JP6185240B2 - Aqcおよび金属ナノ粒子の組合せにより得られる導電性インク - Google Patents
Aqcおよび金属ナノ粒子の組合せにより得られる導電性インク Download PDFInfo
- Publication number
- JP6185240B2 JP6185240B2 JP2012540465A JP2012540465A JP6185240B2 JP 6185240 B2 JP6185240 B2 JP 6185240B2 JP 2012540465 A JP2012540465 A JP 2012540465A JP 2012540465 A JP2012540465 A JP 2012540465A JP 6185240 B2 JP6185240 B2 JP 6185240B2
- Authority
- JP
- Japan
- Prior art keywords
- aqc
- conductive ink
- average size
- metal nanoparticles
- nanoparticles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002082 metal nanoparticle Substances 0.000 title claims description 23
- 239000000203 mixture Substances 0.000 claims description 35
- 239000002245 particle Substances 0.000 claims description 34
- 238000009826 distribution Methods 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 230000004907 flux Effects 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 229920000642 polymer Polymers 0.000 claims description 13
- 238000007639 printing Methods 0.000 claims description 13
- -1 polyethylene Polymers 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 238000005245 sintering Methods 0.000 claims description 9
- 230000002902 bimodal effect Effects 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 239000004952 Polyamide Substances 0.000 claims description 6
- 239000004698 Polyethylene Substances 0.000 claims description 6
- 239000004743 Polypropylene Substances 0.000 claims description 6
- 229920001577 copolymer Polymers 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000007641 inkjet printing Methods 0.000 claims description 6
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 6
- 229920000573 polyethylene Polymers 0.000 claims description 6
- 229920001155 polypropylene Polymers 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052745 lead Inorganic materials 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- 238000007645 offset printing Methods 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920006254 polymer film Polymers 0.000 claims description 2
- 238000007649 pad printing Methods 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 239000002105 nanoparticle Substances 0.000 description 70
- 239000000976 ink Substances 0.000 description 47
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 18
- 238000009472 formulation Methods 0.000 description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 12
- 230000009467 reduction Effects 0.000 description 5
- 238000012856 packing Methods 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 235000010724 Wisteria floribunda Nutrition 0.000 description 2
- 239000013590 bulk material Substances 0.000 description 2
- 238000001246 colloidal dispersion Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000013020 final formulation Substances 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 238000005191 phase separation Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003917 TEM image Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011370 conductive nanoparticle Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005274 electronic transitions Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000004768 lowest unoccupied molecular orbital Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000006072 paste Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
- C09D1/02—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances alkali metal silicates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/67—Particle size smaller than 100 nm
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/68—Particle size between 100-1000 nm
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0266—Size distribution
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
- Y10T428/31699—Ester, halide or nitrile of addition polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31703—Next to cellulosic
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Nanotechnology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Powder Metallurgy (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
本発明は、様々なサイズの金属ナノ粒子と、150℃未満の融点、有利には100℃未満の融点を有する半導電性融剤成分との混合物に基づく安定なコロイドインクの新たな配合に関する。前記融剤成分は、結合成分(焼結成分)として作用し、ナノ粒子間の金属接触を達成し、極めて低い温度(<150℃)での熱処理で極低抵抗(バルク材料の抵抗に近い)を有する電子構造体を達成する驚くべき効果をもたらす。
1.三峰性の分布+AQC
上記によれば、導電性インクの配合の最適化のために半導電性融剤成分、特にAQCと、様々なサイズのナノ粒子との組合せが提案されており、ここでAQCは以下のように理解される:
500個未満の金属原子(Mn、n<500)で構成されるものとして特徴付けられる安定な原子量子クラスターAQC
200個未満の金属原子(Mn、n<200)で構成されるものとして特徴付けられるAQC
2個超27個未満の間の金属原子(Mn、2<n<27)で構成されるものとして特徴付けられるAQC
2〜5個の間の金属原子で構成されるものとして特徴付けられるAQC
金属がAu、Ag、Co、Cu、Pt、Fe、Cr、Pd、Ni、Rh、Pbまたはそれらの二元金属および多金属の組合せから選択されるAQC。
a)様々なサイズの金属ナノ粒子を混合する工程、
b)融解温度が金属ナノ粒子の初期混合物のものより実質的に低く、特に150℃未満である低温の融剤で、サイズが2nm未満である半導電体成分を添加する工程、
c)紙、ポリアミドタイプのポリマー、カプトン、可撓性または比較的非可撓性のポリマー、ポリエチレン製品、ポリプロピレン、アクリレート含有製品、ポリメチルメタクリレート、上述したポリマーの共重合体またはそれらの組合せである基板のいずれかにインクを堆積させる工程と、
d)基板上に堆積したインクの温度を、金属ナノ粒子がその融点に達せず、半導電体融剤成分が融解して、金属ナノ粒子間の金属接点が高い導電性となり得るようにインクの焼結を達成するために上昇させる工程とを備えることを特徴とする。
25%の大きなAgナノ粒子:12.5g
4.9%の小さなAgナノ粒子:2.45g
0.1%のAg AQC:0.05g
35%のエチレングリコール(EG):17.5g
35%のエタノール(E):17.5g
Claims (17)
- a)サイズ分布の平均サイズが5〜250nmの範囲内である、少なくとも二つの異なるサイズ分布の金属ナノ粒子の混合物と、
b)安定な原子量子クラスター(AQC)からなる融剤成分との組合せを含み、
前記AQCが、500未満の金属原子数からなり、前記AQCの平均サイズが、2nm未満であり、前記AQC用の金属が、Au、Ag、Co、Cu、Pt、Fe、Cr、Pd、Ni、Rh、Pbまたはそれらの二元金属および多金属の組合せから選択され、
前記金属ナノ粒子の金属が、Au、Ag、Co、Cu、Pt、Fe、Cr、Pd、Ni、Rh、Pbまたはそれらの二元金属および多金属の組合せから選択される導電性インク。 - 前記金属ナノ粒子の混合物が双峰性分布、すなわち二つの異なる平均サイズの金属ナノ粒子の分布であり、最小粒子の平均サイズと、最大粒子の平均サイズとの比が約1/10であることを特徴とする請求項1に記載の導電性インク。
- 前記双峰性分布において、最大粒子の平均サイズが100〜250nmの間からなり、
最小粒子の平均サイズが10〜25nmの間からなることを特徴とする請求項2に記載の導電性インク。 - 前記最大粒子に対するAQCの容積比が、1/10以下である請求項3に記載の導電性インク。
- 前記金属ナノ粒子の混合物が、三峰性分布、すなわち三つの異なる平均サイズの金属ナノ粒子の分布であり、中間粒子の平均サイズに対する最小粒子の平均サイズの比、および、最大粒子の平均サイズに対する中間粒子の平均サイズの比が、それぞれ約1/5である
ことを特徴とする請求項1に記載の導電性インク。 - 前記金属ナノ粒子の混合物が、三峰性分布、すなわち三つの異なる平均サイズの金属ナノ粒子の分布であり、ここで最大粒子の平均サイズが100〜250nmの間からなり、中間粒子の平均サイズが25〜50nmからなり、最小粒子の平均サイズが5〜10nmからなることを特徴とする請求項5に記載の導電性インク。
- 前記最大粒子に対するAQCの容積比が、1/30以下であることを特徴とする請求項6に記載の導電性インク。
- 前記AQCの平均サイズが、1nm未満である請求項1〜7のいずれかに記載の導電性インク。
- 前記AQCの融解温度が、150℃以下である請求項1〜8のいずれかに記載の導電性インク。
- 前記AQCが、下記の群:
200未満の金属原子数からなることを特徴とするAQC、
2超27未満の金属原子数からなることを特徴とするAQC、
2〜5の金属原子数からなることを特徴とするAQC
の一つまたはいくつかに属する請求項1〜9のいずれかに記載の導電性インク。 - 紙、ポリアミド類のポリマー、カプトン、可撓性もしくは非可撓性のポリマー、ポリエチレン製品、ポリプロピレン、アクリレート含有製品、ポリメチルメタクリレート、上記ポリマーの共重合体およびそれらの組合せからなる群より選択される温度感受性基板への印刷用である請求項1〜10のいずれかに記載の導電性インクの使用。
- 請求項1〜10のいずれかに記載の金属ナノ粒子を有する導電性インクを焼結するための焼結処理での低温融剤物質としての前記AQCの使用であって、前記融剤成分が様々なサイズ分布の金属ナノ粒子間の結合成分または連結子として作用して導電性を付与し得ることを特徴とするAQCの使用。
- スクリーン印刷、パッド印刷およびインクジェット印刷用プリントエレクトロニクスへの請求項12に記載のAQCの使用。
- 大量印刷、オフセット印刷、彫版印刷およびフレキソ印刷への請求項12に記載のAQCの使用。
- 紙、ポリアミド類のポリマー、カプトン、可撓性もしくは非可撓性のポリマー、ポリエチレン製品、ポリプロピレン、アクリレート含有製品、ポリメチルメタクリレート、上記ポリマーの共重合体およびそれらの組合せからなる群より選択される温度感受性基板に印刷するための請求項12に記載のAQCの使用。
- ポリエステル類、ポリアミド類、ポリカーボネート類、ポリエチレン、ポリプロピレンおよびその共重合体並びにそれらの組合せの群より選択した少なくとも一つを含有するポリマーフィルムへ印刷するための請求項12に記載のAQCの使用。
- 請求項1〜10のいずれかに記載の導電性インクを製造するに当たり、
a)少なくとも二つの異なるサイズ分布の前記金属ナノ粒子を混合する工程と、
b)AQCからなる融剤成分を添加する工程と、
を備えることを特徴とする導電性インクの製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES200902230A ES2360649B2 (es) | 2009-11-25 | 2009-11-25 | Tintas conductoras obtenidas por combinación de aqcs y nanopartículas metálicas. |
ESP200902230 | 2009-11-25 | ||
PCT/ES2010/070765 WO2011064430A2 (es) | 2009-11-25 | 2010-11-23 | Tintas conductoras obtenidas por combinación de aqcs y nanopartículas metálicas |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015159603A Division JP2016048677A (ja) | 2009-11-25 | 2015-08-12 | Aqcおよび金属ナノ粒子の組合せにより得られる導電性インク |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013512300A JP2013512300A (ja) | 2013-04-11 |
JP6185240B2 true JP6185240B2 (ja) | 2017-08-23 |
Family
ID=44060839
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012540465A Expired - Fee Related JP6185240B2 (ja) | 2009-11-25 | 2010-11-23 | Aqcおよび金属ナノ粒子の組合せにより得られる導電性インク |
JP2015159603A Pending JP2016048677A (ja) | 2009-11-25 | 2015-08-12 | Aqcおよび金属ナノ粒子の組合せにより得られる導電性インク |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015159603A Pending JP2016048677A (ja) | 2009-11-25 | 2015-08-12 | Aqcおよび金属ナノ粒子の組合せにより得られる導電性インク |
Country Status (6)
Country | Link |
---|---|
US (1) | US9315687B2 (ja) |
EP (1) | EP2505616A4 (ja) |
JP (2) | JP6185240B2 (ja) |
KR (1) | KR101826272B1 (ja) |
ES (1) | ES2360649B2 (ja) |
WO (1) | WO2011064430A2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2785456B1 (en) * | 2011-12-02 | 2017-09-27 | Universidade De Santiago De Compostela | Photoconversion of light using metal supported atomic quantum clusters |
WO2014090853A1 (en) * | 2012-12-12 | 2014-06-19 | Nanogap Sub Nm Powder, S.A. | Luminescent nanocompounds |
KR101656452B1 (ko) * | 2013-09-06 | 2016-09-09 | 주식회사 잉크테크 | 전도성 패턴 형성 방법 및 전도성 패턴 |
DE102013224622A1 (de) * | 2013-11-29 | 2015-06-03 | Robert Bosch Gmbh | Dispersion für die Metallisierung von Kontaktierungen |
US10087332B2 (en) * | 2016-05-13 | 2018-10-02 | NanoCore Technologies | Sinterable metal paste for use in additive manufacturing |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003187640A (ja) * | 2001-12-18 | 2003-07-04 | Bando Chem Ind Ltd | 金属コロイド液及び導電性被膜 |
JP4261162B2 (ja) * | 2002-11-19 | 2009-04-30 | 住友ゴム工業株式会社 | 回路の製造方法および該回路を備えた回路板 |
US20070267291A1 (en) * | 2004-03-09 | 2007-11-22 | Hall Clive E | Electrochemical Sensor Comprising Diamond Particles |
JP4706637B2 (ja) * | 2004-11-29 | 2011-06-22 | Dic株式会社 | 導電性ペースト、及び導電性ペーストの製造方法 |
US7824466B2 (en) * | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
ES2277531B2 (es) | 2005-08-03 | 2008-07-16 | Universidad De Santiago De Compostela | Procedimiento para la obtencion de clusteres cuanticos atomicos. |
US20070144305A1 (en) * | 2005-12-20 | 2007-06-28 | Jablonski Gregory A | Synthesis of Metallic Nanoparticle Dispersions |
WO2008100568A1 (en) * | 2007-02-17 | 2008-08-21 | Nanogram Corporation | Functional composites, functional inks and applications thereof |
WO2009027172A1 (en) * | 2007-08-31 | 2009-03-05 | Unilever Plc | Printing formulations |
ES2319064B1 (es) * | 2007-10-05 | 2010-02-15 | Universidad De Santiago De Compostela | Uso de clusteres cuanticos atomicos (aqcs) como antimicrobianos y biocidas. |
KR20100068274A (ko) * | 2007-10-09 | 2010-06-22 | 나노마스 테크놀러지스, 인코포레이티드 | 전도성 나노입자 잉크 및 페이스트, 및 이를 이용한 응용 |
US7976733B2 (en) * | 2007-11-30 | 2011-07-12 | Xerox Corporation | Air stable copper nanoparticle ink and applications therefor |
US20090274834A1 (en) * | 2008-05-01 | 2009-11-05 | Xerox Corporation | Bimetallic nanoparticles for conductive ink applications |
US8017044B2 (en) * | 2008-07-08 | 2011-09-13 | Xerox Corporation | Bimodal metal nanoparticle ink and applications therefor |
ES2365313B2 (es) * | 2010-03-18 | 2012-01-19 | Universidad De Santiago De Compostela | PROCEDIMIENTO PARA LA PREPARACIÓN DE NANOPARTÍCULAS METÁLICAS ANISOTRÓPICAS MEDIANTE CATÁLISIS POR AQCs. |
-
2009
- 2009-11-25 ES ES200902230A patent/ES2360649B2/es active Active
-
2010
- 2010-11-23 EP EP10832691.9A patent/EP2505616A4/en not_active Withdrawn
- 2010-11-23 KR KR1020127016564A patent/KR101826272B1/ko not_active Application Discontinuation
- 2010-11-23 JP JP2012540465A patent/JP6185240B2/ja not_active Expired - Fee Related
- 2010-11-23 WO PCT/ES2010/070765 patent/WO2011064430A2/es active Application Filing
- 2010-11-23 US US13/511,369 patent/US9315687B2/en not_active Expired - Fee Related
-
2015
- 2015-08-12 JP JP2015159603A patent/JP2016048677A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
KR101826272B1 (ko) | 2018-02-06 |
EP2505616A2 (en) | 2012-10-03 |
US20120315495A1 (en) | 2012-12-13 |
WO2011064430A4 (es) | 2011-09-22 |
WO2011064430A2 (es) | 2011-06-03 |
WO2011064430A3 (es) | 2011-07-28 |
EP2505616A4 (en) | 2014-08-20 |
JP2013512300A (ja) | 2013-04-11 |
KR20120113739A (ko) | 2012-10-15 |
ES2360649B2 (es) | 2011-10-17 |
US9315687B2 (en) | 2016-04-19 |
ES2360649A1 (es) | 2011-06-07 |
JP2016048677A (ja) | 2016-04-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2016048677A (ja) | Aqcおよび金属ナノ粒子の組合せにより得られる導電性インク | |
Xin et al. | Decoration of carbon nanotubes with silver nanoparticles for advanced CNT/polymer nanocomposites | |
JP5190412B2 (ja) | 合金ナノ粒子及びその製造方法、並びにその合金ナノ粒子を用いたインク及びペースト | |
Pajor-Świerzy et al. | Air stable copper-silver core-shell submicron particles: Synthesis and conductive ink formulation | |
JP6211245B2 (ja) | 導電性材料およびその製造方法 | |
Yin et al. | Screen printing of silver nanoparticle suspension for metal interconnects | |
Zhang et al. | PVP-mediated galvanic replacement synthesis of smart elliptic Cu–Ag nanoflakes for electrically conductive pastes | |
CN111906321B (zh) | 焊膏用金属纳米颗粒分散液及其制造方法,以及焊膏及其制造方法 | |
TW200305619A (en) | Electroconductive composition, electroconductive coating and method of producing the electroconductive coating | |
WO2007111996A2 (en) | Conducting polymer ink | |
JP2005507452A5 (ja) | ||
JP2004273205A (ja) | 導電性ナノ粒子ペースト | |
Mathias et al. | Morphology control in biphasic hybrid systems of semiconducting materials | |
CN101608075A (zh) | 非水性导电纳米油墨组合物 | |
WO2009115643A2 (en) | Novel materials and methods | |
Yu et al. | Morphology, Electrical, and Rheological Properties of Silane‐Modified Silver Nanowire/Polymer Composites | |
JP4638825B2 (ja) | 多成分系金属粒子スラリー及びそのスラリーを用いた導電性インク又は導電性ペースト | |
Mir et al. | One‐Pot Fabrication of Hollow Polymer@ Ag Nanospheres for Printable Translucent Conductive Coatings | |
Yang et al. | Preparation and conductive mechanism of copper nanoparticles ink | |
Pajor-Świerzy et al. | The conductive properties of ink coating based on Ni–Ag core–shell nanoparticles with the bimodal size distribution | |
JP2005281781A (ja) | 銅ナノ粒子の製造方法 | |
KR101635848B1 (ko) | 탄소 비결합성 금속 나노입자가 함유된 잉크 기제 제조 방법 및 금속 나노입자가 분산된 잉크 | |
Lee et al. | A modular solder system with hierarchical morphology and backward compatibility | |
KR101239238B1 (ko) | 주석계 나노 입자가 첨가된 은 복합 잉크의 제조 방법과 그에 의한 은 복합 잉크 및 그 소결 방법과 은 복합 잉크의 소결체 | |
Sakurai et al. | Filtration-induced production of conductive/robust Cu films on cellulose paper by low-temperature sintering in air |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20131112 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140610 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140722 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20141021 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20141028 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150122 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20150414 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150812 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20150819 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20150911 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20161114 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20161215 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20170106 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170215 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20170216 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170727 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6185240 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |