JP6180433B2 - 昇降装置および小型製造装置 - Google Patents
昇降装置および小型製造装置 Download PDFInfo
- Publication number
- JP6180433B2 JP6180433B2 JP2014550989A JP2014550989A JP6180433B2 JP 6180433 B2 JP6180433 B2 JP 6180433B2 JP 2014550989 A JP2014550989 A JP 2014550989A JP 2014550989 A JP2014550989 A JP 2014550989A JP 6180433 B2 JP6180433 B2 JP 6180433B2
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- JP
- Japan
- Prior art keywords
- semiconductor wafer
- lifting device
- substrate
- processing substrate
- support portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
[発明の実施の形態1]
図1乃至図4には、本発明の実施の形態1を示す。
[発明のその他の実施の形態]
なお、上述した実施の形態1では、半導体ウェハ300を用いる半導体製造装置を例に採って説明したが、本発明は、他の種類の基板(例えば、サファイア基板等の絶縁性基板や、アルミニウム基板等の導電性基板)や、非円盤形状(例えば、矩形)の処理基板からデバイスを製造する製造装置にも適用することができる。
110 レジスト塗布装置
120 装置前室
210 搬送ユニット
220 HMDS処理ユニット
221 ホットプレート
222 ピン部材
223 昇降装置
224 基板支持部
225 ガイド部
226 下部
227 上部
230 コーターカップ部
240 レジストノズル
250 EBRノズル
260 ベーク処理ユニット
261 ホットプレート
263 昇降装置
300 半導体ウェハ(処理基板)
301 下面
302 側面
CT1 位置決め中心
Claims (4)
- 処理基板を、所定の位置に位置決めされた状態で、昇降自在に支持する昇降装置であって、
所定の位置決め中心を中心とする円周上に配置された3つ以上の昇降自在のピン部材を有し、
前記各ピン部材はそれぞれ、前記処理基板の下面に接触して当該処理基板をほぼ水平に支持する基板支持部と、この基板支持部と一体に形成され、前記処理基板の側面に接触して当該処理基板をその中心が前記位置決め中心に近付くように案内するガイド部とを有し、
前記各ピン部材はそれぞれ少なくとも上部がほぼ板状を呈しており、
該板状の部分の横側端面が前記位置決め中心に対向するように、放射状に配置されており、
該板状の部分は、前記基板支持部が薄板状に形成されているとともに、該基板支持部より厚く形成された部分を有している、
ことを特徴とする昇降装置。 - 前記ガイド部は、前記基板支持部より上方へ突出し、前記位置決め中心側を向く形でテーパ状に形成されていることを特徴とする請求項1に記載の昇降装置。
- 前記処理基板は、直径が20mm以下であることを特徴とする請求項1に記載の昇降装置。
- 請求項1に記載の昇降装置を備えていることを特徴とする小型製造装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012265079 | 2012-12-04 | ||
JP2012265079 | 2012-12-04 | ||
PCT/JP2013/079254 WO2014087762A1 (ja) | 2012-12-04 | 2013-10-29 | 昇降装置および小型製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014087762A1 JPWO2014087762A1 (ja) | 2017-01-05 |
JP6180433B2 true JP6180433B2 (ja) | 2017-08-16 |
Family
ID=50883189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014550989A Active JP6180433B2 (ja) | 2012-12-04 | 2013-10-29 | 昇降装置および小型製造装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6180433B2 (ja) |
WO (1) | WO2014087762A1 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04167541A (ja) * | 1990-10-31 | 1992-06-15 | Fujitsu Ltd | 基板の位置決め方法とその装置 |
JPH08186074A (ja) * | 1994-12-28 | 1996-07-16 | Hitachi Ltd | スパッタリング装置 |
JPH11274124A (ja) * | 1998-03-26 | 1999-10-08 | Shibaura Mechatronics Corp | スピン処理装置 |
JP4255014B2 (ja) * | 2002-12-03 | 2009-04-15 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
CN100585812C (zh) * | 2005-04-19 | 2010-01-27 | 株式会社荏原制作所 | 基板处理设备 |
JP4954255B2 (ja) * | 2009-09-25 | 2012-06-13 | 東京エレクトロン株式会社 | 静電吸着部材、静電吸着部材保持機構、搬送モジュール、半導体製造装置及び搬送方法 |
-
2013
- 2013-10-29 WO PCT/JP2013/079254 patent/WO2014087762A1/ja active Application Filing
- 2013-10-29 JP JP2014550989A patent/JP6180433B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JPWO2014087762A1 (ja) | 2017-01-05 |
WO2014087762A1 (ja) | 2014-06-12 |
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