include alkyl hydrogen silicone and alkoxy silicone. Examples of the alkyl hydrogen silicone include methyl hydrogen silicone and ethyl hydrogen silicone.

  Examples of the alkoxysilicone include methoxysilicone and ethoxysilicone. Particularly preferred alkoxysilicone is a silicone compound containing an alkoxysilyl group in which an alkoxy group is bonded to a silicon atom directly or via a divalent hydrocarbon group, for example, a straight chain having a linear shape, a cyclic shape, a network shape, and a partial branch. In particular, a linear polyorganosiloxane is preferable. More specifically, polyorganosiloxane having a molecular structure bonded to an alkoxy group via a methylene chain with respect to the silicone main chain is preferable.

As such a component, for example, commercially available SH1107, SR2402, BY16-160, BY16-161, BY16-160E, BY16-161E manufactured by Toray Dow Corning Co., Ltd. can be preferably used.
The treatment amount with alkoxysilicone is preferably about 0.05 to 5.0 parts by mass, and more preferably 0.05 to 3.0 parts by mass with respect to 100 parts by mass of the titanium oxide component.

  In addition, since the polyol also has an effect of reducing the moisture adsorption amount to a certain extent, the titanium oxide particles are hydrophobized and the affinity with the resin is improved. Examples of the polyol compound include trimethylol ethane, trimethylol propane, tripropanol ethane, pentaerythritol, and pentaerythritol. Among them, trimethylol ethane and trimethylol propane are particularly preferable. The treatment amount with the polyol is preferably about 0.5 to 5% by mass with respect to the titanium oxide particles.

Further, the boron nitride particles according to the present invention may be any one of a hexagonal structure (h-BN), a zinc blende structure (c-BN), a wurtzite structure (w-BN), and a rhombohedral structure (r-BN). However, it is preferable to use boron nitride particles having a so-called hexagonal crystal structure in the form of scales from the viewpoint of heat resistance and cost.
The melamine cyanurate according to the present invention refers to a compound represented by the chemical formula C ₆ H ₉ N ₉ O _{3 in} which melamine molecules and cyanuric acid molecules are arranged in a plane by hydrogen bonds.

  As the inorganic particles according to the present invention (excluding the above white pigment), those usually blended in the thermoplastic resin composition and the epoxy resin composition may be used alone or mixed, and the shape is not particularly limited and can be used. . Examples thereof include silica such as glass fiber, fused silica, fused spherical silica, crystalline silica, alumina, silicon nitride, aluminum nitride, antimony trioxide, and the like. Among them, glass fiber is preferable, and the content is preferably 10 to 200 parts by mass, more preferably 25 to 150 parts by mass, and more preferably 25 to 120 parts by mass with respect to 100 parts by mass of polyarylate. Is more preferable.

  The shape of the inorganic particles is not particularly limited, but a fibrous one (for example, the above glass fiber) is preferable from the viewpoint of improving the strength of the resin. In the case of a fiber, the average fiber length is preferably 30 to 100 μm, and the average fiber diameter is preferably 10 to 20 μm. The average fiber length and the average fiber diameter can be obtained by randomly extracting a predetermined amount of glass fiber from an arbitrary point of the glass fiber laminate, pulverizing the extracted fiber with a mortar or the like, and measuring with an image processing apparatus. it can.

The resin composition for a reflector of the present invention can be prepared by mixing polyarylate, white pigment, and inorganic particles excluding white pigment in a predetermined amount as described above. As the mixing method, known means such as a two-roll or three-roll, a single-screw kneader, a twin-screw kneader, a polylab system, or a melt kneader such as a lab plast mill can be applied. These may be performed at normal temperature, cooling state, heating state, normal pressure, reduced pressure state, or pressurized state.
Various additives can be added as long as the effects of the present invention are not impaired. For example, various whisker, silicone powder, thermoplastic elastomer, organic synthetic rubber, fatty acid ester, glycerate ester, zinc stearate, calcium stearate and other internal release agents for the purpose of improving the properties of the resin composition, benzophenone series Additives such as salicylic acid-based, cyanoacrylate-based, isocyanurate-based, oxalic acid anilide-based, benzoate-based, hindered amine-based, benzotriazole-based, phenol-based antioxidants, hindered amine-based and benzoate-based light stabilizers Can be blended.

  By using the resin composition for a reflector of the present invention, various molded products can be molded, and a molded product having a thinner thickness (for example, a reflector) can be produced. Such a molded body is preferably produced by the molding method of the present invention, that is, by using the resin composition for a reflector of the present invention, with an injection temperature of 200 to 400 ° C. and a mold temperature of 20 to 200 ° C.

  The reflector resin composition of the present invention as described above can be applied to various applications as a composite material coated on a substrate and cured, or as a cured product of a reflector resin composition. For example, it can be applied as a reflector of a light source for a light reflection sheet or LED for a solar cell or a television.

[2. Resin frame for reflectors]
The reflector resin frame of the present invention is formed by molding the above-described reflector resin composition of the present invention. Specifically, the resin frame for reflectors of the present invention is manufactured by using the resin for reflectors of the present invention as pellets and forming a resin frame of a desired shape by injection molding. The thickness of the reflector resin frame is preferably 0.1 to 3.0 mm.

  The resin frame for a reflector of the present invention can be made into a semiconductor light emitting device by placing an LED chip on this, further sealing with a known sealing agent, and performing die bonding to obtain a desired shape. In addition, although the resin frame for reflectors of this invention acts as a reflector, it functions also as a frame which supports a semiconductor light-emitting device.

[3. Reflector]
The reflector of the present invention is formed by curing the above-described resin composition for a reflector of the present invention.
The reflector may be used in combination with a semiconductor light-emitting device to be described later, or may be used in combination with a semiconductor light-emitting device (LED mounting substrate) made of another material.
The reflector of the present invention mainly has an action of reflecting light from the LED element of the semiconductor light emitting device toward the lens (light emitting portion). The details of the reflector are the same as those of the reflector (reflector 12 described later) applied to the semiconductor light emitting device of the present invention, and are omitted here.

[4. Semiconductor light emitting device]
As illustrated in FIG. 1, the semiconductor light emitting device of the present invention is provided around an optical semiconductor element (for example, an LED element) 10 and the optical semiconductor element 10, and reflects light from the optical semiconductor element 10 in a predetermined direction. A reflector 12 is provided on the substrate 14. And at least one part (all in the case of FIG. 1) of the light reflection surface of the reflector 12 is comprised with the hardened | cured material of the reflector composition of the above-mentioned this invention.

  The optical semiconductor element 10 emits radiated light (generally UV or blue light in a white light LED), for example, an active layer made of AlGaAs, AlGaInP, GaP or GaN sandwiched between n-type and p-type cladding layers. It is a semiconductor chip (light emitter) having a double heterostructure, and has a hexahedral shape with a side length of about 0.5 mm, for example. In the case of wire bonding mounting, it is connected to an electrode (connection terminal) (not shown) via a lead wire 16.

The shape of the reflector 12 conforms to the shape of the end portion (joint portion) of the lens 18 and is usually a cylindrical shape such as a square shape, a circular shape, or an oval shape, or an annular shape. In the schematic cross-sectional view of FIG. 1, the reflector 12 is a cylindrical body (annular body), and all the end faces of the reflector 12 are in contact with and fixed to the surface of the substrate 14.
In addition, in order to improve the directivity of the light from the optical semiconductor element 10, the inner surface of the reflector 12 may be expanded upward in a tapered shape (see FIG. 1).
The reflector 12 can also function as a lens holder when the end portion on the lens 18 side is processed into a shape corresponding to the shape of the lens 18.

  As shown in FIG. 2, the reflector 12 is good also considering only the light reflection surface side as the light reflection layer 12a which consists of the resin composition for reflectors of this invention. In this case, the thickness of the light reflection layer 12a is preferably 500 μm or less, and more preferably 300 μm or less, from the viewpoint of reducing the thermal resistance. The member 12b on which the light reflecting layer 12a is formed can be made of a known heat resistant resin.

  As described above, the lens 18 is provided on the reflector 12, but this is usually made of a resin, and various structures may be adopted and colored depending on the purpose and application.

  The space formed by the substrate 14, the reflector 12, and the lens 18 may be a transparent sealing portion, or may be a gap if necessary. This space portion is usually a transparent sealing portion filled with a light-transmitting and insulating material, and the force applied by directly contacting the lead wire 16 in wire bonding mounting and indirectly. Prevents electrical defects caused by the lead wire 16 being disconnected, cut, or short-circuited from the connection portion with the optical semiconductor element 10 and / or the connection portion with the electrode due to applied vibration, impact, etc. can do. At the same time, the optical semiconductor element 10 can be protected from moisture, dust, etc., and the reliability can be maintained over a long period of time.

  Examples of the material (transparent encapsulant composition) that imparts light-transmitting properties and insulating properties usually include silicone resins, epoxy silicone resins, epoxy resins, acrylic resins, polyimide resins, polycarbonate resins, and the like. Of these, silicone resins are preferred from the viewpoints of heat resistance, weather resistance, low shrinkage, and discoloration resistance.

Below, an example of the manufacturing method of the semiconductor light-emitting device shown in FIG. 1 is demonstrated.
First, the reflector 12 having a predetermined shape is molded from the reflective resin composition of the present invention by compression molding, injection molding, or the like using a mold having a cavity space having a predetermined shape. Thereafter, the separately prepared optical semiconductor element 10, electrodes and lead wires 16 are fixed to the substrate 14 with an adhesive or a bonding member, and further fixed to the reflector 12 on the substrate 14. Next, a transparent sealant composition containing a silicone resin or the like is poured into the recess formed by the substrate 14 and the reflector 12, and cured by heating, drying, or the like to obtain a transparent sealing portion. Thereafter, the lens 18 is disposed on the transparent sealing portion to obtain the semiconductor light emitting device shown in FIG.
In addition, after mounting the lens 18 in a state where the transparent sealant composition is uncured, the composition may be cured.

  EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not limited at all by these examples. In addition, the material used in the present Examples 1-9 and Comparative Examples 1-8 is as follows.

(1) Transparent resin / polyarylate: U polymer U-100, manufactured by Unitika Ltd., glass transition point 193 ° C.
Polymethylpentene resin: TPX RT18, manufactured by Mitsui Chemicals, mp 232 ° C
Norbornene polymer: ZEONOR 1600, manufactured by Nippon Zeon Co., Ltd., glass transition point 163 ° C.
Semi-aromatic polyamide (semi-aromatic polyamide obtained by polymerizing 2-methylpentamethylenediamine, hexamethylenediamine and terephthalic acid in proportions of 25 mol%, 25 mol% and 50 mol%, respectively): Zytel HTN501, DuPont ( Co., Ltd., melting point 305 ° C, glass transition temperature 125 ° C
Liquid crystal polymer: Vectra C950RX, manufactured by Polyplastics Co., Ltd., melting point 325 ° C.

(2) White pigment / titanium oxide particles: PC-3 (Ishihara Sangyo Co., Ltd. Rutile structure average particle size 0.21 μm, rutile type, specific gravity 4.2, surface treatment components: alumina hydrate, silica hydration Product, polyol compound, polyorganosiloxane)
-Titanium oxide particles: CR-90 (Ishihara Sangyo Co., Ltd. made rutile type structure average particle size 0.21 μm, rutile type, specific gravity 4.2, surface treatment components: alumina hydrate, silica hydrate)
Titanium oxide particles: PF-690 (Ishihara Sangyo Co., Ltd. Rutile structure average particle size 0.21 μm, rutile type, specific gravity 4.2, surface treatment components: alumina hydrate, silica hydrate, polyol compound)
-Titanium oxide particles (surface untreated): Titanium oxide (Wako Pure Chemical Industries, Ltd. rutile structure average particle size 0.21 μm, specific gravity 4.2, surface treatment components: none)
Boron nitride particles: UHP-S1 (manufactured by Showa Denko KK, scaly hexagonal crystal structure, volume average particle size 1.5 μm, surface treatment component: none)
Melamine cyanurate particles: MC-6000 (Nissan Chemical Co., Ltd. average particle size 2.0 μm, surface treatment component: none)
-Zinc oxide particles: LP-ZINC2 (manufactured by Sakai Chemical Industry Co., Ltd., average particle size 2 μm, surface treatment component: none)
Magnesium oxide particles: Magnesium oxide (Wako Pure Chemical Industries, Ltd. average particle size 0.2 μm, surface treatment component: none)
・ Aluminum oxide particles: CBP-02 (manufactured by Showa Denko KK, average particle diameter of 2 μm, surface treatment component: none)
Magnesium hydroxide particles: Magseeds N-6 (manufactured by Kamishima Chemical Co., Ltd., average particle size 1.1 μm, surface treatment component: organic fatty acid)
-Talc particle: Hi-micron HE5 (Takehara Chemical Industries, Ltd. average particle size 1.6 μm, surface treatment component: none)
Calcium carbonate particles: WS-2200 (Takehara Chemical Co., Ltd. average particle size 1.3 μm)
Barium sulfate particles: Barium sulfate (Wako Pure Chemical Industries, Ltd. average particle size 1.5 μm, surface treatment component: none)

(3) Inorganic filler / glass fiber: CS 3J-941 (manufactured by Nittobo Co., Ltd., fiber length: 3 mm)
Glass fiber: CSG3PA-830 (manufactured by Nittobo Co., Ltd., fiber length 3 mm)

(4) Additive / Silane coupling agent: KBM-303 (manufactured by Shin-Etsu Chemical Co., Ltd.)
Antioxidant: IRGANOX 1010 (BASF Japan Ltd.)
・ Processing stabilizer: IRGAFOS168 (manufactured by BASF Japan)
Mold release agent: SZ-2000 (manufactured by Sakai Chemical Co., Ltd.)

[Examples 1 to 9, Comparative Examples 1 to 16]
In the blending shown in Table 1 below, a transparent resin (polyarylate) and various particles were blended and kneaded to obtain a reflector resin composition. The kneading was performed with a roll.

  These compositions were press-molded into 750 mm × 750 mm × thickness 1 mm under conditions of 310 to 370 ° C. and 10 seconds to produce molded bodies. The following various characteristics of this molded product were evaluated. The results are shown in Table 1 below.

(Evaluation 1)
-Dispersibility: Appearance, light reflectance The color of the surface of the molded body was visually observed. The light reflectance at a wavelength of 230 to 780 nm was measured using a spectrophotometer UV-2550 (manufactured by Shimadzu Corporation).

(Evaluation 2)
-Heat resistance: yellow change in appearance, change in light reflectance After the molded body was left at 150 ° C for 500 hours and 1,000 hours, the light reflectance at a wavelength of 230 to 780 nm was measured with a spectrophotometer UV-2550 (Shimadzu Corporation). ).
Tables 1 and 2 show the results at a wavelength of 450 nm.

Light resistance: yellowing of appearance The molded body was visually observed for 500 hours at 100 ° C. before and after irradiation with Xe light with a wavelength of 400 nm or less cut, and then the surface color change was visually observed. If the white color before being left is maintained, it has good light resistance. In the table, “◯” indicates that white is maintained, “Δ” indicates that the body is slightly yellowish but white is maintained, and “X” indicates yellowing. In addition, “◯” and “Δ” are levels at which there is no practical problem.

-Formability: Warpage of appearance Prepare LED frame with reflector by injection molding at cylinder temperature 300-370 ° C, injection pressure 260MPa, injection hold time 4.5s, cooling time 5.0s, mold temperature 160 ° C. Compared with warp. “◯” in the table indicates a state where there is no warp, “Δ” indicates a level where there is a warp but there is no practical problem, and “x” indicates a level where there is a warp and is not practical. In addition, “◯” and “Δ” are levels at which there is no practical problem.

・ Reflow resistance: Warping of appearance The sample after molding is passed through a small nitrogen atmosphere reflow device RN-S (manufactured by Matsushita Electric Works) set so that the maximum temperature of the sample surface is maintained at 260 ° C for 10 seconds. evaluated. “◯” in the table indicates a state where there is no warp, “Δ” indicates a level where there is a warp but there is no practical problem, and “x” indicates a level where there is a warp and is not practical. In addition, “◯” and “Δ” are levels at which there is no practical problem.

[Comparative Example 17]
In Example 1, instead of polyarylate, a commercially available epoxy resin (triglycidyl isocyanurate and hexahydrophthalic anhydride dissolved in an epoxy resin in an equivalent amount was mixed with a curing catalyst tetra-n-butylphosphonium- o, o-diethyl phosphorodiothioate-containing resin), and cured at 150 ° C. for 90 seconds, further molded into a cured product having a diameter of 50 mm × thickness of 3 mm from post-curing at 150 ° C. for 2 hours, In the same manner as in the above example, the light reflectance was measured immediately after molding and after the heat test (24 hours at 500 ° C., 500 hours), and was 95% (before the heat test) and 90% (after 24 hours), respectively. 78% (after 500 hours). The warpage was 1 mm (corresponding to “Δ” in the evaluation of “warp”).

From Table 1, it was confirmed that the resin composition of the present invention was excellent in dispersibility and light reflectance when using titanium oxide surface-treated with an inorganic compound and an organic siloxane treatment. In addition, it was confirmed that the dispersibility with boron nitride and melamine cyanurate and the light reflectance were excellent even without surface treatment. It was also confirmed that the heat resistance and light resistance were excellent.
From Table 2, it was confirmed that the resin composition of the present invention is superior in heat resistance to other resin compositions, exhibits an equivalent level of light resistance, and is excellent in moldability and reflow resistance required as an LED reflector. . In addition, it was confirmed that the product has the same level of productivity as a commercially available thermoplastic resin composition and is excellent in heat resistance, and has the same level of heat resistance as a thermosetting resin composition and is excellent in productivity. .
From the above, it can be said that the resin composition of the present invention is useful for reflectors and reflectors for semiconductor light emitting devices.

DESCRIPTION OF SYMBOLS 10 ... Optical semiconductor element 12 ... Reflector 14 ... Board | substrate 16 ... Lead wire 18 ... Lens

Claims (9)

A polyarylate which is a copolymer comprising an aromatic dicarboxylic acid and a bisphenol diacetate, a white pigment, and inorganic particles excluding the white pigment,
The white pigment, boron nitride, melamine cyanurate, and at least a polyol compound及beauty free machine compounds reflector resin composition is at least one selected titanium oxide emissions or et al., Which is surface-treated with.   2. The aromatic dicarboxylic acid is one or two selected from terephthalic acid, isophthalic acid and naphthalenedicarboxylic acid, and the bisphenol is 2,2-bis (4′-hydroxyphenyl) -propane. The resin composition for reflectors described in 1.   The resin composition for a reflector according to claim 1, wherein the inorganic particles other than the white pigment are glass fibers. The titanium oxide, reflectors resin composition according to claim 1 in which surface-treated with further organic Siloxane.   The resin frame for reflectors which shape | molds the resin composition for reflectors in any one of Claims 1-4.   The resin frame for a reflector according to claim 5, wherein the thickness is 0.1 to 3.0 mm.   The reflector formed by hardening | curing the resin composition for reflectors in any one of Claims 1-4. An optical semiconductor element and a reflector provided around the optical semiconductor element and reflecting light from the optical semiconductor element in a predetermined direction on a substrate;
The light-emitting surface of the said reflector is a semiconductor light-emitting device which is the hardened | cured material of the resin composition for reflectors in any one of Claims 1-4.   The molding method which injection-molds the resin composition for reflectors in any one of Claims 1-4 at the injection temperature of 200-400 degreeC, and the mold temperature of 20-200 degreeC.

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