JP6161201B2 - 半導体センサデバイスのパッケージングおよび方法 - Google Patents

半導体センサデバイスのパッケージングおよび方法 Download PDF

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Publication number
JP6161201B2
JP6161201B2 JP2013202874A JP2013202874A JP6161201B2 JP 6161201 B2 JP6161201 B2 JP 6161201B2 JP 2013202874 A JP2013202874 A JP 2013202874A JP 2013202874 A JP2013202874 A JP 2013202874A JP 6161201 B2 JP6161201 B2 JP 6161201B2
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Japan
Prior art keywords
gel
layer
lid
cavity
baffle
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JP2013202874A
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English (en)
Japanese (ja)
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JP2014085337A (ja
JP2014085337A5 (enExample
Inventor
エム．ヒギンズ ザ サード レオ
エム．ヒギンズ ザ サード レオ
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NXP USA Inc
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NXP USA Inc
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Publication of JP2014085337A5 publication Critical patent/JP2014085337A5/ja
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G01L19/0636—Protection against aggressive medium in general using particle filters
    • H10W72/884—
    • H10W90/753—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
JP2013202874A 2012-10-22 2013-09-30 半導体センサデバイスのパッケージングおよび方法 Active JP6161201B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/657,250 2012-10-22
US13/657,250 US8946833B2 (en) 2012-10-22 2012-10-22 Packaging for semiconductor sensor devices and methods

Publications (3)

Publication Number Publication Date
JP2014085337A JP2014085337A (ja) 2014-05-12
JP2014085337A5 JP2014085337A5 (enExample) 2016-11-17
JP6161201B2 true JP6161201B2 (ja) 2017-07-12

Family

ID=49485484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013202874A Active JP6161201B2 (ja) 2012-10-22 2013-09-30 半導体センサデバイスのパッケージングおよび方法

Country Status (4)

Country Link
US (1) US8946833B2 (enExample)
EP (1) EP2722660B1 (enExample)
JP (1) JP6161201B2 (enExample)
CN (1) CN103776580B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9476788B2 (en) * 2014-04-22 2016-10-25 Freescale Semiconductor, Inc. Semiconductor sensor with gel filled cavity
CN105300593B (zh) * 2014-07-28 2018-12-28 恩智浦美国有限公司 具有盖的封装的半导体传感器装置
DE102016201847A1 (de) 2015-05-28 2016-12-01 Robert Bosch Gmbh Vorrichtung zur Erfassung eines Drucks eines fluiden Mediums und Verfahren zur Herstellung der Vorrichtung
US10244644B2 (en) * 2015-12-04 2019-03-26 Continental Automotive Systems, Inc. Automotive electronic device having a cover with fins to reduce gel vibration
CN108344530A (zh) * 2017-01-24 2018-07-31 英属开曼群岛商智动全球股份有限公司 力量传感器
US20180335360A1 (en) * 2017-05-16 2018-11-22 Honeywell International Inc. Ported Pressure Sensor With No Internally Trapped Fluid
US11225409B2 (en) 2018-09-17 2022-01-18 Invensense, Inc. Sensor with integrated heater
US10787361B2 (en) 2018-10-30 2020-09-29 Nxp Usa, Inc. Sensor device with flip-chip die and interposer
US11532532B2 (en) * 2019-05-08 2022-12-20 Nxp Usa, Inc. Composite media protection for pressure sensor
CN116324364A (zh) * 2020-09-30 2023-06-23 株式会社村田制作所 压力传感器及其制造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2764113B1 (fr) 1997-05-28 2000-08-04 Motorola Semiconducteurs Dispositif capteur et son procede de fabrication
CN1213476C (zh) 1998-06-24 2005-08-03 约翰逊·马太电子公司 具有纤维接合层的电子器件
JP2000346736A (ja) 1999-06-02 2000-12-15 Saginomiya Seisakusho Inc 半導体式圧力センサ
DE29922992U1 (de) * 1999-12-30 2000-03-23 Aktiv-Sensor GmbH, 14532 Stahnsdorf Druckmesselement mit piezoresistiven Halbleiterelementen
US6401545B1 (en) * 2000-01-25 2002-06-11 Motorola, Inc. Micro electro-mechanical system sensor with selective encapsulation and method therefor
DE20206474U1 (de) * 2002-04-24 2003-09-04 B. Braun Melsungen Ag, 34212 Melsungen Drucksensor für Infusionsschlauchpumpen
US6732590B1 (en) * 2002-11-20 2004-05-11 Infineon Technologies Ag Pressure sensor and process for producing the pressure sensor
ITMI20070099A1 (it) * 2007-01-24 2008-07-25 St Microelectronics Srl Dispositivo elettronico comprendente dispositivi sensori differenziali mems e substrati bucati
JP2009063352A (ja) 2007-09-05 2009-03-26 Nissan Motor Co Ltd ガス物理量検出装置，燃料電池システム，車両
JP2009103602A (ja) 2007-10-24 2009-05-14 Denso Corp 圧力センサ
FR2940904B1 (fr) * 2009-01-13 2012-08-31 Urgo Laboratoires Systeme de mesure de pression d'interface
US20100289055A1 (en) 2009-05-14 2010-11-18 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Silicone leaded chip carrier
DE102010030960B4 (de) * 2010-07-06 2020-12-10 Robert Bosch Gmbh Verfahren zur Herstellung eines schwingungsgedämpften Bauteils
US8230743B2 (en) 2010-08-23 2012-07-31 Honeywell International Inc. Pressure sensor
CN102183441B (zh) * 2011-02-18 2012-12-12 华东理工大学 一种软物质材料的表面粘附能和弹性模量的测量方法

Also Published As

Publication number Publication date
EP2722660A3 (en) 2014-04-30
JP2014085337A (ja) 2014-05-12
CN103776580B (zh) 2018-01-12
EP2722660A2 (en) 2014-04-23
CN103776580A (zh) 2014-05-07
EP2722660B1 (en) 2015-12-30
US20140110801A1 (en) 2014-04-24
US8946833B2 (en) 2015-02-03

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