JP6113023B2 - 研削装置 - Google Patents
研削装置 Download PDFInfo
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- JP6113023B2 JP6113023B2 JP2013168207A JP2013168207A JP6113023B2 JP 6113023 B2 JP6113023 B2 JP 6113023B2 JP 2013168207 A JP2013168207 A JP 2013168207A JP 2013168207 A JP2013168207 A JP 2013168207A JP 6113023 B2 JP6113023 B2 JP 6113023B2
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- grinding
- light
- holding
- holding surface
- reflected
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- 238000005259 measurement Methods 0.000 claims description 45
- 238000003780 insertion Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 8
- 238000001514 detection method Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
3 保持テーブル
3a 保持面
4 研削手段
4d 研削砥石
4e 研削面
44 研削送り手段
5 測定手段
51a 投光部
51b 受光部
53 分割器
54 挿入手段
B 測定光
B1 第1の測定光
B2 第2の測定光
C 反射光
C1 第1の反射光
C2 第2の反射光
W 板状ワーク
Claims (1)
- 板状ワークを保持する保持テーブルと、該保持テーブルに保持される板状ワークを研削する研削砥石を備えた研削手段と、該保持テーブルに接近および離反する方向に該研削手段を移動させる研削送り手段と、該保持テーブルが板状ワークを保持する保持面と該研削砥石が板状ワークに接触して研削する研削面との距離を測定する測定手段と、を備えた研削装置において、
該測定手段は、測定光を投光させる投光部と、該投光部から投光された該測定光を、該保持面に投光する第1の測定光と該研削面に投光する第2の測定光とに分割する分割器と、該分割器で分割された該第1の測定光が該保持面で反射される第1の反射光と、該第2の測定光が該研削面で反射される第2の反射光とを受光する受光部と、所定の間隔で離間する該保持面と該研削面との間に該分割器を挿入させる挿入手段と、を備え、
該挿入手段で該保持面と該研削面との間に挿入された該分割器に対し、該投光部から該測定光を投光させ、該受光部が該第1の反射光及び第2の反射光を受光し該保持面と該研削面との距離を測定可能にする研削装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013168207A JP6113023B2 (ja) | 2013-08-13 | 2013-08-13 | 研削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013168207A JP6113023B2 (ja) | 2013-08-13 | 2013-08-13 | 研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015036169A JP2015036169A (ja) | 2015-02-23 |
JP6113023B2 true JP6113023B2 (ja) | 2017-04-12 |
Family
ID=52686859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013168207A Active JP6113023B2 (ja) | 2013-08-13 | 2013-08-13 | 研削装置 |
Country Status (1)
Country | Link |
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JP (1) | JP6113023B2 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5281843U (ja) * | 1975-12-17 | 1977-06-18 | ||
JPH02113109U (ja) * | 1989-02-25 | 1990-09-11 | ||
JPH07190714A (ja) * | 1993-12-24 | 1995-07-28 | Olympus Optical Co Ltd | 干渉計 |
JPH11309666A (ja) * | 1998-04-27 | 1999-11-09 | Tokyo Seimitsu Co Ltd | ウェーハの平面加工装置 |
JP4814187B2 (ja) * | 2007-09-11 | 2011-11-16 | 株式会社ディスコ | チャックテーブルに保持された被加工物の高さ位置検出装置 |
JP2013174549A (ja) * | 2012-02-27 | 2013-09-05 | Institute Of National Colleges Of Technology Japan | 工具位置測定装置及び測定方法 |
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2013
- 2013-08-13 JP JP2013168207A patent/JP6113023B2/ja active Active
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