JP6105125B2 - 発光素子パッケージ及びバックライトユニット - Google Patents

発光素子パッケージ及びバックライトユニット Download PDF

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Publication number
JP6105125B2
JP6105125B2 JP2016086225A JP2016086225A JP6105125B2 JP 6105125 B2 JP6105125 B2 JP 6105125B2 JP 2016086225 A JP2016086225 A JP 2016086225A JP 2016086225 A JP2016086225 A JP 2016086225A JP 6105125 B2 JP6105125 B2 JP 6105125B2
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Prior art keywords
light emitting
emitting device
light
pad
device package
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JP2016086225A
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Japanese (ja)
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JP2016208037A (ja
Inventor
スン ヒョン オウ
スン ヒョン オウ
デ ギル ゾン
デ ギル ゾン
ジュン ヒョン パーク
ジュン ヒョン パーク
ヒョ グ ジオン
ヒョ グ ジオン
Original Assignee
ルーメンス カンパニー リミテッド
ルーメンス カンパニー リミテッド
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Led Devices (AREA)
JP2016086225A 2015-04-22 2016-04-22 発光素子パッケージ及びバックライトユニット Active JP6105125B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20150056682 2015-04-22
KR10-2015-0056682 2015-04-22
KR10-2015-0099949 2015-07-14
KR1020150099949A KR101713685B1 (ko) 2015-04-22 2015-07-14 발광 소자 패키지, 백라이트 유닛 및 발광 장치의 제조 방법

Publications (2)

Publication Number Publication Date
JP2016208037A JP2016208037A (ja) 2016-12-08
JP6105125B2 true JP6105125B2 (ja) 2017-03-29

Family

ID=57484645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016086225A Active JP6105125B2 (ja) 2015-04-22 2016-04-22 発光素子パッケージ及びバックライトユニット

Country Status (2)

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JP (1) JP6105125B2 (ko)
KR (1) KR101713685B1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7108172B2 (ja) * 2017-07-20 2022-07-28 テイ・エス テック株式会社 照明装置
JP7158647B2 (ja) * 2019-02-28 2022-10-24 日亜化学工業株式会社 発光装置の製造方法
US11769862B2 (en) 2020-03-26 2023-09-26 Nichia Corporation Light emitting device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10247412A (ja) * 1997-03-03 1998-09-14 Omron Corp 面光源装置
JP2001094157A (ja) * 1999-09-24 2001-04-06 Sharp Corp チップ部品型発光ダイオードおよびその製造方法
JP4357311B2 (ja) * 2004-02-04 2009-11-04 シチズン電子株式会社 発光ダイオードチップ
JP2005353816A (ja) 2004-06-10 2005-12-22 Olympus Corp 発光デバイス、発光デバイスの製造方法、発光デバイスを用いた照明装置、及び、プロジェクタ
JP2006237217A (ja) * 2005-02-24 2006-09-07 Toshiba Discrete Technology Kk 半導体発光装置及び面発光装置
JP2008277073A (ja) * 2007-04-27 2008-11-13 Citizen Electronics Co Ltd 発光ダイオード
KR101515833B1 (ko) * 2008-10-08 2015-05-04 삼성전자주식회사 광학 장치
JP2010225754A (ja) * 2009-03-23 2010-10-07 Stanley Electric Co Ltd 半導体発光装置
KR20110108832A (ko) * 2010-03-30 2011-10-06 엘지이노텍 주식회사 발광 소자, 라이트 유닛 및 이를 구비한 표시 장치
JP2012033310A (ja) * 2010-07-29 2012-02-16 Stanley Electric Co Ltd サイドエッジ型面状発光装置
KR101078032B1 (ko) 2010-07-29 2011-10-31 주식회사 루멘스 측면 발광형 발광소자 패키지 및 이를 구비한 백라이트 모듈

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Publication number Publication date
KR20160125860A (ko) 2016-11-01
JP2016208037A (ja) 2016-12-08
KR101713685B1 (ko) 2017-03-22

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