JP6131473B2 - Electronic component mounting method and electronic component mounting apparatus - Google Patents

Description

  The present invention relates to an electronic component mounting method and an electronic component mounting apparatus for mounting an electronic component on each of a plurality of mounting points arranged on a substrate.

  Conventionally, as a kind of electronic component mounting apparatus that manufactures a mounting board by mounting electronic components on a substrate, an adhesive is applied to each of a plurality of mounting points arranged on the substrate (for example, individual substrates in a multi-chip board). There are known, for example, a die bonder, a flip chip bonder, etc., in which an electronic component is mounted on each mounting point where the adhesive is applied after application. In such an electronic component mounting apparatus, the application of the adhesive to each mounting point is performed by the application nozzle, and the mounting of the electronic component to each mounting point to which the adhesive is applied is performed by a mounting nozzle that operates independently of the application nozzle. To do.

  The application nozzle applies the adhesive to the mounting point at a height at which the discharge port of the adhesive is separated from the mounting point by a predetermined distance (this distance is referred to as “application height”). The coating height is an extremely important factor for producing a high-quality mounting board by stably applying the adhesive to the mounting points. The coating height must be constant for each mounting point. (For example, Patent Document 1). For this reason, when the substrate holding stage that supports the substrate is in a heated state, the substrate or the substrate holding stage is thermally deformed and the flatness is not sufficient, and the height differs depending on the mounting point. Even so, in order to be able to calculate the height of the coating nozzle so that the coating height is constant for each mounting point, there is a method in which the heights of all mounting points on the substrate are measured in advance. It is done.

JP 2008-104947 A

  However, as described above, when the heights of all mounting points on the board are measured in advance, a dedicated measuring instrument for that purpose is required, and additional time is required for measurement. There was a problem that the productivity of the entire work may be reduced.

  Therefore, the present invention provides an electronic component mounting method and an electronic component mounting apparatus capable of manufacturing a high-quality mounting substrate by applying a stable adhesive at a constant application height at each mounting point. Objective.

  An electronic component mounting method according to the present invention is an electronic component mounting method for mounting an electronic component on each of a plurality of mounting points arranged on a substrate, from above one mounting point among the plurality of mounting points. An application step of lowering the application nozzle to apply the adhesive, a mounting step of lowering the mounting nozzle from above the one mounting point where the adhesive is applied, and mounting an electronic component, and an electronic to the one mounting point Based on the measurement step of measuring the height of the mounting nozzle when the component is mounted, and the height of the mounting nozzle when the electronic component is mounted at the measured one mounting point, Next, a setting step of setting a height of the coating nozzle when an adhesive is applied to the next mounting point for mounting the electronic component, and the coating when the coating step is executed for the next mounting point Nozzle height in the setting process Boss was a height of the coating nozzle.

  An electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus that mounts an electronic component on each of a plurality of mounting points arranged on a substrate, from above one mounting point among the plurality of mounting points. An application nozzle that descends and applies an adhesive, a mounting nozzle that descends from above the one mounting point where the adhesive is applied, and an electronic component that is mounted on the one mounting point A measuring means for measuring the height of the mounting nozzle, and an electronic component next to the one mounting point based on the measured height of the mounting nozzle when the electronic component is mounted at the one mounting point. Setting means for setting the height of the coating nozzle when applying an adhesive to the next mounting point for mounting, and the height of the coating nozzle when applying the adhesive to the next mounting point The height of the coating nozzle set by the setting means To.

  According to the present invention, it is possible to manufacture a high-quality mounting board by applying a stable adhesive at a fixed application height for each mounting point.

1 is a schematic configuration diagram of an electronic component mounting apparatus according to an embodiment of the present invention. The perspective view of the board | substrate holding part with which the electronic component mounting apparatus in one embodiment of this invention is equipped, and the board | substrate hold | maintained at the board | substrate holding part (A) (b) Operation | movement explanatory drawing of the coating nozzle with which the electronic component mounting apparatus in one embodiment of this invention is provided (A) (b) Operation | movement explanatory drawing of the mounting nozzle with which the electronic component mounting apparatus in one embodiment of this invention is provided The figure which shows the positional relationship of the coating nozzle with which the electronic component mounting apparatus in one embodiment of this invention and a mounting nozzle are equipped, and these control systems The figure which shows an example of the screen for initial value setting displayed on the input part with which the electronic component mounting apparatus in one embodiment of this invention is equipped The flowchart which shows the execution procedure of the electronic component mounting operation | work by the electronic component mounting apparatus in one embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. The electronic component mounting apparatus 1 shown in FIG. 1 mounts the electronic component 3 on a plurality of mounting points MP (center positions of individual substrates) arranged in a matrix on a substrate 2 (multiple substrate) as shown in FIG. A device holding unit 12 for holding a substrate 2, a component supply unit 13 for supplying an electronic component 3, a coating head 14 having a coating nozzle 14N, and a reversing head 15 having a reversing nozzle 15N on a base 11. A mounting head 16 having a mounting nozzle 16N and a control device 17 for controlling the operation of the mounting head 16 are provided.

  1 and 2, the substrate holding unit 12 includes a substrate holding stage 12A that holds the substrate 2 by vacuum suction, and a substrate moving mechanism 12B that moves the substrate holding stage 12A in the horizontal plane direction. The substrate moving mechanism 12B operates under the control of the control device 17, and sets the mounting point MP on the substrate 2 held by the substrate holding stage 12A to a predetermined position (“ (Referred to as component mounting position K1).

  The component supply unit 13 includes a wafer holding unit 13A that holds the wafer Wf cut into a large number of electronic components 3 in a state where the wafer Wf is adhered to an adhesive tape, a wafer moving mechanism 13B that moves the wafer holding unit 13A in a horizontal plane, and a wafer. A peeling mechanism 13C provided below the wafer Wf held by the holding unit 13A is provided. The wafer moving mechanism 13B operates under the control of the control device 17, and the electronic component 3 on the wafer holding unit 13A is set at a predetermined position (referred to as “pickup position K2”) determined by the fixed coordinate system of the electronic component mounting apparatus 1. To be located. When the electronic component 3 is located at the pickup position K2, the peeling mechanism 13C is controlled and operated by the control device 17, and the electronic component 3 located at the pickup position K2 is pushed up from below by a push-up pin equipped in the peeling mechanism 13C. Part 3 is peeled from the adhesive tape.

  In FIG. 1, the coating head 14 is driven by the coating head moving mechanism 14 </ b> A to move in the horizontal direction, and the coating nozzle lifting mechanism 14 </ b> B lifts and lowers the coating nozzle 14 </ b> N together with the coating head 14. The adhesive SZ is stored inside the coating head 14, and the coating nozzle 14N receives the pressure supplied from the adhesive discharging mechanism 14C and discharges the adhesive SZ from the lower discharge port. Control of horizontal movement of the coating head 14 by the coating head moving mechanism 14A, lifting and lowering operation of the coating nozzle 14N by the coating nozzle lifting mechanism 14B, and discharge operation of the adhesive SZ from the coating nozzle 14N by the adhesive discharge mechanism 14C. Is performed by the control device 17.

  When one mounting point MP on the substrate 2 is positioned at the component mounting position K1 by the substrate moving mechanism 12B, the coating head 14 is positioned above the component mounting position K1. Then, when the application nozzle 14N descends from the initial position and reaches the discharge position, the adhesive SZ is applied from the discharge port toward the mounting point MP (FIG. 3 (a) → FIG. 3 (b), application step). Here, as shown in FIG. 3A, the initial position of the application nozzle 14N is a position at which the lower end (discharge port) becomes a predetermined lowering start height H0. As shown in FIG. 3B, the lower discharge port is a position where the discharge height H1 is higher than the mounting point MP by a predetermined height (application height ΔN). When the adhesive SZ is applied, the application nozzle 14N rises and returns to the initial position (FIG. 3 (b) → FIG. 3 (a)).

  The coating height ΔN is an extremely important factor for manufacturing a high-quality mounting board by applying the adhesive SZ to the mounting point MP with high accuracy and stability. Accordingly, the coating height ΔN needs to be constant for each mounting point MP, but the flatness is sufficient because the substrate 2 and the substrate holding stage 12A are thermally deformed, such as when the substrate holding stage 12A is in a heated state. If not, the height may be different for each mounting point MP. Therefore, in order to make the coating height ΔN constant for each mounting point MP, it is necessary to set the discharge height H1 for each mounting point MP. The procedure for setting the discharge height H1 will be described later.

  In FIG. 1, the reversing head 15 is driven by the reversing head moving mechanism 15A to move in the horizontal direction, and rotates about the horizontal axis 15J. The reversing nozzle lifting mechanism 15B moves the reversing nozzle 15N up and down with the reversing nozzle 15N facing up and down. The reversing head 15 is connected to the reversing nozzle suction mechanism 15C, and when the vacuum pressure is supplied from the reversing nozzle suction mechanism 15C, the suction force of the electronic component 3 is generated at the end of the reversing nozzle 15N. The reversing head moving mechanism 15A moves the reversing head 15 in the horizontal direction, rotates around the horizontal axis 15J, the reversing nozzle lifting mechanism 15B raises and lowers the reversing nozzle 15N, and the reversing nozzle suction mechanism 15C sucks the reversing nozzle 15N. Is performed by the control device 17.

  The reversing head 15 is positioned above the pickup position K2 with the reversing nozzle 15N facing downward. When the electronic component 3 is pushed up by the push-up pin of the peeling mechanism 13C, the reversing nozzle 15N is lowered and the electronic component 3 is moved. To pick up. The reversing head 15 rotates around the horizontal axis 15J and moves in the horizontal direction while inverting the electronic component 3 up and down, and reaches a component delivery position K3 (FIG. 1) determined by the fixed coordinate system of the electronic component mounting apparatus 1. The electronic component 3 is positioned.

  In FIG. 1, the mounting head 16 is driven by the mounting head moving mechanism 16A to move in the horizontal direction, and the mounting nozzle lifting mechanism 16B lifts and lowers the mounting nozzle 16N. The mounting head 16 is connected to the mounting nozzle suction mechanism 16C, and when the vacuum pressure is supplied from the mounting nozzle suction mechanism 16C, the suction force of the electronic component 3 is generated at the end of the mounting nozzle 16N. The control device 17 controls each of the horizontal movement operation of the mounting head 16 by the mounting head moving mechanism 16A, the lifting operation of the mounting nozzle 16N by the mounting nozzle lifting mechanism 16B, and the suction operation of the mounting nozzle 16N by the mounting nozzle suction mechanism 16C. Made.

  The mounting head 16 is positioned above the component delivery position K3, receives the electronic component 3 from the reversing head 15 by the mounting nozzle 16N, and moves above the component mounting position K1. Then, the mounting nozzle 16N is lowered from the initial position, and the electronic component 3 is grounded and mounted on the mounting point MP where the adhesive SZ is applied by the application nozzle 14N (FIG. 4 (a) → FIG. 4 (b)). Process). Here, the initial position of the mounting nozzle 16N is a position at which the lower end (component suction portion) becomes a predetermined descending start height J0, and the mounting nozzle 16N when the electronic component 3 contacts the mounting point MP. The lower end height is referred to as a mounting height J1 (FIG. 4). The mounting nozzle 16N rises when the electronic component 3 is mounted on the mounting point MP, and returns to the initial position (FIG. 4 (b) → FIG. 4 (a)). Through the mounting process, the electronic component 3 is mounted on the mounting point MP located at the component mounting position K1. In the present embodiment, it is assumed that the descending start height J0 of the mounting nozzle 16N is higher than the descending start height H0 of the coating nozzle 14N by the gap amount ΔD (FIG. 5).

  Next, a procedure for setting the discharge height H1 of the coating nozzle 14N will be described. In FIG. 5, the mounting head 16 includes a touch sensor 21 that detects a state in which the electronic component 3 is grounded to the substrate 2 after the mounting nozzle 16N that has attracted the electronic component 3 starts to descend from the initial position, and the mounting nozzle 16N. A position detector 22 for detecting the position in the Z direction is provided.

  In FIG. 5, the control device 17 includes a storage unit 23, a mounting height calculation unit 24, a discharge height setting unit 25, and a coating nozzle lowering control amount calculation unit 26. In addition to the descending start height J0 of the mounting nozzle 16N, each value of the gap amount ΔD (= J0−H0), the coating height ΔN, and the height T of the electronic component 3 is stored in the storage unit 23. Detection information from the touch sensor 21 (information that the electronic component 3 is grounded to the substrate 2) and detection information from the position detector 22 (position information of the mounting nozzle 16N) are input to the mounting height calculation unit 24.

  When the electronic component 3 is mounted at one mounting point MP where the mounting nozzle 16N is positioned at the component mounting position K1 as described above, the mounting height calculation unit 24 detects the detection information from the touch sensor 21 and the position detector 22. Based on the detection information from the position, the amount of lowering of the mounting nozzle 16N when the electronic component 3 is mounted at the one mounting point MP, that is, the mounting nozzle 16N starts to descend from the initial position, and the electronic component 3 moves to the component mounting position K1. The amount of lowering of the mounting nozzle 16N until it is grounded (this is referred to as the amount of lowering ΔJ during mounting) is detected. The mounting nozzle 16N when the electronic component 3 is mounted at one mounting point MP based on the detected descending amount ΔJ during mounting and the descending start height J0 of the mounting nozzle 16N stored in the storage unit 23. Is calculated by calculation: J1 = J0−ΔJ (see FIGS. 4A, 4B and 5). As described above, in the present embodiment, the mounting height calculation unit 24 of the touch sensor 21, the position detector 22, and the control device 17 has the height of the mounting nozzle 16N when the electronic component 3 is mounted at one mounting point MP. It is the measuring means 27 which performs the process (measuring process) which measures (mounting height J1).

  When the measuring means 27 measures the height (mounting height J1) of the mounting nozzle 16N when the electronic component 3 is mounted at one mounting point MP as described above, the discharge height setting unit 25 is stored in the storage unit 23. Next, based on the values of the coating height ΔN and the height T of the electronic component 3 stored in the above and the value of the mounting height J1 measured by the measuring means 27, the mounting point MP ( The discharge height of the application nozzle 14N when the adhesive SZ is applied to the next mounting point MP) is set as the discharge height H1 (setting step). Here, it is assumed that the next mounting point MP is the mounting point MP adjacent to the one mounting point MP, and that the height of the one mounting point MP and the height of the next mounting point MP are substantially the same. The discharge height H1 for the next mounting point MP is obtained by calculation: H1 = J1−T + ΔN (see FIG. 5).

  As described above, in the present embodiment, the discharge height setting unit 25 determines the next mounting point based on the mounting height J1 of the mounting nozzle 16N when the electronic component 3 is mounted on the measured one mounting point MP. This is setting means for setting the height (discharge height H1) of the coating nozzle 14N when the adhesive SZ is applied to the MP.

  When the discharge height setting unit 25 sets the discharge height H1, the application nozzle lowering control amount calculation unit 26 of the control device 17 sets the lowering start height H0 of the mounting nozzle 16N and the gap amount ΔD stored in the storage unit 23. Are used to calculate the lowering control amount ΔH of the coating nozzle 14N required to lower the coating nozzle 14N from the lowering start height H0 to the discharge height H1 of the coating nozzle 14N: ΔH = J0−ΔD− It calculates by H1 (refer FIG. 5).

  The discharge height H1 of the application nozzle 14N when the adhesive SZ is applied to the next mounting point MP is set by the above-described procedure, but is the first (the first of the plurality of mounting points MP arranged on the substrate 2 ), The discharge height H1 of the coating nozzle 14N for the mounting point MP on which the electronic component 3 is mounted needs to be given separately as an initial value. In this embodiment, the initial value is input by the operator OP from the input unit 30 shown in FIG.

  FIG. 6 is an example of an initial value setting screen GM displayed as an image on the input unit 30. In the initial value setting screen GM, the operator OP mounts the electronic component 3 first among the plurality of mounting points MP arranged on the board 2 (hereinafter referred to as “first mounting point”). (1) The first mounting point MP on the first substrate 2 is a fixed value and the first mounting on the second and subsequent substrates 2 is set as a discharge height H1 of the coating nozzle 14N. The “first mode” in which the same value is also fixed for the point MP, and (2) the first mounting point MP on the first board 2 is a fixed value, while 1 on the second and subsequent boards 2 For the second mounting point MP, the discharge height H1 set based on the mounting height J1 of the mounting nozzle 16N for the first mounting point MP of the substrate 2 on which the electronic component 3 was mounted immediately before (ie, the previous mounting point MP1). Board 2 on which electronic component 3 is mounted on Using the value of the discharge height H1) for the second mounting points MP it is possible to select one of the "second mode". As shown in FIG. 6, a fixed value input area 31 and a setting button 32 are provided, and the operator OP inputs a fixed value to be set to the fixed value input area 31, and operates the setting button 32. By doing so, the fixed value can be set to a desired value. The operator OP can set the “first mode” by operating the first mode selection switch 33 and can set the “second mode” by operating the second mode selection switch 34.

  Here, in the “second mode”, the first mounting point MP on the second and subsequent boards 2 is mounted on the first mounting point MP of the board 2 on which the electronic component 3 was mounted immediately before. The option of using the discharge height H1 set based on the height J1 is prepared because the height of the mounting points MP arranged at the same location is the same for the substrate 2 having the same arrangement of the mounting points MP. This is because the discharge height H1 for the first mounting point MP of the first substrate 2 can be set to an appropriate value (a value at which the adhesive SZ can be applied at the application height ΔN). If it is, the operation of setting the discharge height H1 for the first mounting point MP of the second and subsequent boards to an appropriate value becomes easy (unnecessary).

  Next, referring to the flowchart of FIG. 7, an electronic component mounting operation execution procedure (electronic component mounting) for mounting the electronic component 3 on each of the plurality of mounting points MP arranged on the substrate 2 by the electronic component mounting apparatus 1 is performed. (Method) will be described. In the electronic component mounting work, first, the initial value setting screen GM is displayed on the input unit 30 to prompt the operator OP to set an initial value. When the operator OP inputs an initial value (step ST1 in FIG. 7), the control device 17 resets the counter number n (not shown) to “0” (step ST2), and then sets the counter number n to 1. Is added (step ST3). Then, the mounting point MP (nth mounting point MP) corresponding to the current counter number n is positioned at the component mounting position K1 (step ST4).

  When the nth mounting point MP is located at the component mounting position K1 in step ST4, the control device 17 determines whether or not the current counter number n is “1” (step ST5). As a result, when the current counter number n is “1”, the initial value input from the initial value setting screen GM by the operator OP is read (step ST6). On the other hand, if the current counter number n is not "1" in step ST5, the electronic component 3 is mounted at the (n-1) th mounting point MP (mounting point MP of the previous mounting). The mounting height J1 of the mounting nozzle 16N is read (step ST7).

  When the initial value is read in step ST6 or the mounting height J1 of the (n−1) th mounting point MP is read in step ST7, the adhesive SZ is applied to the nth mounting point MP at the discharge height H1. A control amount ΔH for lowering the coating nozzle 14N necessary for the calculation is calculated (step ST8). The lowering control amount ΔH is obtained by the calculation: ΔH = J0−ΔD−H1 as described above. Since H1 = J1−T + ΔN and J1 = J0−ΔJ, the lowering control amount ΔH is Eventually, ΔH = ΔJ + T−ΔD−ΔN. As can be seen from this equation, in order to calculate the lowering control amount ΔH of the coating nozzle 14N, in addition to the measured lowering amount ΔJ of the mounted nozzle 16N, the coating height ΔN, gap amount ΔD and Only each value of the height T of the electronic component 3 is required, and it is not necessary to directly determine the mounting height J1 of the mounting nozzle 16N.

  After calculating the lowering control amount ΔH of the application nozzle 14N for the nth mounting point MP as described above, the nth mounting point MP is positioned at the component mounting position K1 (FIG. 3A). The application nozzle 14N is lowered from the lowering start height H0 by the calculated lowering control amount ΔH, and the adhesive SZ is applied to the component mounting position K1 (FIG. 3B, step ST9, the above-described application step).

  When the adhesive SZ is applied to the nth mounting point MP located at the component mounting position K1 as described above, the application nozzle 14N rises to the lowering start height H0 (FIG. 3B → FIG. 3A). ). Then, the wafer holding mechanism 13B moves the wafer holder 13A so that the electronic component 3 to be mounted on the mounting point MP from now on (referred to as “electronic component 3 to be mounted”) is located at the pickup position K2. The reversing head 15 is positioned above the pickup position K2 with the reversing nozzle 15N facing downward. The push-up pin of the peeling mechanism 13C pushes up the electronic component 3 to be mounted, and the reverse nozzle 15N picks up and picks up the electronic component 3 to be mounted. The reversing nozzle 15N that picks up the electronic component 3 to be mounted rotates around the horizontal axis 15J to turn the electronic component 3 upside down. The reversing head 15 moves horizontally and the reversing nozzle 15N flips the electronic component 3 upside down. It is located at the parts delivery position K3.

  When the electronic component 3 is positioned at the component delivery position K3, the mounting head 16 is positioned above the component delivery position K3 and receives the electronic component 3 to be mounted from the reversing nozzle 15N. Then, after the mounting head 16 is positioned above the component mounting position K1 (FIG. 4A), the mounting nozzle 16N descends from the descending start height J0, and the nth mounting point MP positioned at the component mounting position K1. The electronic component 3 is mounted on (FIG. 4B, step ST10, the mounting process described above). Then, in accordance with the mounting of the electronic component 3 at the nth mounting point MP located at the component mounting position K1, the amount of descending ΔJ of the mounting nozzle 16N at the nth mounting point MP is detected and mounted according to the above-described procedure. The mounting height J1 of the nozzle 16N is measured (step ST11, the above-described measuring step). Then, based on the measured mounting height J1 of the mounting nozzle 16N, the discharge height H1 for the next mounting point MP is set according to the above-described procedure (the above-described setting step).

  When the electronic component 3 is mounted on the nth mounting point MP as described above and the discharge height H1 is set for the next mounting point MP, the mounting nozzle 16N rises to the descending start height J0 (FIG. 4 ( b) → FIG. 4 (a)). Thus, when the mounting operation of the electronic component 3 at the nth mounting point MP (one mounting point MP) is completed, it is determined whether or not the mounting of the electronic component 3 is completed for all the mounting points MP on the current board 2. (Step ST12) As a result, when the mounting of the electronic component 3 is not completed for all the mounting points MP, the process returns to Step ST3 and the processes of Step ST3 to Step ST12 are performed again for the next mounting point MP. . When re-executing step ST3 to step ST12, in step ST7, the mounting height J1 of the mounting nozzle 16N at the previous mounting point MP is read. On the other hand, if the mounting of the electronic component 3 has been completed for all the mounting points MP in step ST12, the electronic component mounting operation for the current substrate 2 is completed, and the substrate 2 is replaced with the next one in the same manner. Perform the work.

  In the above electronic component mounting work, as described above, when the next mounting point MP is a mounting point adjacent to one mounting point MP, the height of one mounting point MP and the height of the next mounting point MP are The mounting height J1 of the mounting nozzle 16N for one mounting point MP (this mounting height J1 is obtained by subtracting the height T of the electronic component 3 as shown in FIG. The discharge height H1 for the next mounting point MP is set based on the measured value of the height R of the MP. Therefore, according to the present embodiment, a stable adhesive SZ with a constant application height ΔN for each mounting point MP without actually measuring the height of each mounting point MP on the substrate 2 with a dedicated measuring instrument. Can be applied, and a high-quality mounting substrate can be manufactured.

  In the present embodiment, the height of the application nozzle 14N when the adhesive SZ is applied to the mounting point MP on which the electronic component 3 is mounted first among the plurality of mounting points MP arranged on the substrate 2 ( Since the discharge height H1) is set to a predetermined value, the discharge height H1 for the mounting point MP on which the electronic component 3 is first mounted is set to an appropriate value according to the substrate 2. Can do.

  Furthermore, in the present embodiment, in the case where the electronic components 3 are sequentially mounted on the plurality of boards 2 having the same arrangement of the mounting points MP, the first mounting points MP of the second and subsequent boards 2 are described. The coating nozzle 14N set based on the height (mounting height J1) of the mounting nozzle 16N measured at the first mounting point MP of the substrate on which the electronic component 3 was mounted immediately before the above-specified value. Height (discharge height H1) can be used, and the setting of the discharge height H1 for the first mounting point MP of the second and subsequent substrates can be made easy (unnecessary).

  Provided are an electronic component mounting method and an electronic component mounting apparatus capable of manufacturing a high-quality mounting substrate by applying a stable adhesive at a fixed application height for each mounting point.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Board | substrate 3 Electronic component 14N Application | coating nozzle 16N Mounting nozzle 25 Discharge height setting part (setting means)
27 Measuring means MP Mounting point SZ Adhesive H1 Discharge height (height of application nozzle when applying adhesive)
J1 mounting height (height of mounting nozzle when electronic components are mounted)

Claims (10)

An electronic component mounting method for mounting an electronic component on each of a plurality of mounting points arranged on a substrate,
An application step of applying an adhesive by lowering an application nozzle from above one of the plurality of mounting points;
A mounting step of mounting electronic components by lowering the mounting nozzle from above the one mounting point to which the adhesive is applied;
A measuring step for measuring the height of the mounting nozzle when an electronic component is mounted on the one mounting point;
Based on the height of the mounting nozzle when the electronic component is mounted on the one mounting point measured, when applying an adhesive to the next mounting point for mounting the electronic component next to the one mounting point Including a setting step for setting the height of the application nozzle,
The electronic component mounting method according to claim 1, wherein the height of the coating nozzle when the coating step is executed for the next mounting point is set to the height of the coating nozzle set in the setting step. In the setting step, in addition to the height of the mounting nozzle when the electronic component is mounted at the one mounting point measured in the measuring step, the one of the lower ends of the application nozzles stored in a storage unit is stored. Based on the coating height that is the height from the mounting point and the height of the electronic component mounted at the one mounting point, the height of the coating nozzle when the adhesive is applied to the next mounting point is set. The electronic component mounting method according to claim 1, wherein: Electronic component mounting method according to claim 1 or 2, wherein the next mounting point is a mounting point adjacent the mounting point of the one. The height of the application nozzle when applying adhesive to the mounting point on which the electronic component is mounted first among the plurality of mounting points arranged on the substrate is set to a predetermined value. electronic component mounting method according to any one of claims 1 to 3. In the case where electronic components are sequentially mounted on a plurality of boards having the same arrangement of the plurality of mounting points, the pre-defined value for the first mounting point of the second and subsequent boards is immediately before that. 5. The electronic component according to claim 4 , wherein the height of the coating nozzle set based on the height of the mounting nozzle measured at the first mounting point of the substrate on which the electronic component is mounted is used. Implementation method. An electronic component mounting apparatus for mounting an electronic component on each of a plurality of mounting points arranged on a substrate,
An application nozzle that descends from above one of the plurality of mounting points and applies an adhesive;
A mounting nozzle for mounting electronic components by descending from above the one mounting point to which the adhesive is applied;
Measuring means for measuring the height of the mounting nozzle when an electronic component is mounted on the one mounting point;
When applying an adhesive to the next mounting point for mounting the electronic component next to the one mounting point, based on the height of the mounting nozzle when the electronic component is mounted on the measured one mounting point And setting means for setting the height of the application nozzle,
The electronic component mounting apparatus according to claim 1, wherein a height of the coating nozzle when the adhesive is applied to the next mounting point is set to a height of the coating nozzle set by the setting unit. In addition to the height of the mounting nozzle when the electronic component is mounted on the one mounting point measured by the measuring unit, the setting unit stores the one of the lower ends of the coating nozzles stored in a storage unit. Based on the coating height that is the height from the mounting point and the height of the electronic component mounted at the one mounting point, the height of the coating nozzle when the adhesive is applied to the next mounting point is set. The electronic component mounting apparatus according to claim 6. 8. The electronic component mounting apparatus according to claim 6, wherein the next mounting point is a mounting point adjacent to the one mounting point. The height of the coating nozzle when the adhesive is applied to the mounting point for mounting the electronic component first among the plurality of mounting points arranged on the substrate is set to a predetermined value. The electronic component mounting apparatus according to claim 6, wherein the electronic component mounting apparatus is characterized in that: In the case where electronic components are sequentially mounted on a plurality of boards having the same arrangement of the plurality of mounting points, the pre-defined value for the first mounting point of the second and subsequent boards is immediately before that. according to claim 9, characterized in that the first height of the coating nozzle, which is set based on the height of the mounting nozzle measured for mounting point of the substrate subjected to mounting of electronic components are used in the Electronic component mounting equipment.

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