JP6138698B2 - プリント回路基板アセンブリ - Google Patents

プリント回路基板アセンブリ Download PDF

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Publication number
JP6138698B2
JP6138698B2 JP2013550996A JP2013550996A JP6138698B2 JP 6138698 B2 JP6138698 B2 JP 6138698B2 JP 2013550996 A JP2013550996 A JP 2013550996A JP 2013550996 A JP2013550996 A JP 2013550996A JP 6138698 B2 JP6138698 B2 JP 6138698B2
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JP
Japan
Prior art keywords
electronic components
substrate
category
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013550996A
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English (en)
Japanese (ja)
Other versions
JP2014504031A (ja
JP2014504031A5 (https=
Inventor
ハンフェン ジ
ハンフェン ジ
アブラハム ルドルフ バルケンデ
アブラハム ルドルフ バルケンデ
ホン チェン
ホン チェン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Signify Holding BV
Original Assignee
Signify Holding BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Signify Holding BV filed Critical Signify Holding BV
Publication of JP2014504031A publication Critical patent/JP2014504031A/ja
Publication of JP2014504031A5 publication Critical patent/JP2014504031A5/ja
Application granted granted Critical
Publication of JP6138698B2 publication Critical patent/JP6138698B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/047—Soldering with different solders, e.g. two different solders on two sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Processing Of Solid Wastes (AREA)
JP2013550996A 2011-01-30 2012-01-30 プリント回路基板アセンブリ Expired - Fee Related JP6138698B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CNPCT/CN2011/070824 2011-01-30
CN2011070824 2011-01-30
PCT/IB2012/050408 WO2012101611A1 (en) 2011-01-30 2012-01-30 Printed circuit board assembly

Publications (3)

Publication Number Publication Date
JP2014504031A JP2014504031A (ja) 2014-02-13
JP2014504031A5 JP2014504031A5 (https=) 2015-03-26
JP6138698B2 true JP6138698B2 (ja) 2017-05-31

Family

ID=45768261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013550996A Expired - Fee Related JP6138698B2 (ja) 2011-01-30 2012-01-30 プリント回路基板アセンブリ

Country Status (6)

Country Link
US (1) US9113584B2 (https=)
EP (1) EP2668834A1 (https=)
JP (1) JP6138698B2 (https=)
BR (1) BR112013019109A2 (https=)
RU (1) RU2614387C2 (https=)
WO (1) WO2012101611A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10772249B2 (en) * 2015-03-18 2020-09-08 Mycronic AB Method, system and device for providing and changing information related to an SMT job
CN105791725A (zh) * 2016-03-14 2016-07-20 东莞康佳电子有限公司 超高清人机交互电视生产线工艺
GB2555659B (en) * 2016-11-07 2020-01-15 Cirrus Logic Int Semiconductor Ltd Package for MEMS device and process
DE102022113851A1 (de) * 2022-06-01 2023-12-07 Ersa Gmbh System zur Bestimmung von Verschmutzungskoeffizienten und/oder Verschmutzungsgraden insbesondere beim Reflowlöten von Leiterplatten und zugehörige Auswerteinheit
DE102024131479A1 (de) * 2024-10-29 2026-04-30 Tridonic Gmbh & Co Kg Leiterplatte und verfahren zum trennen von bauteilen von einem träger einer leiterplatte und vorzugsweise recyceln dieser bauteile

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4561006A (en) 1982-07-06 1985-12-24 Sperry Corporation Integrated circuit package with integral heating circuit
US5241454A (en) 1992-01-22 1993-08-31 International Business Machines Corporation Mutlilayered flexible circuit package
JPH06260731A (ja) * 1993-03-08 1994-09-16 Hitachi Ltd プリント回路基板および該プリント回路基板を備えた回路装置
JPH09103761A (ja) * 1995-10-12 1997-04-22 Hitachi Ltd 電子部品搭載プリント配線基板の処理方法及びその装置
JPH10303523A (ja) * 1997-04-30 1998-11-13 Ricoh Co Ltd プリント回路基板
JP3603605B2 (ja) * 1998-08-04 2004-12-22 株式会社日立製作所 プリント板のリサイクル方法及びその装置
EP1156706B1 (en) * 1999-01-11 2003-10-08 Matsushita Electric Industrial Co., Ltd. A method for recycling wastes of an article having a circuit soldered with parts
JP3365364B2 (ja) * 1999-08-31 2003-01-08 千住金属工業株式会社 プリント基板
JP2001135928A (ja) * 1999-11-08 2001-05-18 Pfu Ltd 再利用装置および再利用方法
JP2001203447A (ja) * 2000-01-18 2001-07-27 Minolta Co Ltd 部品を保持した保持部材、プリント板実装品、及びプリント板実装品の部品分別方法
JP3463685B2 (ja) * 2002-02-04 2003-11-05 株式会社日立製作所 分解方法およびリサイクル方法
US20040181923A1 (en) * 2003-03-17 2004-09-23 Dills James Carl Process for reusing and recycling circuit boards
US6910615B2 (en) * 2003-03-27 2005-06-28 International Business Machines Corporation Solder reflow type electrical apparatus packaging having integrated circuit and discrete components
DE102004003521B3 (de) * 2004-01-21 2005-02-17 Siemens Ag Reparaturlötkopf mit einem Zuführkanal für ein Wärmeübertragungsmedium und dessen Verwendung
WO2007077594A1 (ja) 2005-12-28 2007-07-12 Fujitsu Limited はんだ除去装置、はんだ除去方法
US20090033337A1 (en) * 2007-08-03 2009-02-05 Pasco Robert W Temporary chip attach test carrier utilizing an interposer
KR101364538B1 (ko) 2007-12-12 2014-02-18 삼성전자주식회사 적어도 2종의 전자 부품들의 실장 방법 및 실장 장치
US7781232B2 (en) * 2008-01-17 2010-08-24 International Business Machines Corporation Method to recover underfilled modules by selective removal of discrete components
US8293388B2 (en) * 2009-03-02 2012-10-23 Rocky Research Thermal energy battery and method for cooling temperature sensitive components
JP2012094609A (ja) * 2010-10-26 2012-05-17 Panasonic Corp 電子回路装置および電子回路装置の分別方法

Also Published As

Publication number Publication date
RU2614387C2 (ru) 2017-03-27
JP2014504031A (ja) 2014-02-13
EP2668834A1 (en) 2013-12-04
BR112013019109A2 (pt) 2017-11-07
WO2012101611A1 (en) 2012-08-02
US20130314885A1 (en) 2013-11-28
RU2013140175A (ru) 2015-03-10
US9113584B2 (en) 2015-08-18

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