JP6142771B2 - ブレイク装置 - Google Patents

ブレイク装置 Download PDF

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Publication number
JP6142771B2
JP6142771B2 JP2013221738A JP2013221738A JP6142771B2 JP 6142771 B2 JP6142771 B2 JP 6142771B2 JP 2013221738 A JP2013221738 A JP 2013221738A JP 2013221738 A JP2013221738 A JP 2013221738A JP 6142771 B2 JP6142771 B2 JP 6142771B2
Authority
JP
Japan
Prior art keywords
break
substrate
break bar
heater
brittle material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013221738A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015084349A (ja
Inventor
佑磨 岩坪
佑磨 岩坪
村上　健二
健二 村上
武田　真和
真和 武田
木下　知子
知子 木下
博之 富本
博之 富本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2013221738A priority Critical patent/JP6142771B2/ja
Priority to TW103121419A priority patent/TWI596065B/zh
Priority to CN201410310303.3A priority patent/CN104552623B/zh
Priority to KR1020140097072A priority patent/KR20150048022A/ko
Publication of JP2015084349A publication Critical patent/JP2015084349A/ja
Application granted granted Critical
Publication of JP6142771B2 publication Critical patent/JP6142771B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/10—Means for treating work or cutting member to facilitate cutting by heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006—Cutting members therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/04—Severing by squeezing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Details Of Cutting Devices (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP2013221738A 2013-10-25 2013-10-25 ブレイク装置 Expired - Fee Related JP6142771B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013221738A JP6142771B2 (ja) 2013-10-25 2013-10-25 ブレイク装置
TW103121419A TWI596065B (zh) 2013-10-25 2014-06-20 Breaking device
CN201410310303.3A CN104552623B (zh) 2013-10-25 2014-07-01 切断装置
KR1020140097072A KR20150048022A (ko) 2013-10-25 2014-07-30 브레이크 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013221738A JP6142771B2 (ja) 2013-10-25 2013-10-25 ブレイク装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017084983A Division JP2017128137A (ja) 2017-04-24 2017-04-24 ブレイク装置

Publications (2)

Publication Number Publication Date
JP2015084349A JP2015084349A (ja) 2015-04-30
JP6142771B2 true JP6142771B2 (ja) 2017-06-07

Family

ID=53047834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013221738A Expired - Fee Related JP6142771B2 (ja) 2013-10-25 2013-10-25 ブレイク装置

Country Status (4)

Country Link
JP (1) JP6142771B2 (zh)
KR (1) KR20150048022A (zh)
CN (1) CN104552623B (zh)
TW (1) TWI596065B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6481465B2 (ja) * 2014-08-21 2019-03-13 三星ダイヤモンド工業株式会社 複合基板のブレイク方法
JP6578759B2 (ja) * 2015-06-29 2019-09-25 三星ダイヤモンド工業株式会社 ブレイク装置
JP6716402B2 (ja) * 2016-09-09 2020-07-01 株式会社ディスコ ウェーハの加工方法
JP7020675B2 (ja) * 2018-02-26 2022-02-16 三星ダイヤモンド工業株式会社 Ｌｏｗ－ｋ膜付きウエハの分断方法
JP6996459B2 (ja) * 2018-09-06 2022-01-17 三菱電機株式会社 物理量検出センサの製造方法、物理量検出センサ

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5984546A (ja) * 1982-11-08 1984-05-16 Hitachi Yonezawa Denshi Kk ウエハブレ−カ−
JPS6333842A (ja) * 1986-07-28 1988-02-13 Hitachi Cable Ltd 化合物半導体ウエハのスクライブ方法
JPH01122408A (ja) * 1987-11-06 1989-05-15 Ngk Insulators Ltd セラミック・グリーンシートの切断加工方法
JPH05221673A (ja) * 1992-02-14 1993-08-31 Taketoshi Nojima 割断加工方法
JPH06302692A (ja) * 1993-04-13 1994-10-28 Toshiba Corp 半導体装置の製造装置および方法
DE19851353C1 (de) * 1998-11-06 1999-10-07 Schott Glas Verfahren und Vorrichtung zum Schneiden eines Laminats aus einem sprödbrüchigen Werkstoff und einem Kunststoff
JP2006016276A (ja) * 2004-07-05 2006-01-19 Shiraitekku:Kk 分断方法及びその装置
JP4065280B2 (ja) * 2005-05-19 2008-03-19 株式会社グラスアシスト 合わせ板ガラスの切断方法および切断用加熱器具
JP2009166169A (ja) * 2008-01-15 2009-07-30 Mitsuboshi Diamond Industrial Co Ltd カッター装置
JP2011060985A (ja) * 2009-09-10 2011-03-24 Murata Mfg Co Ltd 電子部品の製造方法
JP2011084423A (ja) * 2009-10-14 2011-04-28 Nagasaki Univ 熱応力割断装置、及び熱応力割断方法
JP5161927B2 (ja) * 2010-07-05 2013-03-13 三星ダイヤモンド工業株式会社 分断装置
JP5657946B2 (ja) * 2010-08-05 2015-01-21 株式会社ディスコ 分割方法
JP2012188337A (ja) * 2011-03-14 2012-10-04 Nippon Electric Glass Co Ltd ガラス板の加工治具
CN202640452U (zh) * 2012-07-05 2013-01-02 张家港市民扬塑胶科技有限公司 Pet薄板的幅宽切边装置

Also Published As

Publication number Publication date
KR20150048022A (ko) 2015-05-06
CN104552623B (zh) 2018-09-18
JP2015084349A (ja) 2015-04-30
CN104552623A (zh) 2015-04-29
TWI596065B (zh) 2017-08-21
TW201516011A (zh) 2015-05-01

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