JP6119617B2 - 積層型冷却システム - Google Patents
積層型冷却システム Download PDFInfo
- Publication number
- JP6119617B2 JP6119617B2 JP2014004511A JP2014004511A JP6119617B2 JP 6119617 B2 JP6119617 B2 JP 6119617B2 JP 2014004511 A JP2014004511 A JP 2014004511A JP 2014004511 A JP2014004511 A JP 2014004511A JP 6119617 B2 JP6119617 B2 JP 6119617B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- refrigerant
- cooling
- cooling plate
- supply path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims description 169
- 239000003507 refrigerant Substances 0.000 claims description 124
- 239000002826 coolant Substances 0.000 claims description 9
- 230000001105 regulatory effect Effects 0.000 description 31
- 238000011144 upstream manufacturing Methods 0.000 description 14
- 230000007423 decrease Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 3
- 229910000639 Spring steel Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
5、5a、5b、5c、5d、5e、5f、5g;調整弁
3;供給管
4;排出管
5;調整弁
6;接続部
7、7a、7b、7g、8、8a、8b、8g;流路
21、21a、21b、21g;上板
22、22a、22b、22g;中板
23、23a、23b、23g;下板
24;フィン
40;冷媒供給路
50;冷媒排出路
60;半導体カード
90;冷却システム
Claims (1)
- 被冷却物と交互に積層されると共に、内部を冷媒が流れる複数の冷却プレートと、
積層方向に前記複数の冷却プレートを貫通していると共に各冷却プレートに冷媒を供給する冷媒供給路と、
前記各冷却プレートの流路内において弾性的に支持されていると共に、通過する冷媒の流量が大きい程、前記冷却プレートの流路面積を小さくする弁体と、
を備えることを特徴とする積層型冷却システム。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014004511A JP6119617B2 (ja) | 2014-01-14 | 2014-01-14 | 積層型冷却システム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014004511A JP6119617B2 (ja) | 2014-01-14 | 2014-01-14 | 積層型冷却システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015133421A JP2015133421A (ja) | 2015-07-23 |
JP6119617B2 true JP6119617B2 (ja) | 2017-04-26 |
Family
ID=53900415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014004511A Expired - Fee Related JP6119617B2 (ja) | 2014-01-14 | 2014-01-14 | 積層型冷却システム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6119617B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180131140A (ko) * | 2017-05-31 | 2018-12-10 | 한온시스템 주식회사 | 전기소자 냉각용 열교환기 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6349594B2 (ja) * | 2014-10-08 | 2018-07-04 | カルソニックカンセイ株式会社 | 半導体冷却装置 |
JP6708113B2 (ja) * | 2016-12-19 | 2020-06-10 | 株式会社デンソー | 積層型冷却器 |
JP2020088108A (ja) * | 2018-11-21 | 2020-06-04 | 三井化学株式会社 | 冷却装置および構造体 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08797Y2 (ja) * | 1987-03-16 | 1996-01-10 | 富士通株式会社 | 電子機器の冷媒流路調整構造 |
JPH04350485A (ja) * | 1991-04-26 | 1992-12-04 | Fujitsu Ltd | 冷却装置 |
JP2005191082A (ja) * | 2003-12-24 | 2005-07-14 | Toyota Motor Corp | 電気機器の冷却装置 |
JP2006147924A (ja) * | 2004-11-22 | 2006-06-08 | Toyota Motor Corp | 温度調整装置 |
JP4600052B2 (ja) * | 2005-01-24 | 2010-12-15 | トヨタ自動車株式会社 | 半導体装置 |
JP2013026434A (ja) * | 2011-07-21 | 2013-02-04 | Toyota Motor Corp | 冷却システム |
-
2014
- 2014-01-14 JP JP2014004511A patent/JP6119617B2/ja not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180131140A (ko) * | 2017-05-31 | 2018-12-10 | 한온시스템 주식회사 | 전기소자 냉각용 열교환기 |
KR102350025B1 (ko) * | 2017-05-31 | 2022-01-12 | 한온시스템 주식회사 | 전기소자 냉각용 열교환기 |
Also Published As
Publication number | Publication date |
---|---|
JP2015133421A (ja) | 2015-07-23 |
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