JP6120161B2 - レーザー加工装置及び光学表示デバイスの生産システム - Google Patents

レーザー加工装置及び光学表示デバイスの生産システム Download PDF

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Publication number
JP6120161B2
JP6120161B2 JP2013104400A JP2013104400A JP6120161B2 JP 6120161 B2 JP6120161 B2 JP 6120161B2 JP 2013104400 A JP2013104400 A JP 2013104400A JP 2013104400 A JP2013104400 A JP 2013104400A JP 6120161 B2 JP6120161 B2 JP 6120161B2
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Japan
Prior art keywords
optical member
cutting
bonding
member sheet
optical
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Active
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JP2013104400A
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English (en)
Japanese (ja)
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JP2014217879A (ja
Inventor
達也 土岡
達也 土岡
和範 岸▲崎▼
和範 岸▲崎▼
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Sumitomo Chemical Co Ltd
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Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP2013104400A priority Critical patent/JP6120161B2/ja
Priority to PCT/JP2014/051682 priority patent/WO2014167875A1/ja
Priority to KR1020157027044A priority patent/KR20150140664A/ko
Priority to CN201480018797.6A priority patent/CN105102175A/zh
Priority to TW103112909A priority patent/TW201446381A/zh
Publication of JP2014217879A publication Critical patent/JP2014217879A/ja
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Publication of JP6120161B2 publication Critical patent/JP6120161B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
JP2013104400A 2013-04-08 2013-05-16 レーザー加工装置及び光学表示デバイスの生産システム Active JP6120161B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013104400A JP6120161B2 (ja) 2013-04-08 2013-05-16 レーザー加工装置及び光学表示デバイスの生産システム
PCT/JP2014/051682 WO2014167875A1 (ja) 2013-04-08 2014-01-27 レーザー加工装置及び光学表示デバイスの生産システム
KR1020157027044A KR20150140664A (ko) 2013-04-08 2014-01-27 레이저 가공 장치 및 광학 표시 디바이스의 생산 시스템
CN201480018797.6A CN105102175A (zh) 2013-04-08 2014-01-27 激光加工装置以及光学显示器件的生产系统
TW103112909A TW201446381A (zh) 2013-04-08 2014-04-08 雷射加工裝置及光學顯示設備之生產系統

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013080846 2013-04-08
JP2013080846 2013-04-08
JP2013104400A JP6120161B2 (ja) 2013-04-08 2013-05-16 レーザー加工装置及び光学表示デバイスの生産システム

Publications (2)

Publication Number Publication Date
JP2014217879A JP2014217879A (ja) 2014-11-20
JP6120161B2 true JP6120161B2 (ja) 2017-04-26

Family

ID=51689293

Family Applications (1)

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JP2013104400A Active JP6120161B2 (ja) 2013-04-08 2013-05-16 レーザー加工装置及び光学表示デバイスの生産システム

Country Status (5)

Country Link
JP (1) JP6120161B2 (zh)
KR (1) KR20150140664A (zh)
CN (1) CN105102175A (zh)
TW (1) TW201446381A (zh)
WO (1) WO2014167875A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102416550B1 (ko) * 2017-04-28 2022-07-05 삼성디스플레이 주식회사 편광층, 이를 구비하는 표시 장치 및 표시 장치의 제조 방법
JP6998158B2 (ja) * 2017-09-07 2022-01-18 株式会社ディスコ 切削ブレード供給装置
KR102241016B1 (ko) * 2020-01-30 2021-04-28 주식회사 제이스텍 디스플레이 레이저 컷팅설비 인스펙션 공정방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0417361U (zh) * 1990-05-26 1992-02-13
JPH04361103A (ja) 1991-06-06 1992-12-14 Olympus Optical Co Ltd 相対位置検出方法及び装置
JP2003107452A (ja) * 2001-09-17 2003-04-09 Internatl Business Mach Corp <Ibm> 液晶表示パネルの製造方法、液晶表示装置の製造方法、および、液晶表示装置の製造装置
KR20040002796A (ko) * 2002-06-28 2004-01-07 후지 샤신 필름 가부시기가이샤 편광판 점착방법 및 그 장치
JP2005074910A (ja) * 2003-09-02 2005-03-24 Fuji Photo Film Co Ltd カラープリンタ
PL2093041T3 (pl) * 2006-10-17 2013-08-30 Nitto Denko Corp Sposób przyklejania elementu optycznego i urządzenie wykorzystujące ten sposób
JP5096040B2 (ja) 2007-05-16 2012-12-12 日東電工株式会社 レーザー加工方法及びレーザー加工品
US7947919B2 (en) * 2008-03-04 2011-05-24 Universal Laser Systems, Inc. Laser-based material processing exhaust systems and methods for using such systems
WO2009128115A1 (ja) * 2008-04-15 2009-10-22 日東電工株式会社 光学フィルム積層体ロールならびにその製造方法および装置
KR100848854B1 (ko) * 2008-04-21 2008-07-30 주식회사 탑 엔지니어링 취성기판의 스크라이빙 장치 및 그 방법
JP5207306B2 (ja) * 2009-01-26 2013-06-12 武井電機工業株式会社 薄膜積層ガラス基板の薄膜除去方法及び装置
JP4563491B1 (ja) * 2009-07-07 2010-10-13 株式会社片岡製作所 レーザ加工機
JP2011178636A (ja) * 2010-03-03 2011-09-15 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法及び脆性材料部材
WO2013099922A1 (ja) * 2011-12-27 2013-07-04 住友化学株式会社 レーザー光照射装置、光学部材貼合体の製造装置、レーザー光照射方法及び光学部材貼合体の製造方法

Also Published As

Publication number Publication date
WO2014167875A1 (ja) 2014-10-16
CN105102175A (zh) 2015-11-25
KR20150140664A (ko) 2015-12-16
TW201446381A (zh) 2014-12-16
JP2014217879A (ja) 2014-11-20

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