JP2014085337A5 - - Google Patents

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Publication number
JP2014085337A5
JP2014085337A5 JP2013202874A JP2013202874A JP2014085337A5 JP 2014085337 A5 JP2014085337 A5 JP 2014085337A5 JP 2013202874 A JP2013202874 A JP 2013202874A JP 2013202874 A JP2013202874 A JP 2013202874A JP 2014085337 A5 JP2014085337 A5 JP 2014085337A5
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JP
Japan
Prior art keywords
gel
layer
cavity
baffle
sensing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013202874A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014085337A (ja
JP6161201B2 (ja
Filing date
Publication date
Priority claimed from US13/657,250 external-priority patent/US8946833B2/en
Application filed filed Critical
Publication of JP2014085337A publication Critical patent/JP2014085337A/ja
Publication of JP2014085337A5 publication Critical patent/JP2014085337A5/ja
Application granted granted Critical
Publication of JP6161201B2 publication Critical patent/JP6161201B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013202874A 2012-10-22 2013-09-30 半導体センサデバイスのパッケージングおよび方法 Active JP6161201B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/657,250 US8946833B2 (en) 2012-10-22 2012-10-22 Packaging for semiconductor sensor devices and methods
US13/657,250 2012-10-22

Publications (3)

Publication Number Publication Date
JP2014085337A JP2014085337A (ja) 2014-05-12
JP2014085337A5 true JP2014085337A5 (enExample) 2016-11-17
JP6161201B2 JP6161201B2 (ja) 2017-07-12

Family

ID=49485484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013202874A Active JP6161201B2 (ja) 2012-10-22 2013-09-30 半導体センサデバイスのパッケージングおよび方法

Country Status (4)

Country Link
US (1) US8946833B2 (enExample)
EP (1) EP2722660B1 (enExample)
JP (1) JP6161201B2 (enExample)
CN (1) CN103776580B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9476788B2 (en) * 2014-04-22 2016-10-25 Freescale Semiconductor, Inc. Semiconductor sensor with gel filled cavity
CN105300593B (zh) * 2014-07-28 2018-12-28 恩智浦美国有限公司 具有盖的封装的半导体传感器装置
DE102016201847A1 (de) 2015-05-28 2016-12-01 Robert Bosch Gmbh Vorrichtung zur Erfassung eines Drucks eines fluiden Mediums und Verfahren zur Herstellung der Vorrichtung
US10244644B2 (en) * 2015-12-04 2019-03-26 Continental Automotive Systems, Inc. Automotive electronic device having a cover with fins to reduce gel vibration
CN108344530A (zh) * 2017-01-24 2018-07-31 英属开曼群岛商智动全球股份有限公司 力量传感器
US20180335360A1 (en) * 2017-05-16 2018-11-22 Honeywell International Inc. Ported Pressure Sensor With No Internally Trapped Fluid
US11225409B2 (en) 2018-09-17 2022-01-18 Invensense, Inc. Sensor with integrated heater
US10787361B2 (en) 2018-10-30 2020-09-29 Nxp Usa, Inc. Sensor device with flip-chip die and interposer
US11532532B2 (en) * 2019-05-08 2022-12-20 Nxp Usa, Inc. Composite media protection for pressure sensor
WO2022070571A1 (ja) * 2020-09-30 2022-04-07 株式会社村田製作所 圧力センサおよびその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2764113B1 (fr) 1997-05-28 2000-08-04 Motorola Semiconducteurs Dispositif capteur et son procede de fabrication
JP2002519846A (ja) 1998-06-24 2002-07-02 ジョンソン マシュー エレクトロニクス インコーポレイテッド 繊維状インタフェースを有する電気素子
JP2000346736A (ja) 1999-06-02 2000-12-15 Saginomiya Seisakusho Inc 半導体式圧力センサ
DE29922992U1 (de) * 1999-12-30 2000-03-23 Aktiv-Sensor GmbH, 14532 Stahnsdorf Druckmesselement mit piezoresistiven Halbleiterelementen
US6401545B1 (en) * 2000-01-25 2002-06-11 Motorola, Inc. Micro electro-mechanical system sensor with selective encapsulation and method therefor
DE20206474U1 (de) * 2002-04-24 2003-09-04 B. Braun Melsungen Ag, 34212 Melsungen Drucksensor für Infusionsschlauchpumpen
US6732590B1 (en) * 2002-11-20 2004-05-11 Infineon Technologies Ag Pressure sensor and process for producing the pressure sensor
ITMI20070099A1 (it) * 2007-01-24 2008-07-25 St Microelectronics Srl Dispositivo elettronico comprendente dispositivi sensori differenziali mems e substrati bucati
JP2009063352A (ja) 2007-09-05 2009-03-26 Nissan Motor Co Ltd ガス物理量検出装置，燃料電池システム，車両
JP2009103602A (ja) 2007-10-24 2009-05-14 Denso Corp 圧力センサ
FR2940904B1 (fr) * 2009-01-13 2012-08-31 Urgo Laboratoires Systeme de mesure de pression d'interface
US20100289055A1 (en) 2009-05-14 2010-11-18 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Silicone leaded chip carrier
DE102010030960B4 (de) * 2010-07-06 2020-12-10 Robert Bosch Gmbh Verfahren zur Herstellung eines schwingungsgedämpften Bauteils
US8230743B2 (en) 2010-08-23 2012-07-31 Honeywell International Inc. Pressure sensor
CN102183441B (zh) * 2011-02-18 2012-12-12 华东理工大学 一种软物质材料的表面粘附能和弹性模量的测量方法

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