JP5699329B2 - Reflector resin composition, reflector resin frame, reflector, and semiconductor light emitting device - Google Patents

Description

  The present invention relates to a reflector resin composition, a reflector resin frame, a reflector, and a semiconductor light emitting device.

  An LED element, which is one of semiconductor light emitting devices, is widely used as a light source for an indicator lamp or the like because it is small and has a long lifetime and is excellent in power saving. In recent years, LED elements with higher brightness have been manufactured at a relatively low cost, and therefore, use as a light source to replace fluorescent lamps and incandescent bulbs has been studied. When applying to such a light source, in order to obtain a large illuminance, a plurality of LED elements are arranged on a surface-mounted LED package, that is, a metal substrate (LED mounting substrate) such as aluminum, and each LED element. A system is often used in which a reflector (reflector) that reflects light in a predetermined direction is disposed around the.

  However, since the LED element generates heat during light emission, in such a type of LED lighting device, the reflector deteriorates due to the temperature rise during light emission of the LED element, and the reflectance decreases, thereby reducing the brightness. The life of the element will be shortened. Therefore, heat resistance is required for the reflector.

In order to meet the above heat resistance requirement, Patent Document 1 proposes a polymer composition used for a reflector of a light emitting diode, specifically, polyphthalamide, carbon black, titanium dioxide, glass fiber, and an antioxidant. A polymer composition is disclosed. And the reflectance after heat aging is measured about the said composition, Compared with the polymer composition which does not contain carbon black, the favorable reflectance is obtained with the said composition, and it has shown that there is also little yellowing.
Patent Document 2 discloses a thermosetting light reflecting resin composition used for an optical semiconductor device in which an optical semiconductor element and a wavelength conversion means such as a phosphor are combined.

JP-T-2006-503160 JP 2009-149845 A

  However, the heat aging test of the thermosetting light reflecting resin composition described in Patent Document 2 has been verified under more practical conditions of 150 hours at 150 ° C., but the molding time is 90 seconds, which is Since it is longer and requires 2 hours as post-cure at 150 ° C., there is a problem in productivity.

  The thermal aging test of the polymer composition described in Patent Document 1 is an evaluation in a short time of 3 hours at 170 ° C., and whether good results can be obtained in heat durability under a longer practical condition Is unknown.

  Further, in the polymer composition described in Patent Document 1, glass fiber is used as a reinforcing agent. However, since glass fiber is an anisotropic particle, the inside of a mold is used during molding such as general injection molding. In the resin flow direction (MD: Machine Detection) and the vertical direction (TD: Transverse Detection), a phenomenon in which the reinforcing effect is different occurs, and defective products such as warping of the molded product are likely to occur. Further, if the amount of glass fiber is increased in order to increase the reinforcing effect, a new problem of inhibiting fluidity occurs, and the moldability is significantly lowered. Considering future miniaturization of elements, improvement of moldability will also be an important requirement in the future.

In view of the above prior art, even when a reinforcing agent that is not simply glass fiber is used as an alternative material, a practical resin composition for a reflector has not necessarily been obtained.
Further, according to the research of the present inventor, when porous silica particles are blended in place of glass fibers, foaming due to water evaporation occurs in the process of manufacturing a reflector and the like, and micropores are formed in the molded product. It has been found that defective products may be generated.

  As described above, the present invention has a high moldability and productivity when used as a reflector, and can exhibit excellent heat resistance when used as a reflector, and a resin frame for a reflector using the resin composition. An object of the present invention is to provide a reflector, a semiconductor light emitting device, and a molding method using the resin composition.

  As a result of intensive studies to achieve the above object, the present inventor has found that the object can be achieved by the following invention. That is, the present invention is as follows.

[1] A resin composition for a reflector, comprising a polymethylpentene resin, a white pigment, spherical fused silica particles and / or modified cross-section glass fibers.
[2] A reflector resin frame comprising a cured product of the reflector resin composition according to [1].
[3] The resin frame for reflectors according to [2], wherein the thickness is 0.1 to 0.5 mm.
[4] A reflector comprising a cured product of the resin composition for reflectors according to [1].

[5] An optical semiconductor element and a reflector provided around the optical semiconductor element and reflecting light from the optical semiconductor element in a predetermined direction are provided on a substrate, and the light reflecting surface of the reflector is the above [1] ] The semiconductor light-emitting device which consists of hardened | cured material of the reflector composition as described in above.
[6] A molding method in which the resin composition for reflectors according to [1] is injection molded at an injection temperature of 200 to 400 ° C. and a mold temperature of 20 to 100 ° C.

  According to the present invention, the moldability and productivity when making a reflector is high, the resin composition for a reflector that can exhibit excellent heat resistance when used as a reflector, the resin frame for a reflector using the resin composition, A reflector, a semiconductor light emitting device, and a molding method using the resin composition can be provided.

It is a schematic sectional drawing which shows an example of the semiconductor light-emitting device of this invention. It is a schematic sectional drawing which shows an example of the semiconductor light-emitting device of this invention.

[1. Resin resin composition]
The resin composition for a reflector of the present invention comprises a polymethylpentene resin, a white pigment, spherical fused silica particles and / or modified cross-section glass fibers.

By using a polymethylpentene resin, it is possible to suppress heat resistance, in particular, a decrease in reflectance over time when a reflector is used. In addition, since the refractive index of the resin is 1.46, which is very close to the refractive index of the silica particles, it is possible to suppress inhibition of optical characteristics such as transmittance and reflectance even when mixed.
The polymethylpentene resin is preferably a homopolymer of 4-methylpentene-1, but 4-methylpentene-1 and other α-olefins such as ethylene, propylene, 1-butene, 1-pentene, 1-hexene, Α-olefins having 2 to 20 carbon atoms such as 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-octadecene, 1-eicocene, 3-methyl-1-butene, 3-methyl-1-pentene And a copolymer mainly composed of 4-methylpentene-1 containing 90 mol% or more of 4-methyl-1-pentene.
As for the molecular weight of the homopolymer of 4-methylpentene-1, the weight average molecular weight Mw measured by gel permeation chromatography is preferably 1,000 or more, particularly preferably 5,000 or more.

  Spherical fused silica particles and modified cross-section glass fibers according to the present invention are usually used alone or in combination with thermoplastic resin compositions and thermosetting resin compositions such as epoxy resins, acrylic resins, and silicone resins. Can be used.

  Here, “spherical” of “spherical fused silica particles” is not a fiber shape like glass fiber, a shape with a large unevenness difference, or a thin flake shape, but the maximum distance and minimum distance from the center to the surface It refers to a shape having the same distance, and specifically refers to a substantially spherical shape or a spherical shape having an average sphericity of 0.8 or more. By having a substantially spherical or spherical shape, there is no anisotropy, high filling can be achieved, and the flowability to the mold and the wear resistance of the mold are excellent.

The average sphericity can be measured by image analysis of a particle image taken with a scanning electron microscope “FE-SEM, model JSM-6301F” manufactured by JEOL Ltd. That is, the projected area (A) and the perimeter (PM) of the particle are measured from the photograph. When the area of a perfect circle corresponding to the perimeter (PM) is (B), the roundness of the particle can be displayed as A / B. Therefore, assuming a perfect circle having the same peripheral length as the sample particle (PM), PM = 2πr and B = πr ² , so that B = π × (PM / 2π) ² , and each particle The sphericity can be calculated as sphericity = A / B = A × 4π / (PM) ² . The sphericity of 200 arbitrary particles thus obtained is obtained, and the average value is defined as the average sphericity of the powder. In addition, the average sphericity is 0.8 or more for a normal commercial product that is displayed as “spherical (spherical)”.

  Spherical fused silica particles are produced, for example, through a process in which a silicon dioxide powder raw material (for example, silica powder) is entrained in a powdered state with a carrier gas such as air in a flame formed in a melting zone in a furnace and injected from a burner Is done. In general, commercially available products can be used.

  The volume average particle diameter of the spherical fused silica particles is preferably 0.1 to 500 μm, more preferably 1 to 200 μm, and further preferably 5 to 150 μm from the viewpoint of the balance between heat resistance and moldability. . The said volume average particle diameter can be calculated | required as the mass average value D50 in the particle size distribution measurement by a laser beam diffraction method.

In addition, “an irregular cross-section glass fiber” refers to a fiber having a cross-sectional shape having a different minor axis and major axis. Since it can be reinforced almost equally in the resin flow direction (MD) and its vertical direction (TD), it is excellent in preventing warping of the molded product.
The modified cross-section glass fiber is an average fiber having a cross-sectional shape in which the short axis D1 of the cross section is 0.5 to 25 μm, the long diameter D2 is 0.6 to 300 μm, and the ratio D2 / D1 of D2 to D1 is 1.2 to 30. A glass fiber having a length of 0.75 to 300 μm is preferable. The fiber diameter and fiber length can be determined by randomly extracting a predetermined amount of glass fiber from an arbitrary point of the glass fiber laminate, pulverizing the extracted fiber with a mortar or the like, and measuring with an image processing apparatus.

  The content of the spherical fused silica particles and / or the modified cross-section glass fiber is preferably 10 to 300 parts by mass, more preferably 30 to 200 parts by mass with respect to 100 parts by mass of the polymethylpentene resin. More preferably, it is -120 mass parts.

  As the white pigment according to the present invention, titanium oxide, zinc sulfide, zinc oxide, barium sulfide, potassium titanate and the like can be used alone or in combination, and titanium oxide is particularly preferable. The content of the white pigment is preferably 5 to 200 parts by mass, more preferably 10 to 150 parts by mass, and further preferably 20 to 80 parts by mass with respect to 100 parts by mass of the polymethylpentene resin. preferable.

  The average particle diameter of the white pigment is preferably 0.10 to 0.50 μm, more preferably 0.10 to 0.40 μm in the primary particle size distribution from the viewpoint of obtaining high reflectance in consideration of moldability, More preferably, it is 0.21-0.25 micrometer. An average particle diameter can be calculated | required as mass average value D50 in the particle size distribution measurement by a laser beam diffraction method.

  The reflector resin composition of the present invention is prepared by mixing the polymethylpentene resin described above, spherical fused silica particles and / or modified cross-section glass fibers, and a white pigment in a predetermined ratio as described above. Can do. As the mixing method, known means such as a two-roll or three-roll, a stirrer such as a homogenizer or a planetary mixer, or a melt kneader such as a polylab system or a lab plast mill can be applied. These may be performed at normal temperature, cooling state, heating state, normal pressure, reduced pressure state, or pressurized state.

  Various additives can be added as long as the effects of the present invention are not impaired. For example, various whisker, silicone powder, thermoplastic elastomer, organic synthetic rubber, fatty acid ester, glycerate ester, zinc stearate, calcium stearate and other internal release agents for the purpose of improving the properties of the resin composition, benzophenone series Additives such as salicylic acid-based, cyanoacrylate-based, isocyanurate-based, oxalic acid anilide-based, benzoate-based, hindered amine-based, benzotriazole-based, phenol-based antioxidants, hindered amine-based and benzoate-based light stabilizers Can be blended.

  By using the resin composition for a reflector of the present invention, various molded products can be molded, and a molded product having a thinner thickness (for example, a reflector) can be produced. Such a molded body is preferably produced by the molding method of the present invention, that is, using the resin composition for a reflector of the present invention, with an injection temperature of 200 to 400 ° C. and a mold temperature of 20 to 100 ° C.

  The reflector resin composition of the present invention as described above can be applied to various applications as a composite material coated on a substrate and cured, or as a cured product of a reflector resin composition. For example, it can be applied as a reflector of a light source for a light reflection sheet or LED for a solar cell or a television.

[2. Resin frame for reflectors]
The reflector resin frame of the present invention comprises a cured product obtained by molding the above-described reflector resin composition of the present invention. Specifically, the resin frame for reflectors of the present invention is manufactured by using the resin for reflectors of the present invention as pellets and forming a resin frame of a desired shape by injection molding. The thickness of the reflector resin frame is preferably 0.1 to 0.5 mm.

  As described above, since the resin composition for a reflector of the present invention has good fluidity to a mold, for example, the thickness is smaller than that of a resin frame manufactured using glass fibers having an anisotropic shape. A resin frame can be produced. Specifically, a resin frame having a thickness of 0.1 to 0.5 mm can be produced. In addition, the reflector resin frame of the present invention formed in this way is stable in form because there is no warping caused by including an anisotropic filler such as glass fiber even when the thickness is reduced. Excellent in handling and handling.

  The resin frame for a reflector of the present invention can be made into a semiconductor light emitting device by placing an LED chip on this, further sealing with a known sealing agent, and performing die bonding to obtain a desired shape. In addition, although the resin frame for reflectors of this invention acts as a reflector, it is functioning also as a frame which supports a semiconductor light-emitting device.

  In addition, since the resin frame for reflectors of this invention suppresses foaming by water in the process of manufacturing the frame, micropores that cause defects are not formed. Therefore, in a product using the frame (for example, a semiconductor light emitting element), it is difficult for defects due to the fine holes to occur, so that durability as the product can be improved.

[3. Reflector]
The reflector of this invention consists of hardened | cured material which hardened | cured the resin composition for reflectors of the above-mentioned this invention.
The reflector may be used in combination with a semiconductor light-emitting device to be described later, or may be used in combination with a semiconductor light-emitting device (LED mounting substrate) made of another material.
The reflector of the present invention mainly has an action of reflecting light from the LED element of the semiconductor light emitting device toward the lens (light emitting portion). The details of the reflector are the same as those of the reflector (reflector 12 described later) applied to the semiconductor light emitting device of the present invention, and are omitted here.

In addition, since the foam of the reflector of this invention is suppressed in the process which manufactures the said reflector, the micropore which produces a defect is not formed. Therefore, in a product using the reflector (for example, a semiconductor light emitting element), it is difficult for defects due to the fine holes to occur, so that the durability as the product can be improved.
As described above, the semiconductor light-emitting device in which the reflector is formed using the resin composition for a reflector of the present invention does not have micropores that cause defects in the reflector. Is less likely to occur. Therefore, the durability as the product is improved.

[4. Semiconductor light emitting device]
As illustrated in FIG. 1, the semiconductor light emitting device of the present invention is provided around an optical semiconductor element (for example, an LED element) 10 and the optical semiconductor element 10, and reflects light from the optical semiconductor element 10 in a predetermined direction. A reflector 12 is provided on the substrate 14. And at least one part (all in the case of FIG. 1) of the light reflection surface of the reflector 12 is comprised with the hardened | cured material of the reflector composition of the above-mentioned this invention.

  The optical semiconductor element 10 emits radiated light (generally UV or blue light in a white light LED), for example, an active layer made of AlGaAs, AlGaInP, GaP or GaN sandwiched between n-type and p-type cladding layers. It is a semiconductor chip (light emitter) having a double heterostructure, and has a hexahedral shape with a side length of about 0.5 mm, for example. In the case of wire bonding mounting, it is connected to an electrode (connection terminal) (not shown) via a lead wire 16.

The shape of the reflector 12 conforms to the shape of the end portion (joint portion) of the lens 18 and is usually a cylindrical shape such as a square shape, a circular shape, or an oval shape, or an annular shape. In the schematic cross-sectional view of FIG. 1, the reflector 12 is a cylindrical body (annular body), and all the end faces of the reflector 12 are in contact with and fixed to the surface of the substrate 14.
In addition, in order to improve the directivity of the light from the optical semiconductor element 10, the inner surface of the reflector 12 may be expanded upward in a tapered shape (see FIG. 1).
The reflector 12 can also function as a lens holder when the end portion on the lens 18 side is processed into a shape corresponding to the shape of the lens 18.

  As shown in FIG. 2, the reflector 12 is good also considering only the light reflection surface side as the light reflection layer 12a which consists of the resin composition for reflectors of this invention. In this case, the thickness of the light reflection layer 12a is preferably 500 μm or less, and more preferably 300 μm or less, from the viewpoint of reducing the thermal resistance. The member 12b on which the light reflecting layer 12a is formed can be made of a known heat resistant resin.

  As described above, the lens 18 is provided on the reflector 12, but this is usually made of a resin, and various structures may be adopted and colored depending on the purpose and application.

  The space formed by the substrate 14, the reflector 12, and the lens 18 may be a transparent sealing portion, or may be a gap if necessary. This space portion is usually a transparent sealing portion filled with a light-transmitting and insulating material, and the force applied by directly contacting the lead wire 16 in wire bonding mounting and indirectly. Prevents electrical defects caused by the lead wire 16 being disconnected, cut, or short-circuited from the connection portion with the optical semiconductor element 10 and / or the connection portion with the electrode due to applied vibration, impact, etc. can do. At the same time, the optical semiconductor element 10 can be protected from moisture, dust, etc., and the reliability can be maintained over a long period of time.

  Examples of the material (transparent encapsulant composition) that imparts light-transmitting properties and insulating properties usually include silicone resins, epoxy silicone resins, epoxy resins, acrylic resins, polyimide resins, polycarbonate resins, and the like. Of these, silicone resins are preferred from the viewpoints of heat resistance, weather resistance, low shrinkage, and discoloration resistance.

Below, an example of the manufacturing method of the semiconductor light-emitting device shown in FIG. 1 is demonstrated.
First, the reflector 12 having a predetermined shape is molded from the reflective resin composition of the present invention by transfer molding, compression molding, injection molding or the like using a mold having a cavity space having a predetermined shape. Thereafter, the separately prepared optical semiconductor element 10, electrodes and lead wires 16 are fixed to the substrate 14 with an adhesive or a bonding member, and further fixed to the reflector 12 on the substrate 14. Next, a transparent sealant composition containing a silicone resin or the like is poured into the recess formed by the substrate 14 and the reflector 12, and cured by heating, drying, or the like to obtain a transparent sealing portion. Thereafter, the lens 18 is disposed on the transparent sealing portion to obtain the semiconductor light emitting device shown in FIG.
In addition, after mounting the lens 18 in a state where the transparent sealant composition is uncured, the composition may be cured.

EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not limited at all by these examples.
The materials used in Examples 1 and 2 and Comparative Examples 1 to 3 are as follows.

(1) Resin polymethylpentene resin: TPX RT18 (Mitsui Chemicals, Inc., molecular weight: MW 500,000 to 600,000)
Cyclopolyolefin resin: ZEONOR 1600 (manufactured by Nippon Zeon Co., Ltd.)
(2) Inorganic particle spherical fused silica: F-HS20 (manufactured by Kinsei Matec Co., Ltd., average particle size 22 μm)
Modified cross-section glass fiber: CSG3PA-820 (manufactured by Nittobo Co., Ltd., fiber length: 3 mm)
Spherical porous silica: SYLYSIA780 (manufactured by Fuji Silica Chemical Co., Ltd., average particle size 12 μm)
Glass fiber: CSX3J-451 (manufactured by Nittobo Co., Ltd., fiber length: 3 mm)
(3) White pigment titanium oxide particles: PF-691 (Ishihara Sangyo Co., Ltd. Rutile structure average particle diameter 0.21 μm)

(4) Additive silane coupling agent: KBM-303 (manufactured by Shin-Etsu Chemical Co., Ltd.)
Release agent: SZ-2000 (manufactured by Sakai Chemical Co., Ltd.)
Antioxidant: IRGANOX 1010 (manufactured by Ciba Japan Co., Ltd.)
Light stabilizer: IRGAFOS168 (manufactured by Ciba Japan Co., Ltd.)

[Examples 1-2, Comparative Examples 1-3]
In the compounding shown in Table 1, various materials were compounded and kneaded to obtain a resin composition for a reflector. The kneading was performed with a roll.

These compositions were press-molded into a size of 750 mm × 750 mm × thickness 0.6 mm under the conditions of 250 to 280 ° C., 10 seconds, and 50 MPa to prepare a molded body.
The following various characteristics of this molded product were evaluated. The results are shown in Table 1 below.

(Evaluation 1)
-Workability It evaluated by kneadability and the possibility of stable pellet production. “◯” in the table indicates that stable pelletization is possible, “Δ” indicates that it is somewhat unstable but can be produced, and “×” indicates that it is very difficult.

(Evaluation 2)
・ Heat resistance (yellowing of appearance)
Before and after leaving the molded body at 150 ° C. for 24 hours and 500 hours, the color change of the surface before and after the standing was visually observed. If the white color before being left is maintained, it has good heat resistance. In the table, “◯” indicates that white is maintained, “Δ” indicates that the body is slightly yellowish but white is maintained, and “X” indicates yellowing.

(Evaluation 3)
・ Heat resistance: light reflectivity Before and after leaving the molded product at 150 ° C. for 24 hours and 500 hours, use a spectrophotometer UV-2550 (manufactured by Shimadzu Corporation) for light reflectivity at a wavelength of 230 to 780 nm. Measured. Table 1 shows the results at a wavelength of 450 nm.

(Evaluation 4)
-Formability: Warpage Cylinder temperature 270-300 ° C, injection pressure 115MPa, injection pressure holding time 4.5s, cooling time 5.0s, mold temperature 80 ° C, LED frame with reflector is produced by injection molding, warping Was measured. Warpage was obtained from the maximum value of the gap with the surface plate when placed on a flat surface plate. The results are shown in Table 1 below.

(Evaluation 5)
-Formability: presence or absence of micropores A cross section of the molded body obtained by the above method was cut, and it was confirmed from appearance evaluation whether micropores existed in each molded body. The results are shown in Table 1 below. “◯” in the table indicates that no micropores are observed, and “x” indicates that micropores are observed.

[Comparative Example 4]
In Example 1, instead of the polymethylpentene resin, a commercially available polyphthalamide resin (terephthalic acid unit and 1,9-nonanediamine unit: 2-methyl-1,8-octanediamine unit had a molar ratio of 85:15. And having a melting point of 306 ° C.), a cured product having a diameter of 50 mm × thickness of 3 mm was molded. When the light reflectance of time was measured, they were 94% (before the heat resistance test), 83% (after 24 hours), and 62% (after 500 hours), respectively. The molding time was 10 seconds and the warpage was 6.3 mm.

[Comparative Example 5]
In Example 1, instead of a polymethylpentene resin, a commercially available epoxy resin (triglycidyl isocyanurate and hexahydrophthalic anhydride were dissolved and mixed in an epoxy resin in an equivalent amount to a curing catalyst tetra-n-butyl. A resin containing phosphonium-o, o-diethyl phosphorodiothioate), cured at 150 ° C. for 90 seconds, and then molded into a cured product having a diameter of 50 mm × thickness of 3 mm by post-curing at 150 ° C. for 2 hours. In the same manner as in the above examples, the light reflectance was measured immediately after molding and after the heat resistance test (at 150 ° C. for 24 hours and 500 hours). After), 78% (after 500 hours). The warpage was 1 mm or less.

From Table 1, it has confirmed that the resin composition of this invention was excellent in productivity, heat resistance, and a moldability. Heat resistance is better than commercially available thermoplastic resin compositions, comparable to commercially available thermosetting resin compositions, molding time is equivalent to commercially available thermoplastic resin compositions, and commercially available thermosetting resin compositions It was confirmed that the product was also excellent in productivity.
From the above, it can be said that the resin composition for reflectors of the present invention is useful for reflectors and reflectors for semiconductor light emitting devices.

DESCRIPTION OF SYMBOLS 10 ... Optical semiconductor element 12 ... Reflector 14 ... Board | substrate 16 ... Lead wire 18 ... Lens

Claims (11)

A polymethylpentene resin, seen containing a white pigment, and spherical fused silica particles and / or modified cross-section glass fibers, and has an average sphericity of the spherical fused silica particles is 0.8 or more, the foreign-shaped cross-section glass fiber A resin composition for a reflector having a minor axis D1 of 0.5 to 25 μm in cross section and a major axis D2 of 0.6 to 300 μm .   The resin composition for a reflector according to claim 1, wherein the spherical fused silica particles have a volume average particle size of 0.1 to 500 μm.   The resin composition for a reflector according to claim 1, wherein the spherical fused silica particles have a volume average particle size of 1 to 200 μm.   The resin composition for a reflector according to claim 1, wherein the spherical fused silica particles have a volume average particle size of 5 to 150 μm.   The resin composition for a reflector according to any one of claims 1 to 4, wherein the deformed cross-section glass fiber has a cross-sectional shape in which a ratio D2 / D1 of the D2 to the short diameter D1 is 1.2 to 30.   The resin composition for a reflector according to any one of claims 1 to 5, wherein an average fiber length of the modified cross-section glass fiber is 0.75 to 300 µm. The resin frame for reflectors which consists of a hardened | cured material of the resin composition for reflectors of any one of Claims 1-6 . The resin frame for a reflector according to claim 7 , wherein the thickness is 0.1 to 0.5 mm. The reflector which consists of hardened | cured material of the resin composition for reflectors of any one of Claims 1-6 . An optical semiconductor element and a reflector provided around the optical semiconductor element and reflecting light from the optical semiconductor element in a predetermined direction on a substrate;
The semiconductor light-emitting device which the light reflection surface of the said reflector consists of the hardened | cured material of the reflector composition of Claim 9 . A molding method for injection-molding the resin composition for a reflector according to any one of claims 1 to 6 at an injection temperature of 200 to 400 ° C and a mold temperature of 20 to 100 ° C.

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