HK1203905A1 - Optical module comprising a molded portion for installation - Google Patents
Optical module comprising a molded portion for installationInfo
- Publication number
- HK1203905A1 HK1203905A1 HK15104666.8A HK15104666A HK1203905A1 HK 1203905 A1 HK1203905 A1 HK 1203905A1 HK 15104666 A HK15104666 A HK 15104666A HK 1203905 A1 HK1203905 A1 HK 1203905A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- installation
- optical module
- molded portion
- molded
- module
- Prior art date
Links
- 238000009434 installation Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/69—Details of refractors forming part of the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B3/00—Drying solid materials or objects by processes involving the application of heat
- F26B3/28—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0268—Diffusing elements; Afocal elements characterized by the fabrication or manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0273—Diffusing elements; Afocal elements characterized by the use
- G02B5/0278—Diffusing elements; Afocal elements characterized by the use used in transmission
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/003—Alignment of optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- Microbiology (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012008637A DE102012008637A1 (de) | 2012-05-02 | 2012-05-02 | Optisches Modul mit Ausformung zur Montage |
PCT/EP2013/000862 WO2013164054A1 (de) | 2012-05-02 | 2013-03-21 | Optisches modul mit ausformung zur montage |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1203905A1 true HK1203905A1 (en) | 2015-11-06 |
Family
ID=48050653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15104666.8A HK1203905A1 (en) | 2012-05-02 | 2015-05-18 | Optical module comprising a molded portion for installation |
Country Status (9)
Country | Link |
---|---|
US (1) | US10185112B2 (ja) |
EP (1) | EP2844475B1 (ja) |
JP (1) | JP6133403B2 (ja) |
KR (1) | KR101687087B1 (ja) |
CN (1) | CN104395084B (ja) |
CA (1) | CA2872077C (ja) |
DE (1) | DE102012008637A1 (ja) |
HK (1) | HK1203905A1 (ja) |
WO (1) | WO2013164054A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3366474B1 (en) * | 2017-02-22 | 2020-06-24 | KBA-NotaSys SA | Printing press with in-line casting device for the replication and formation of a micro-optical structure |
DE102017108688B4 (de) * | 2017-04-24 | 2022-08-04 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen eines optoelektronischen Bauteils und optoelektronisches Bauteil |
US11859750B2 (en) | 2018-03-16 | 2024-01-02 | Dirtt Environmental Solutions Ltd. | Med-gas panel connectors for reconfigurable walls |
JP6897641B2 (ja) | 2018-08-31 | 2021-07-07 | 日亜化学工業株式会社 | レンズ及び発光装置並びにそれらの製造方法 |
JP7239804B2 (ja) | 2018-08-31 | 2023-03-15 | 日亜化学工業株式会社 | レンズ及び発光装置並びにそれらの製造方法 |
JP7206475B2 (ja) | 2018-08-31 | 2023-01-18 | 日亜化学工業株式会社 | レンズ及び発光装置並びにそれらの製造方法 |
DE102018221729A1 (de) | 2018-12-14 | 2020-06-18 | Heraeus Noblelight Gmbh | Leuchte zum bestrahlen eines targets |
DE102019209358A1 (de) | 2019-06-27 | 2020-12-31 | Heraeus Noblelight Gmbh | Haltevorrichtung für ein optisches modul mit mindestens einem federelement |
CN111674152B (zh) * | 2020-05-14 | 2021-10-26 | 武汉信息传播职业技术学院 | 一种标签印刷机的双反射紫外线固化装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5660461A (en) * | 1994-12-08 | 1997-08-26 | Quantum Devices, Inc. | Arrays of optoelectronic devices and method of making same |
JP2000068671A (ja) * | 1998-08-19 | 2000-03-03 | Mitsubishi Electric Corp | 放熱装置 |
US7847302B2 (en) * | 2005-08-26 | 2010-12-07 | Koninklijke Philips Electronics, N.V. | Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature |
JP2007065511A (ja) * | 2005-09-01 | 2007-03-15 | Seiko Epson Corp | マイクロレンズ基板、液晶パネルおよび投射型表示装置 |
JP2008207450A (ja) * | 2007-02-27 | 2008-09-11 | Towa Corp | 発光素子の圧縮成形方法 |
JP2008227385A (ja) * | 2007-03-15 | 2008-09-25 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
WO2008152575A1 (en) * | 2007-06-14 | 2008-12-18 | Koninklijke Philips Electronics N.V. | Flexible electronics package and method for manufacturing such a package |
JP2009111102A (ja) * | 2007-10-29 | 2009-05-21 | Mitsubishi Chemicals Corp | 集積型発光源およびその製造方法 |
DE102007063305A1 (de) | 2007-12-27 | 2009-07-02 | Carl Zeiss Smt Ag | Optische Einrichtung mit einer Federeinrichtung mit einem Bereich konstanter Federkraft |
DE202008002473U1 (de) * | 2008-02-21 | 2009-04-30 | Pöllet, Wilfried | Leuchte mit LEDs |
DE102008014927A1 (de) | 2008-02-22 | 2009-08-27 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Mehrzahl von strahlungsemittierenden Bauelementen und strahlungsemittierendes Bauelement |
KR200456730Y1 (ko) * | 2009-07-07 | 2011-11-15 | 허광선 | 스크린 인쇄용 적외선 건조기 |
US8648711B2 (en) * | 2009-07-09 | 2014-02-11 | Syscor Controls & Automation Inc. | Apparatus for the wireless monitoring of linear heat detection systems for storage tank roofs |
JP2011051107A (ja) | 2009-08-31 | 2011-03-17 | Mitsubishi Heavy Industries Printing & Packaging Machinery Ltd | 乾燥装置及び印刷機 |
EP2317205A1 (en) * | 2009-10-27 | 2011-05-04 | Liang Meng Plastic Share Co. Ltd. | Housing of LED light source comprising electrical connector |
EP2388139A1 (en) * | 2010-05-19 | 2011-11-23 | KBA-NotaSys SA | Sheet-fed printing press for numbering and varnishing of security documents, especially banknotes |
JP5882332B2 (ja) | 2010-09-06 | 2016-03-09 | ヘレーウス ノーブルライト ゲゼルシャフト ミット ベシュレンクテルハフツングHeraeus Noblelight GmbH | オプトエレクトロニクスチップオンボードモジュール用のコーティング法 |
-
2012
- 2012-05-02 DE DE102012008637A patent/DE102012008637A1/de not_active Ceased
-
2013
- 2013-03-21 CN CN201380022954.6A patent/CN104395084B/zh not_active Expired - Fee Related
- 2013-03-21 JP JP2015509319A patent/JP6133403B2/ja not_active Expired - Fee Related
- 2013-03-21 WO PCT/EP2013/000862 patent/WO2013164054A1/de active Application Filing
- 2013-03-21 US US14/397,279 patent/US10185112B2/en not_active Expired - Fee Related
- 2013-03-21 KR KR1020147030346A patent/KR101687087B1/ko active IP Right Grant
- 2013-03-21 EP EP13714851.6A patent/EP2844475B1/de active Active
- 2013-03-21 CA CA2872077A patent/CA2872077C/en not_active Expired - Fee Related
-
2015
- 2015-05-18 HK HK15104666.8A patent/HK1203905A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA2872077C (en) | 2017-09-05 |
KR101687087B1 (ko) | 2016-12-15 |
EP2844475B1 (de) | 2020-01-22 |
CA2872077A1 (en) | 2013-11-07 |
JP6133403B2 (ja) | 2017-05-24 |
US20150075025A1 (en) | 2015-03-19 |
US10185112B2 (en) | 2019-01-22 |
KR20150013144A (ko) | 2015-02-04 |
CN104395084B (zh) | 2017-05-24 |
DE102012008637A1 (de) | 2013-11-07 |
WO2013164054A1 (de) | 2013-11-07 |
JP2015522835A (ja) | 2015-08-06 |
CN104395084A (zh) | 2015-03-04 |
EP2844475A1 (de) | 2015-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20220317 |