JP6150500B2 - 配列用マスク - Google Patents

配列用マスク Download PDF

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Publication number
JP6150500B2
JP6150500B2 JP2012256573A JP2012256573A JP6150500B2 JP 6150500 B2 JP6150500 B2 JP 6150500B2 JP 2012256573 A JP2012256573 A JP 2012256573A JP 2012256573 A JP2012256573 A JP 2012256573A JP 6150500 B2 JP6150500 B2 JP 6150500B2
Authority
JP
Japan
Prior art keywords
opening
mask
shape
solder ball
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012256573A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014107282A5 (enrdf_load_stackoverflow
JP2014107282A (ja
Inventor
良弘 小林
良弘 小林
裕仁 田丸
裕仁 田丸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Hitachi Maxell Energy Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Energy Ltd filed Critical Hitachi Maxell Energy Ltd
Priority to JP2012256573A priority Critical patent/JP6150500B2/ja
Priority to KR1020130096587A priority patent/KR20140066080A/ko
Priority to CN201310383108.9A priority patent/CN103839843A/zh
Publication of JP2014107282A publication Critical patent/JP2014107282A/ja
Publication of JP2014107282A5 publication Critical patent/JP2014107282A5/ja
Application granted granted Critical
Publication of JP6150500B2 publication Critical patent/JP6150500B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
    • H01L2224/10135—Alignment aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2012256573A 2012-11-22 2012-11-22 配列用マスク Active JP6150500B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012256573A JP6150500B2 (ja) 2012-11-22 2012-11-22 配列用マスク
KR1020130096587A KR20140066080A (ko) 2012-11-22 2013-08-14 배열용 마스크
CN201310383108.9A CN103839843A (zh) 2012-11-22 2013-08-29 排列用掩模

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012256573A JP6150500B2 (ja) 2012-11-22 2012-11-22 配列用マスク

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016171741A Division JP6277239B2 (ja) 2016-09-02 2016-09-02 配列用マスク

Publications (3)

Publication Number Publication Date
JP2014107282A JP2014107282A (ja) 2014-06-09
JP2014107282A5 JP2014107282A5 (enrdf_load_stackoverflow) 2015-03-12
JP6150500B2 true JP6150500B2 (ja) 2017-06-21

Family

ID=50803223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012256573A Active JP6150500B2 (ja) 2012-11-22 2012-11-22 配列用マスク

Country Status (3)

Country Link
JP (1) JP6150500B2 (enrdf_load_stackoverflow)
KR (1) KR20140066080A (enrdf_load_stackoverflow)
CN (1) CN103839843A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201602715A (zh) * 2014-07-07 2016-01-16 Hitachi Maxell 配列用遮罩及其製造方法
JP6381322B2 (ja) * 2014-07-07 2018-08-29 マクセルホールディングス株式会社 配列用マスク
TWI582873B (zh) * 2015-02-26 2017-05-11 Hitachi Maxell A masking method for manufacturing the same, and a method of manufacturing the solder bump
TWI610376B (zh) * 2016-01-19 2018-01-01 日立麥克賽爾股份有限公司 配列用遮罩及其製造方法、焊料凸塊之形成方法
JP2018170529A (ja) * 2018-07-31 2018-11-01 マクセルホールディングス株式会社 配列用マスク
JP7170456B2 (ja) * 2018-08-09 2022-11-14 マクセル株式会社 配列用マスク
JP7256083B2 (ja) 2019-07-02 2023-04-11 マクセル株式会社 配列用マスク

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3497550B2 (ja) * 1994-03-14 2004-02-16 株式会社東芝 バンプの形成方法
JPH08264932A (ja) * 1995-03-23 1996-10-11 Hitachi Techno Eng Co Ltd はんだバンプ形成法
JP2004253770A (ja) * 2003-01-31 2004-09-09 Hitachi Metals Ltd 導電性ボールの配列方法および配列装置
JP2009182068A (ja) * 2008-01-30 2009-08-13 Kyushu Hitachi Maxell Ltd 配列用マスク及びその製造方法
JP2012227466A (ja) * 2011-04-22 2012-11-15 Bonmaaku:Kk ボール搭載マスク

Also Published As

Publication number Publication date
CN103839843A (zh) 2014-06-04
KR20140066080A (ko) 2014-05-30
JP2014107282A (ja) 2014-06-09

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