JP6133403B2 - 組付けのための構成を備えた光学モジュール - Google Patents
組付けのための構成を備えた光学モジュール Download PDFInfo
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- JP6133403B2 JP6133403B2 JP2015509319A JP2015509319A JP6133403B2 JP 6133403 B2 JP6133403 B2 JP 6133403B2 JP 2015509319 A JP2015509319 A JP 2015509319A JP 2015509319 A JP2015509319 A JP 2015509319A JP 6133403 B2 JP6133403 B2 JP 6133403B2
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- 230000003287 optical effect Effects 0.000 title claims description 65
- 239000000758 substrate Substances 0.000 claims description 31
- 229920001296 polysiloxane Polymers 0.000 claims description 11
- 238000005286 illumination Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 239000002861 polymer material Substances 0.000 claims description 3
- 238000005266 casting Methods 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000014759 maintenance of location Effects 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
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- 238000009792 diffusion process Methods 0.000 description 1
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- 239000004922 lacquer Substances 0.000 description 1
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- 239000007779 soft material Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/69—Details of refractors forming part of the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B3/00—Drying solid materials or objects by processes involving the application of heat
- F26B3/28—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0268—Diffusing elements; Afocal elements characterized by the fabrication or manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0273—Diffusing elements; Afocal elements characterized by the use
- G02B5/0278—Diffusing elements; Afocal elements characterized by the use used in transmission
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/003—Alignment of optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- Microbiology (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Description
Claims (12)
- 光学モジュールであって、
互いに反対側に位置する2つの表面(1a,1b)と1つの縁部(1c)とを有する、確定された形状の基板(1)と、
前記両表面(1a,1b)のうちの少なくとも1つの表面に、該表面を覆うように被着された層(2)と、を有しており、
該層(2)は、透明なポリマ材料から成っていて、少なくとも1つの光学素子(3)を有しており、該光学素子(3)を用いて、前記基板(1)を起点として前記光学素子(3)を透過する光線が、屈折させられる光学モジュールにおいて、
前記層(2)の組付け領域に、当該光学モジュールの組付け及び/又は調整のための構成(4,5)が設けられており、該構成は、材料均一にかつ前記層(2)と一体に構成されており、組付け及び/又は調整のための前記構成(4,5)は、前記層(2)の表面を越えて突出する少なくとも1つの突出部(5)を有していて、当該光学モジュールのための保持装置のクランプジョー(6,7)が、前記突出部(5)に接触していることを特徴とする、光学モジュール。 - 前記層(2)は、シリコーンから成っている、請求項1記載の光学モジュール。
- 組付け及び/又は調整のための前記構成(4,5)は、調整方向において寸法通りに位置決めするストッパ(4)を有している、請求項1又は2項記載の光学モジュール。
- 前記ストッパ(4)は、前記層(2)による前記基板(1)の前記縁部(1c)の被覆部に形成されており、前記調整方向は、前記基板(1)の表面に対して少なくともほぼ平行に延びている、請求項3記載の光学モジュール。
- 前記調整方向における前記ストッパ(4)の位置の精度は、調整方向における光学モジュールの長さの20パーミル以下である、請求項3又は4項記載の光学モジュール。
- 組付け及び/又は調整のための前記構成は、別の光学モジュールの構成との、少なくとも1つの方向における形状結合式の係合のために形成されている、請求項1から5までのいずれか1項記載の光学モジュール。
- 前記層は、10〜90の範囲のショアA硬度を有している、請求項1から6までのいずれか1項記載の光学モジュール。
- 前記基板は、1つの担体(1)と該担体に配置された少なくとも1つのLEDとを備えた、チップ・オン・ボード・モジュールを含む、請求項1から7までのいずれか1項記載の光学モジュール。
- 前記基板は、光透過性又は光反射性の担体(1)を含んでいて、前記担体(1)及び前記層(2)によって全体として、光線の所望の屈折を得るための光学系が形成されている、請求項1から7までのいずれか1項記載の光学モジュール。
- 請求項1から9までのいずれか1項記載の光学モジュールを備えた照明を有する、コーティングを乾燥させる装置。
- 乾燥させられるコーティングを備えた面状の基板と、照明とが、搬送方向において相対的に可動であり、照明は横方向において少なくとも部分的に、前記基板の幅にわたって延在していて、確定された間隔をおいて前記基板の上方に配置されている、請求項10記載の装置。
- 特に印刷法におけるコーティングを乾燥させるための、請求項1から11までのいずれか1項記載の光学モジュールの使用。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012008637A DE102012008637A1 (de) | 2012-05-02 | 2012-05-02 | Optisches Modul mit Ausformung zur Montage |
DE102012008637.7 | 2012-05-02 | ||
PCT/EP2013/000862 WO2013164054A1 (de) | 2012-05-02 | 2013-03-21 | Optisches modul mit ausformung zur montage |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015522835A JP2015522835A (ja) | 2015-08-06 |
JP6133403B2 true JP6133403B2 (ja) | 2017-05-24 |
Family
ID=48050653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015509319A Expired - Fee Related JP6133403B2 (ja) | 2012-05-02 | 2013-03-21 | 組付けのための構成を備えた光学モジュール |
Country Status (9)
Country | Link |
---|---|
US (1) | US10185112B2 (ja) |
EP (1) | EP2844475B1 (ja) |
JP (1) | JP6133403B2 (ja) |
KR (1) | KR101687087B1 (ja) |
CN (1) | CN104395084B (ja) |
CA (1) | CA2872077C (ja) |
DE (1) | DE102012008637A1 (ja) |
HK (1) | HK1203905A1 (ja) |
WO (1) | WO2013164054A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3366474B1 (en) * | 2017-02-22 | 2020-06-24 | KBA-NotaSys SA | Printing press with in-line casting device for the replication and formation of a micro-optical structure |
DE102017108688B4 (de) * | 2017-04-24 | 2022-08-04 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen eines optoelektronischen Bauteils und optoelektronisches Bauteil |
US11859750B2 (en) | 2018-03-16 | 2024-01-02 | Dirtt Environmental Solutions Ltd. | Med-gas panel connectors for reconfigurable walls |
JP6897641B2 (ja) | 2018-08-31 | 2021-07-07 | 日亜化学工業株式会社 | レンズ及び発光装置並びにそれらの製造方法 |
JP7239804B2 (ja) | 2018-08-31 | 2023-03-15 | 日亜化学工業株式会社 | レンズ及び発光装置並びにそれらの製造方法 |
JP7206475B2 (ja) | 2018-08-31 | 2023-01-18 | 日亜化学工業株式会社 | レンズ及び発光装置並びにそれらの製造方法 |
DE102018221729A1 (de) | 2018-12-14 | 2020-06-18 | Heraeus Noblelight Gmbh | Leuchte zum bestrahlen eines targets |
DE102019209358A1 (de) | 2019-06-27 | 2020-12-31 | Heraeus Noblelight Gmbh | Haltevorrichtung für ein optisches modul mit mindestens einem federelement |
CN111674152B (zh) * | 2020-05-14 | 2021-10-26 | 武汉信息传播职业技术学院 | 一种标签印刷机的双反射紫外线固化装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5660461A (en) * | 1994-12-08 | 1997-08-26 | Quantum Devices, Inc. | Arrays of optoelectronic devices and method of making same |
JP2000068671A (ja) * | 1998-08-19 | 2000-03-03 | Mitsubishi Electric Corp | 放熱装置 |
US7847302B2 (en) * | 2005-08-26 | 2010-12-07 | Koninklijke Philips Electronics, N.V. | Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature |
JP2007065511A (ja) * | 2005-09-01 | 2007-03-15 | Seiko Epson Corp | マイクロレンズ基板、液晶パネルおよび投射型表示装置 |
JP2008207450A (ja) * | 2007-02-27 | 2008-09-11 | Towa Corp | 発光素子の圧縮成形方法 |
JP2008227385A (ja) * | 2007-03-15 | 2008-09-25 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
WO2008152575A1 (en) * | 2007-06-14 | 2008-12-18 | Koninklijke Philips Electronics N.V. | Flexible electronics package and method for manufacturing such a package |
JP2009111102A (ja) * | 2007-10-29 | 2009-05-21 | Mitsubishi Chemicals Corp | 集積型発光源およびその製造方法 |
DE102007063305A1 (de) | 2007-12-27 | 2009-07-02 | Carl Zeiss Smt Ag | Optische Einrichtung mit einer Federeinrichtung mit einem Bereich konstanter Federkraft |
DE202008002473U1 (de) * | 2008-02-21 | 2009-04-30 | Pöllet, Wilfried | Leuchte mit LEDs |
DE102008014927A1 (de) | 2008-02-22 | 2009-08-27 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Mehrzahl von strahlungsemittierenden Bauelementen und strahlungsemittierendes Bauelement |
KR200456730Y1 (ko) * | 2009-07-07 | 2011-11-15 | 허광선 | 스크린 인쇄용 적외선 건조기 |
US8648711B2 (en) * | 2009-07-09 | 2014-02-11 | Syscor Controls & Automation Inc. | Apparatus for the wireless monitoring of linear heat detection systems for storage tank roofs |
JP2011051107A (ja) | 2009-08-31 | 2011-03-17 | Mitsubishi Heavy Industries Printing & Packaging Machinery Ltd | 乾燥装置及び印刷機 |
EP2317205A1 (en) * | 2009-10-27 | 2011-05-04 | Liang Meng Plastic Share Co. Ltd. | Housing of LED light source comprising electrical connector |
EP2388139A1 (en) * | 2010-05-19 | 2011-11-23 | KBA-NotaSys SA | Sheet-fed printing press for numbering and varnishing of security documents, especially banknotes |
JP5882332B2 (ja) | 2010-09-06 | 2016-03-09 | ヘレーウス ノーブルライト ゲゼルシャフト ミット ベシュレンクテルハフツングHeraeus Noblelight GmbH | オプトエレクトロニクスチップオンボードモジュール用のコーティング法 |
-
2012
- 2012-05-02 DE DE102012008637A patent/DE102012008637A1/de not_active Ceased
-
2013
- 2013-03-21 CN CN201380022954.6A patent/CN104395084B/zh not_active Expired - Fee Related
- 2013-03-21 JP JP2015509319A patent/JP6133403B2/ja not_active Expired - Fee Related
- 2013-03-21 WO PCT/EP2013/000862 patent/WO2013164054A1/de active Application Filing
- 2013-03-21 US US14/397,279 patent/US10185112B2/en not_active Expired - Fee Related
- 2013-03-21 KR KR1020147030346A patent/KR101687087B1/ko active IP Right Grant
- 2013-03-21 EP EP13714851.6A patent/EP2844475B1/de active Active
- 2013-03-21 CA CA2872077A patent/CA2872077C/en not_active Expired - Fee Related
-
2015
- 2015-05-18 HK HK15104666.8A patent/HK1203905A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA2872077C (en) | 2017-09-05 |
KR101687087B1 (ko) | 2016-12-15 |
EP2844475B1 (de) | 2020-01-22 |
CA2872077A1 (en) | 2013-11-07 |
US20150075025A1 (en) | 2015-03-19 |
US10185112B2 (en) | 2019-01-22 |
KR20150013144A (ko) | 2015-02-04 |
CN104395084B (zh) | 2017-05-24 |
HK1203905A1 (en) | 2015-11-06 |
DE102012008637A1 (de) | 2013-11-07 |
WO2013164054A1 (de) | 2013-11-07 |
JP2015522835A (ja) | 2015-08-06 |
CN104395084A (zh) | 2015-03-04 |
EP2844475A1 (de) | 2015-03-11 |
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