HK1203905A1 - 具有用於安裝的構型的光學模塊 - Google Patents

具有用於安裝的構型的光學模塊

Info

Publication number
HK1203905A1
HK1203905A1 HK15104666.8A HK15104666A HK1203905A1 HK 1203905 A1 HK1203905 A1 HK 1203905A1 HK 15104666 A HK15104666 A HK 15104666A HK 1203905 A1 HK1203905 A1 HK 1203905A1
Authority
HK
Hong Kong
Prior art keywords
installation
optical module
molded portion
molded
module
Prior art date
Application number
HK15104666.8A
Other languages
English (en)
Inventor
Michael Peil
Susanne Schadt
Harald Maiweg
Marcus Helmling
Original Assignee
Heraeus Noblelight Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Noblelight Gmbh filed Critical Heraeus Noblelight Gmbh
Publication of HK1203905A1 publication Critical patent/HK1203905A1/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69—Details of refractors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F26B3/28—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • G02B5/0268—Diffusing elements; Afocal elements characterized by the fabrication or manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • G02B5/0273—Diffusing elements; Afocal elements characterized by the use
    • G02B5/0278—Diffusing elements; Afocal elements characterized by the use used in transmission
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/003—Alignment of optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microbiology (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
HK15104666.8A 2012-05-02 2015-05-18 具有用於安裝的構型的光學模塊 HK1203905A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012008637A DE102012008637A1 (de) 2012-05-02 2012-05-02 Optisches Modul mit Ausformung zur Montage
PCT/EP2013/000862 WO2013164054A1 (de) 2012-05-02 2013-03-21 Optisches modul mit ausformung zur montage

Publications (1)

Publication Number Publication Date
HK1203905A1 true HK1203905A1 (zh) 2015-11-06

Family

ID=48050653

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15104666.8A HK1203905A1 (zh) 2012-05-02 2015-05-18 具有用於安裝的構型的光學模塊

Country Status (9)

Country Link
US (1) US10185112B2 (zh)
EP (1) EP2844475B1 (zh)
JP (1) JP6133403B2 (zh)
KR (1) KR101687087B1 (zh)
CN (1) CN104395084B (zh)
CA (1) CA2872077C (zh)
DE (1) DE102012008637A1 (zh)
HK (1) HK1203905A1 (zh)
WO (1) WO2013164054A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3366474B1 (en) * 2017-02-22 2020-06-24 KBA-NotaSys SA Printing press with in-line casting device for the replication and formation of a micro-optical structure
DE102017108688B4 (de) * 2017-04-24 2022-08-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines optoelektronischen Bauteils und optoelektronisches Bauteil
WO2019178556A1 (en) 2018-03-16 2019-09-19 Dirtt Environmental Solutions Inc. Med-gas panel connectors for reconfigurable walls
JP7239804B2 (ja) 2018-08-31 2023-03-15 日亜化学工業株式会社 レンズ及び発光装置並びにそれらの製造方法
JP6897641B2 (ja) 2018-08-31 2021-07-07 日亜化学工業株式会社 レンズ及び発光装置並びにそれらの製造方法
JP7206475B2 (ja) 2018-08-31 2023-01-18 日亜化学工業株式会社 レンズ及び発光装置並びにそれらの製造方法
DE102018221729A1 (de) 2018-12-14 2020-06-18 Heraeus Noblelight Gmbh Leuchte zum bestrahlen eines targets
DE102019209358A1 (de) * 2019-06-27 2020-12-31 Heraeus Noblelight Gmbh Haltevorrichtung für ein optisches modul mit mindestens einem federelement
CN111674152B (zh) * 2020-05-14 2021-10-26 武汉信息传播职业技术学院 一种标签印刷机的双反射紫外线固化装置

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Publication number Priority date Publication date Assignee Title
US5660461A (en) * 1994-12-08 1997-08-26 Quantum Devices, Inc. Arrays of optoelectronic devices and method of making same
JP2000068671A (ja) * 1998-08-19 2000-03-03 Mitsubishi Electric Corp 放熱装置
US7847302B2 (en) * 2005-08-26 2010-12-07 Koninklijke Philips Electronics, N.V. Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature
JP2007065511A (ja) * 2005-09-01 2007-03-15 Seiko Epson Corp マイクロレンズ基板、液晶パネルおよび投射型表示装置
JP2008207450A (ja) * 2007-02-27 2008-09-11 Towa Corp 発光素子の圧縮成形方法
JP2008227385A (ja) * 2007-03-15 2008-09-25 Dainippon Screen Mfg Co Ltd 基板処理装置
WO2008152575A1 (en) * 2007-06-14 2008-12-18 Koninklijke Philips Electronics N.V. Flexible electronics package and method for manufacturing such a package
JP2009111102A (ja) * 2007-10-29 2009-05-21 Mitsubishi Chemicals Corp 集積型発光源およびその製造方法
DE102007063305A1 (de) 2007-12-27 2009-07-02 Carl Zeiss Smt Ag Optische Einrichtung mit einer Federeinrichtung mit einem Bereich konstanter Federkraft
DE202008002473U1 (de) * 2008-02-21 2009-04-30 Pöllet, Wilfried Leuchte mit LEDs
DE102008014927A1 (de) 2008-02-22 2009-08-27 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Mehrzahl von strahlungsemittierenden Bauelementen und strahlungsemittierendes Bauelement
KR200456730Y1 (ko) 2009-07-07 2011-11-15 허광선 스크린 인쇄용 적외선 건조기
US8648711B2 (en) * 2009-07-09 2014-02-11 Syscor Controls & Automation Inc. Apparatus for the wireless monitoring of linear heat detection systems for storage tank roofs
JP2011051107A (ja) * 2009-08-31 2011-03-17 Mitsubishi Heavy Industries Printing & Packaging Machinery Ltd 乾燥装置及び印刷機
EP2317205A1 (en) * 2009-10-27 2011-05-04 Liang Meng Plastic Share Co. Ltd. Housing of LED light source comprising electrical connector
EP2388139A1 (en) * 2010-05-19 2011-11-23 KBA-NotaSys SA Sheet-fed printing press for numbering and varnishing of security documents, especially banknotes
WO2012031703A1 (de) 2010-09-06 2012-03-15 Heraeus Noblelight Gmbh Beschichtungsverfahren für ein optoelektronisches chip-on-board-modul

Also Published As

Publication number Publication date
US10185112B2 (en) 2019-01-22
WO2013164054A1 (de) 2013-11-07
EP2844475B1 (de) 2020-01-22
JP2015522835A (ja) 2015-08-06
CN104395084B (zh) 2017-05-24
US20150075025A1 (en) 2015-03-19
KR101687087B1 (ko) 2016-12-15
CA2872077A1 (en) 2013-11-07
KR20150013144A (ko) 2015-02-04
EP2844475A1 (de) 2015-03-11
JP6133403B2 (ja) 2017-05-24
CA2872077C (en) 2017-09-05
CN104395084A (zh) 2015-03-04
DE102012008637A1 (de) 2013-11-07

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20220317