JP6105125B2 - Light emitting device package and backlight unit - Google Patents

Description

  The present invention relates to a light emitting device package and a backlight unit, and more particularly to a light emitting device package and a backlight unit that can be used for display applications and illumination applications.

  A light emitting diode (LED) is a kind of semiconductor element that can realize light of various colors by forming a light emitting source by forming a compound semiconductor PN diode. Such a light-emitting element has advantages that it has a long life, can be reduced in size and weight, and can be driven at a low voltage. In addition, such LEDs are resistant to shock and vibration, do not require preheating time and complicated driving, and can be packaged after being mounted on a substrate or lead frame in various forms, so that they can be used for various purposes. It can be modularized and applied to backlight units and various lighting devices.

  A side-emitting light emitting device package applied to a conventional edge type backlight unit is provided at an edge portion of a light guide plate to irradiate light to the light guide plate, and its optical characteristics are designed. In order to be realized, the optical separation distance between the light emitting element and the light guide plate must be kept constant.

  Conventionally, in order to maintain a constant distance from the light guide plate as described above, a spacer that contacts the light guide plate is provided on one side of a module substrate on which a plurality of light emitting element packages are provided.

  However, in the conventional technique using the spacers provided on one side surface of the module substrate as described above, the distance between the light guide plate and the module substrate is maintained when the light emitting device package is not correctly aligned on the module substrate. However, there is a problem in that the separation distance from the light-emitting element package that is not correctly aligned is different, a phenomenon such as a decrease in luminous intensity and a decrease in color appearance occurs, and the light efficiency decreases.

  The present invention has been made in view of the above-described problems in the conventional light emitting device package, and is an interval maintaining unit that contacts the light guide plate on the upper lid that can be precisely aligned and fixed to the reflective mold member. The separation distance between the light emitting element and the light guide plate can be accurately maintained, thereby improving the luminous intensity and color feeling and improving the light efficiency. From the light conversion substance and the light emitting element, An object of the present invention is to provide a light emitting device package and a backlight unit that can be provided with various light emitting devices and can produce high-quality products. In addition, the said subject is an illustration and this does not limit the scope of the present invention.

  The light emitting device package according to the idea of the present invention made to achieve the above object includes a substrate on which a first electrode is formed on one side and a second electrode is formed on the other side with reference to an electrode separation line; A light emitting device including a first pad electrically connected to one electrode and a second pad electrically connected to the second electrode; and a light emitting device package configured to emit light generated from the light emitting device provided on the substrate. A reflective mold member in which a reflective cup portion is formed in which the front surface is open so as to guide it forward and the top is open so that the light emitting element can be accommodated, and the reflective mold member The optical distance between the upper lid formed in a shape corresponding to the upper surface of the reflective mold member and the light guide plate and the light emitting element can be maintained constant so that the opened upper part of the reflective cup portion can be covered. Wherein formed on the upper lid, the tip thereof, characterized in that it comprises a gap maintaining portion which is protruded toward the front side to the light guide plate of the upper lid to contact the light guide plate.

  It is preferable that the distance maintaining part is formed with a light guide plate contact surface in contact with the light guide plate at a tip thereof and partially or entirely longer above the entrance of the reflection cup part.

  Preferably, the upper lid is a metal plate-like reflector that is accommodated in a lid accommodating recess formed in the reflective mold member so that at least a part thereof is fixed to the reflective mold member.

  The upper lid is formed on at least a part of the left side surface and protrudes leftward, and is formed on at least a part of the rear surface and protrudes rearward and at least part of the right side surface. It includes at least one right convex portion that is formed and protrudes in the right direction, and the lid housing concave portion includes a left concave portion corresponding to the left convex portion, a rear concave portion corresponding to the rear convex portion, and the right convex portion. May include at least one of the right-side recesses corresponding to.

  The lid housing recess may include an adhesive housing groove that houses an adhesive capable of bonding the upper lid to the reflective mold member such that the upper lid is bonded and fixed to the reflective mold member.

In the light emitting device, the first pad is formed on a part of a lower surface, the second pad is formed on another part of the lower surface, and a light emitting layer is formed in parallel with the first pad and the second pad, Preferably, the light emitting device is a horizontally mounted light emitting element that is electrically connected to the substrate such that the first pad and the second pad are parallel to the substrate.
The horizontal mounting type light emitting device includes at least a part of an upper surface of the light emitting device and at least a part of a lower surface of the light emitting device so as to guide light generated from the light emitting layer in a direction parallel to the first pad and the second pad. Reflectors formed respectively on at least one of them may be included.

The light emitting device includes a light emitting layer formed in parallel with the first pad and the second pad, and is electrically connected to the substrate so that the first pad and the second pad are perpendicular to the substrate. A vertically mounted light emitting element is preferable.
According to another embodiment of the present invention, the vertically mounted light emitting device has a side surface of the light emitting device so as to guide light generated from the light emitting layer in a direction perpendicular to the first pad and the second pad. A reflector formed on at least a part of at least one of the surfaces may be included.

  According to another embodiment of the present invention, the light emitting device includes a first pad formed on a part of a lower surface of the light emitting device so as to be electrically connected to the first electrode, and the second pad. A flip chip type LED mounted on the electrode separation line, the second pad formed on another portion of the lower surface of the light emitting device to be electrically connected to the electrode. There may be.

The light emitting device package according to another embodiment of the present invention may further include a light conversion material attached to at least a part of at least one surface of the light emitting device.
In the case of the horizontally mounted light emitting device, light formed in a shape surrounding at least one of the four side surfaces of the light emitting device, that is, the front surface, the left surface, the right surface, and the rear surface, excluding the upper surface and the lower surface of the light emitting device. Preferably it contains a conversion substance.
In the case of the vertically mounted light emitting device, the light converting material may be formed to have a shape surrounding at least one of the upper surface and the four side surfaces of the light emitting device except for the lower surface of the light emitting device.

  According to another embodiment of the present invention, the light conversion materials surrounding the light emitting device may have the same thickness on each surface of the light emitting device, or at least one of them may be different.

  It is preferable that the light conversion material surrounding the light emitting element has an inclined surface or a curved surface formed on an outer surface of the light conversion material surrounding at least one of the surfaces of the light emitting element.

  It is preferable to further include a lens part that is formed in at least one surface direction of each surface of the light emitting element on which the light conversion material surrounding the light emitting element is formed and guides an optical path.

  On the other hand, a backlight unit according to the idea of the present invention made to achieve the above object includes a substrate in which a first electrode is formed on one side and a second electrode is formed on the other side with reference to an electrode separation line; A light emitting device including a first pad electrically connected to the first electrode and a second pad electrically connected to the second electrode, and light emitted from the light emitting device provided on the substrate. A reflective mold member formed with a reflective cup portion having a front surface open to guide the front of the device package and an open top so as to accommodate the light emitting device; and the reflective mold member An upper lid formed in a shape corresponding to the upper surface of the reflective mold member so as to cover the opened upper side of the reflective cup portion, a light guide plate provided in an optical path of the light emitting element, The upper lid is formed to maintain a constant optical distance between the light plate and the light emitting element, and protrudes from the front surface of the upper lid toward the light guide plate so that a tip of the upper plate contacts the light guide plate. And an interval maintaining unit provided.

  On the other hand, a method of manufacturing a light emitting device according to the idea of the present invention for solving the above problems includes a release paper preparation stage for preparing a release paper having an adhesive surface formed on one side, and mounting a plurality of light emitting elements on the release paper. A light emitting element mounting step, and a light conversion material flows into a space between the light emitting element and an adjacent light emitting element at a height equal to or lower than a height of the upper surface of the light emitting element so as to surround a side surface of the light emitting element. Incorporating the light conversion material in a state and applying the light conversion material onto the release paper, a light conversion material curing step for curing the light conversion material, and a single unit light emitting device The singulation step of cutting the light conversion substance along a cutting line may be included. In still another embodiment of the present invention, the light emitting device is of a flip chip type, and includes reflectors respectively provided on the upper surface and the lower surface of the light emitting device so as to guide generated light to the side of the light emitting device. But you can.

  According to one embodiment of the present invention configured as described above, the optical distance between the light emitting element and the light guide plate can be accurately maintained, thereby improving the luminous intensity and color of the backlight unit, Light efficiency can be improved, product characteristics can be optimized by changing various optical characteristics, and productivity can be greatly improved by reducing product production time and cost. There is an effect that can be done. Of course, the scope of the present invention is not limited by such effects.

1 is an exploded perspective view of a light emitting device package according to an embodiment of the present invention. FIG. 2 is a component assembly perspective view of the light emitting device package of FIG. 1. FIG. 2 is a plan view showing a module substrate on which the light emitting device package of FIG. 1 is mounted and a backlight unit according to an embodiment of the present invention. FIG. 6 is a perspective view showing another embodiment of the upper lid of the light emitting device package of FIG. 1. FIG. 2 is a perspective view showing a first embodiment of a light emitting device of the light emitting device package of FIG. 1. It is a top view of the light-emitting device of FIG. It is a top view which shows 2nd Embodiment of the light-emitting device of FIG. It is a top view which shows 3rd Embodiment of the light-emitting device of FIG. It is a top view which shows 4th Embodiment of the light-emitting device of FIG. It is a top view which shows 5th Embodiment of the light-emitting device of FIG. It is a top view which shows 6th Embodiment of the light-emitting device of FIG. It is sectional drawing which shows the manufacturing process of the light-emitting device of the light emitting element package by one Embodiment of this invention. It is sectional drawing which shows the manufacturing process following FIG. FIG. 14 is a cross-sectional view showing a manufacturing process subsequent to FIG. 13. It is sectional drawing which shows the manufacturing process following FIG. 3 is a flowchart for explaining a method of manufacturing a light emitting device according to an embodiment of the present invention. FIG. 6 is an exploded perspective view illustrating a light emitting device package according to another embodiment of the present invention. FIG. 5 is a reference diagram illustrating a direction of a light emitting device package according to an embodiment of the present invention.

  Hereinafter, various preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  The embodiments of the present invention are provided in order to more fully explain the present invention to those having ordinary skill in the art, and the embodiments described below can be modified into various other forms. The scope of the present invention is not limited to the embodiments described later. The embodiments described below are provided so that this disclosure will be more thorough and complete, and will enable those skilled in the art to more fully understand the spirit of the present invention. In the drawings, the thickness and size of each layer may be exaggerated for convenience and clarity of explanation.

  FIG. 1 is an exploded perspective view showing a light emitting device package according to an embodiment of the present invention. 2 is an assembly perspective view of the light emitting device package of FIG. 1, and FIG. 3 is a plan view showing a module substrate on which the light emitting device package of FIG. 1 is mounted and a backlight unit according to an embodiment of the present invention. is there.

  First, as illustrated in FIGS. 1 to 3, a light emitting device package 100 according to an embodiment of the present invention may include a substrate 10, a light emitting device 20, a reflective mold member 30, an upper lid 40, and a gap maintaining unit 50. Good.

FIG. 18 is a reference diagram illustrating directions of the light emitting device package according to the embodiment of the present invention.
Referring to FIG. 18A, in this specification, the front of the light emitting device package 100 refers to a direction in which light generated from the light emitting device 20 is emitted from the open front surface of the reflective mold member 30. The rear of the package 100 refers to the reverse direction of the front. The lower side of the light emitting device package 100 refers to the direction in which the substrate 10 is provided, and the upper side of the light emitting device package 100 refers to the opposite direction of the lower side. Further, the right side of the light emitting device package 100 refers to the right direction with respect to the front, and the left side of the light emitting device package 100 refers to the reverse direction of the right side.

  On the other hand, referring to FIG. 18B, in this specification, the lower surface of the light emitting element 20 refers to a surface provided with at least one of the first pad and the second pad, and the upper surface of the light emitting element 20. The term “surface” refers to the surface facing the lower surface. Further, the four side surfaces of the light emitting element 20 refer to surfaces that form side surfaces with respect to the lower surface and the upper surface.

  As shown in FIG. 1, for example, the substrate 10 has a first electrode 11 formed on one side with the electrode separation line L as a reference, a second electrode 12 formed on the other side, a light emitting element 20 mounted thereon, The first electrode 11 and the second electrode 12 are electrically connected to the light emitting element 20 and are made of a material having an appropriate mechanical strength so that the light emitting element 20 can be supported. Here, a plurality of electrode separation lines L may be formed on the substrate 10, and a plurality of light emitting elements may be mounted as necessary.

  More specifically, for example, a plate-like or leadframe-like metal substrate made of aluminum, copper, zinc, tin, lead, gold, silver, or the like can be applied as the substrate 10. In addition, the substrate 10 is a printed circuit board (PCB) on which a wiring layer is formed, or is a flexible flexible printed circuit board (FPCB), or includes a metal and partially. May include synthetic resin such as resin and glass epoxy, and ceramic material in consideration of thermal conductivity. In order to improve processability, EMC (Epoxy Mold Compound), PI (polyimide), graphene, glass synthetic fiber And the material formed by selecting at least one from those combinations may also be included.

  As shown in FIG. 1, the light emitting element 20 includes, for example, a first pad P <b> 1 that is electrically connected to the first electrode 11 on a part of the lower surface, and the second electrode 12 on the other part of the lower surface. A flip-chip type horizontally mounted light emitting element that is formed with a second pad P2 to be electrically connected and is mounted above the electrode separation line L by the bonding medium B may be used. In another embodiment, the horizontally mounted light emitting device may include reflectors (R1 and R2) provided on the upper surface and the lower surface so as to guide generated light to the side of the light emitting device 20.

  As such a light emitting element 20, a side surface on which a double-sided reflector (R1, R2) to which a Bragg reflection layer and a metal reflection layer are applied is provided on the upper surface and the lower surface so that an active layer having a sufficiently large area can be secured. The light emitting element 20 can be applied. As a result, the side-emitting light emitting element 20 is mounted in a horizontal state on the substrate 10 and the light is guided laterally, so that the thickness of the package can be made extremely thin. Further, the bonding medium B is in a form of being pressed in a disc shape between the first pad P1 in the horizontal state and the first electrode 11 in the horizontal state and between the second pad P2 in the horizontal state and the second electrode 12 in the horizontal state. Bonded, the first pad P1 and the first electrode 11 are electrically and physically firmly connected, and the second pad P2 and the second electrode 12 are electrically and physically firmly connected. Various types of bonding media such as solder paste and solder containing a solder component can be applied.

  Here, the light emitting element 20 may be any of a blue LED, a red LED, and a green LED, may be an LED that generates light of various wavelengths, or may be an ultraviolet LED. However, the present invention is not necessarily limited to these, and various types of light emitting elements provided with various horizontal or vertical LEDs and various types of signal transmission media such as bumps, wires, and solder can be applied. .

  Further, the light emitting element 20 may be made of a semiconductor. For example, an InN, AlN, InGaN, AlGaN, InGaAlN or the like is formed on a growth sapphire substrate or a silicon carbide substrate by a vapor phase growth method such as an MOCVD method. A nitride semiconductor may be epitaxially grown. The first light emitting element (LED1) and the second light emitting element (LED2) may be formed using a semiconductor such as ZnO, ZnS, ZnSe, SiC, GaP, GaAlAs, and AlInGaP in addition to the nitride semiconductor. . As these semiconductors, a stacked body formed in the order of an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer may be used. The light emitting layer (active layer) may be formed using a stacked semiconductor including a multiple quantum well structure or a single quantum well structure or a stacked semiconductor having a double hetero structure. Furthermore, you may make it select the light emitting element 20 of arbitrary wavelengths according to uses, such as a display use and illumination use.

  As shown in FIG. 1, the reflective mold member 30 is molded with the electrode separation line L on the substrate 10 using, for example, a mold, and guides the light generated from the light emitting element 20 to the front of the light emitting element package 100. Thus, a structure made of a mold resin material may be used in which the reflective cup portion 31 is formed in such a manner that the front surface is open and the top is open so that the light emitting element 20 can be accommodated. More specifically, as the reflective mold member 30, for example, an epoxy resin composition, a modified epoxy resin composition, a silicone resin composition, a modified silicone resin composition, a polyimide resin composition, a modified polyimide resin composition, polyphthal Amide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, polybutylene terephthalate (PBT) resin, EMC containing reflective material, white silicone containing reflective material, PSR (Photoimageable Solder Resist) or the like can be applied, and in these resins, titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, phosphor nitride You may make it contain light-reflective substances, such as a urine, mullite, chromium, a white type | system | group, and a metal-type component. However, the light emitting element 20 is not necessarily limited to the content described above, and any type of light emitting element can be applied.

  Moreover, as shown in FIGS. 1-3, the upper cover body 40 is made into the shape corresponding to the upper surface of the reflective mold member 30 so that the open upper part of the reflective cup part 31 of the reflective mold member 30 can be covered, for example. A metal plate-like reflector housed in a lid housing recess H formed in the reflective mold member 30 so that at least a portion thereof is firmly fixed to the reflective mold member 30. May be.

  More specifically, as shown in FIGS. 1 to 3, the upper lid 40 is formed, for example, on a left convex portion 43 that is formed on at least a part of the left side surface and projects leftward, and on at least a part of the rear side. You may make it include at least 1 of the rear convex part 42 which is formed and protrudes back, and the right convex part 41 which is formed in at least one part of the right side surface, and protrudes rightward.

  As shown in FIGS. 1 to 3, the left convex portion 43, the rear convex portion 42, and the right convex portion 41 are formed in the same shape as the upper lid body 40, It may be a square plate-like protrusion that protrudes leftward, backward, and rightward with the same thickness as the body 40. However, the left convex portion 43, the rear convex portion 42, and the right convex portion 41 are not necessarily limited to those shown in the drawings, and various forms that protrude from the upper lid 40 in the left direction, the rear direction, and the right direction, respectively. All protrusions can be applied.

  Also, as shown in FIGS. 1 to 3, the lid housing recess H has a left recess H <b> 3 corresponding to the left protrusion 43, a rear recess H <b> 2 corresponding to the rear protrusion 42, and a right side so as to correspond to these. You may make it include at least 1 of the right side recessed part H1 corresponding to the convex part 41. FIG.

  As a result, as shown in FIG. 2, the upper lid 40 can be inserted into the lid housing recess H and firmly assembled, and the left convex portion 43, the rear convex portion 42, and the right convex portion 41 are respectively connected to the left concave portion. It can be inserted into H3, the rear recess H2, and the right recess H1, and can be more firmly assembled to the reflective mold member 30 in the front-rear and left-right directions and the rotation axis direction.

  Further, for example, as shown in FIG. 1, an adhesive S that can bond the upper lid 40 to the reflective mold member 30 is attached to the lid housing recess H so that the upper lid 40 is bonded and fixed to the reflective mold member 30. An adhesive accommodating groove SH for accommodating may be formed.

  Thereby, as shown in FIGS. 1 and 2, the upper lid body 40 made of a metal can be more firmly fixed in the vertical direction to the reflective mold member 30 made of a resin using the adhesive S.

  Therefore, as shown in FIG. 2, the upper lid 40 can be more firmly assembled to the reflective mold member 30 in the directions such as the front and rear, right and left directions and the rotation axis direction by using the assembly structure of the convex portions and the concave portions. Using the adhesive S, it can be more completely fixed in the vertical direction. This is a structure in which the upper lid 40 is firmly fixed to the reflective mold member 30 even when a load, impact, pressure, or the like of the light guide plate 110 is transmitted to the interval maintaining unit 50 to be described later. It is possible to disperse the load in all directions of the axial direction and the vertical direction, greatly improving the durability, and preventing the parts from being detached or damaged.

  In addition, as illustrated in FIGS. 1 to 3, the interval maintaining unit 50 is formed on the upper lid 40 so as to maintain a constant optical interval between the light guide plate 110 and the light emitting element 20, for example, with a tip thereof. A protrusion-like structure projecting from the front surface of the upper lid 40 toward the light guide plate 110 so as to be in contact with the light guide plate 110 may be used.

  More specifically, as shown in FIGS. 1 to 3, the gap maintaining unit 50 has, for example, a light guide plate contact surface F that is in contact with the light guide plate 110 at the tip, and above the entrance of the reflective cup unit 31. Alternatively, it may be formed longer overall. Thereby, the area of the light guide plate contact surface F is further increased, the load and impact can be dispersed over a wider area, and the optical distance can be maintained more precisely.

  The interval maintaining unit 50 is formed in an integral shape made of the same material as that of the upper lid 40 and protrudes forward, that is, toward the light guide plate 110 with the same thickness as the upper lid 40. It may be a square plate-like protrusion. However, the interval maintaining unit 50 is not necessarily limited to the illustrated one, and all of various types of protrusions protruding forward from the upper lid 40 can be applied.

  In addition, as illustrated in FIGS. 1 to 3, the interval maintaining unit 50 may be formed to protrude forward from the front surface of the reflective mold member 30 by a protruding length so as to contact the light guide plate 110. Thereby, only the space | interval maintenance part 50 can contact the light-guide plate 110, and other parts can be spaced apart from the light-guide plate 110. FIG.

  Further, the light guide plate contact surface F of the gap maintaining unit 50 may be a square planar contact surface corresponding to the side surface of the light guide plate 110 in order to facilitate the distribution of impact and load. However, the present invention is not necessarily limited to this, and various forms of contact surfaces can be applied.

  Therefore, as shown in FIG. 3, the module substrate M on which the plurality of light emitting device packages 100 according to the embodiment of the present invention of FIGS. 1 and 2 are mounted can be separated from the light guide plate 110 by a predetermined distance or more. The light guide plate 110 can maintain a constant optical distance by the interval maintaining unit 50. In other words, the upper lid 40 that can be precisely aligned with the reflective mold member 30 and can be firmly fixed in all directions including the front and rear, right and left directions, the rotation axis direction, and the vertical direction is used. By providing the interval maintaining part 50 that contacts the light emitting element 20, the separation distance between the light emitting element 20 and the light guide plate 110 can be accurately maintained, thereby improving luminous intensity and color feeling and improving light efficiency. In addition, various light-emitting devices including a light conversion substance and a side-emitting light-emitting element can be provided, and high-quality products can be produced.

  4 is a perspective view showing another embodiment of the upper lid of the light emitting device package of FIG.

  In addition, as shown in FIG. 4, the gap maintaining unit 50 has a light guide plate contact surface F that contacts the light guide plate 110 at the tip thereof, and is a structure that is partially formed above the entrance of the reflective cup unit 31. It may be.

  2 and 3, the backlight unit 1000 according to the embodiment of the present invention includes the light emitting device package 100 according to the embodiment of the present invention, and includes a plurality of light emitting device packages. 100, a module substrate M on which the first electrode 11 is formed on one side and the second electrode 12 is formed on the other side with respect to the electrode separation line L, A light emitting element 20 including a first pad P1 electrically connected to the first electrode 11 and a second pad P2 electrically connected to the second electrode 12, and light generated from the light emitting element 20 provided on the substrate 10 The reflective cup portion 31 is shaped so that the front surface is opened so as to guide the light emitting device package 100 forward and the top is opened so that the light emitting device 20 can be accommodated. The reflective mold member 30, the upper lid 40 formed in a shape corresponding to the upper surface of the reflective mold member 30 so as to cover the open upper side of the reflective cup portion 31 of the reflective mold member 30, and the light emitting element 20. The light guide plate 110 provided in the light path of the light guide plate 110 is formed on the upper lid 40 so as to maintain a constant optical distance between the light guide plate 110 and the light emitting element 20, and the upper end thereof is in contact with the light guide plate 110. An interval maintaining unit 50 that protrudes from the front surface of the lid 40 toward the light guide plate 110 may be included. As a result, as shown in FIG. 3, the luminous intensity of the backlight unit 1000 can be adjusted and maintained uniformly and precisely using the plurality of interval maintaining units 50.

  Here, the substrate 10, the light emitting element 20, the reflective mold member 30, the upper lid body 40, and the gap maintaining unit 50 have the same configuration and role as the components of the light emitting element package 100 according to the embodiment of the present invention. Therefore, detailed description is omitted.

  5 is a perspective view showing a first embodiment of the light emitting device of the light emitting device package of FIG. 1, and FIG. 6 is a plan view of the light emitting device of FIG.

  As shown in FIGS. 1, 5, and 6, the light emitting device package 100 according to an embodiment of the present invention includes at least a front surface, a left side surface, a right side surface, and a rear surface of the light emitting device 20 except the top surface of the light emitting device 20. You may further contain the light conversion substance 60 formed in the shape surrounding one surface. Such a light conversion material 60 may include a phosphor or a quantum dot that converts the wavelength of light generated from the light emitting element 20.

  For example, the light emitting element 20 that generates light and the light conversion material 60 that converts light are optical elements that form a light source, and can be said to be a kind of light emitting device 120.

  Further, as shown in FIG. 6, the light conversion substance 60 has, for example, the same thickness T1 in the front surface direction, thickness T2 in the rear surface direction, thickness T3 in the right side surface direction, and thickness T4 in the left side surface direction. May be. In this case, since the optical characteristics generated from the front surface, the rear surface, the right side surface, and the left side surface are the same, the optical characteristics are symmetric.

  7 to 11 are plan views showing second to sixth embodiments of the light emitting device of FIG.

  The light-emitting device 120 is not necessarily limited to that shown in FIG. 6, and as shown in FIG. 7, the thickness T 1 in the front direction and the thicknesses T 2, T 3, T 4 in the remaining directions of the light conversion material 60 It may be different. For example, in the light emitting device 120, the thickness T1 in the front direction is further thicker, and when the light emitting element 20 is a blue LED, the light that diverges in a direction other than the front direction hits the phosphor or the quantum dot and is converted into light. The light that diverges in the front direction contains a lot of light with a wavelength different from that of the blue light because the probability of being converted into light by hitting the phosphor or quantum dot is high. Become. Therefore, the optical characteristics differ depending on the thickness of the light conversion material 60, and various optimal light sources that take into consideration the luminous intensity, light efficiency, and the like can be realized.

  Further, the light emitting device 120 may have an inclined surface C1 formed on the outer surface of the front surface portion of the light conversion material 60 as shown in FIG. 8, and the front surface of the light conversion material 60 as shown in FIG. A curved surface C2 may be formed on the outer surface of the part. Therefore, the optical characteristics differ depending on the form of the light conversion substance 60, and various optimal light sources that take into consideration the luminous intensity, the light efficiency, and the like can be realized.

  Furthermore, as shown in FIG. 10, the light emitting device 120 may further include a lens portion LS having a convex or concave lens surface that is formed on the front surface portion of the light conversion substance 60 and guides the optical path. Therefore, the optical characteristics differ depending on the form of the lens portion LS, and various optimal light sources can be realized in consideration of the luminous intensity, the light efficiency, and the like.

  Furthermore, as shown in FIG. 11, the light emitting device 120 may further include a reflecting member 70 that is formed on the left side or the right side of the light conversion substance 60 and reflects light. Therefore, the optical characteristics differ depending on the form of the reflecting member 70, and it is possible to realize various optimal light sources that take into consideration the luminous intensity and the light efficiency.

  12 to 15 are cross-sectional views illustrating steps of manufacturing a light emitting device for a light emitting device package according to an embodiment of the present invention.

  A manufacturing process of the light emitting device 120 of the light emitting device package 100 according to an embodiment of the present invention will be described step by step with reference to FIGS. First, as shown in FIG. 12, a release paper 1 having an adhesive surface D formed on one surface is prepared. Next, as shown in FIG. 13, the first pad P <b> 1 and the second pad P <b> 2 of the plurality of flip-chip type light emitting elements 20 are mounted on the release paper 1. Here, the light emitting element 20 may include reflectors (R1, R2) provided on the upper surface and the lower surface of the light emitting element 20 so as to selectively guide the generated light to the side of the light emitting element 20, respectively.

  Next, as shown in FIG. 14, the light-emitting substance 60 is adjacent to the light-emitting element 20 adjacent to the light-emitting element 20 at a height equal to or lower than the height HH of the upper surface of the light-emitting element 20 so that the light conversion material 60 surrounds the side surface of the light-emitting element 20. The light conversion substance 60 in a fluid state is injected into the space between them, and the light conversion substance 60 is applied onto the release paper 1. At this time, instead of using a separate mold, the light conversion substance 60 is made to flow so as to flow into the space between the light emitting element 20 and the adjacent light emitting element 20 by using gravity. And the light conversion substance 60 can be apply | coated rapidly.

  Next, as shown in FIG. 15, the light conversion substance 60 is cut along the cutting line CL so that the light conversion substance 60 is cured and unitized into a plurality of unit light emitting devices. At this time, for example, by setting the position of the cutting line CL in various ways, the thicknesses T3 and T4 in the side surface direction of the light conversion material 60 can be variously formed. Therefore, the side-emitting light emitting device 120 having very various optical characteristics can be manufactured inexpensively and quickly, and productivity can be greatly improved.

  FIG. 16 is a flowchart for explaining a method of manufacturing a light emitting device according to an embodiment of the present invention.

  As shown in FIGS. 12-16, the manufacturing method of the light-emitting device 120 by one Embodiment of this invention is the release paper preparation step S1 which prepares the release paper 1 in which the adhesive surface D was formed in one surface, flip chip type The light emitting element mounting step S2 for mounting the first pad P1 and the second pad P2 of the plurality of light emitting elements 20 on the release paper 1 and the light converting material 60 so as to surround the side surface of the light emitting element 20. Light conversion in which a light conversion substance 60 in a fluid state is injected into a space between the light emitting element 20 and the adjacent light emitting element 20 at a height equal to or lower than the height HH of the upper surface, and the light conversion substance 60 is applied onto the release paper 1. Substance application step S3, light conversion substance curing step S4 for curing the light conversion substance 60, and singulations for cutting the light conversion substance 60 along the cutting line CL so as to be united into a plurality of unit light emitting devices. -Up S5 and it may also include. In another embodiment of the present invention, the light emitting device 20 may include reflectors (R1, R2) provided on the upper and lower surfaces of the light emitting device 20 so as to guide the generated light to the side of the light emitting device 20. .

  FIG. 17 is an exploded perspective view showing a light emitting device package according to another embodiment of the present invention.

  As shown in FIG. 17, the light emitting device 20 of the light emitting device package 200 according to another embodiment of the present invention emits light so that light generated from the light emitting layer is directed above the light emitting device 20, that is, in front of the light emitting device package 200. The vertically mounted light emitting device in which the side surface of the element 20 is bonded to the substrate 10 by the adhesive layer A, and the first pad P1 and the second pad P2 are bonded to the substrate 10 by the bonding medium B so as to be perpendicular to the horizontal plane of the substrate 10. It may be an element.

  Here, the bonding medium B includes a space that forms an angle between the vertical first pad P1 and the horizontal first electrode 11, and between the vertical second pad P2 and the horizontal second electrode 12. You may make it each adhere | attach on the space which makes the corner | angular.

  Further, the bonding medium B electrically and physically firmly connects the first pad P1 and the first electrode 11, and electrically and physically firmly connects the second pad P2 and the second electrode 12. Various types of bonding media such as solder paste and solder containing a solder component can be applied. Further, the light-emitting substance 60 such as the vertically mounted light-emitting element 20 and the phosphor is mounted by mounting a plurality of light-emitting elements 20 on a release paper, applying and curing the light-converting substance 60 thereon, and then cutting. You may manufacture in the form of the chip scale package (Chip Scale Package; CSP) formed. In addition, the light emitting device 20 can be manufactured by various methods.

  Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely an example, and various modifications and other equivalent embodiments may be made by those having ordinary skill in the art. You will understand that it is possible. Therefore, the technical protection scope of the present invention should be determined by the technical idea of the claims.

DESCRIPTION OF SYMBOLS 10 Board | substrate 11 1st electrode 12 2nd electrode 20 Light emitting element 30 Reflective mold member 31 Reflective cup part 40 Upper cover body 41 Right side convex part 42 Back convex part 43 Left side convex part 50 Space | interval maintenance part 60 Light conversion substance 100, 200 Light emitting element Package 110 Light guide plate 120 Light-emitting device F Light guide plate contact surface H Cover recess H1 Right recess H2 Back recess H3 Left recess L Electrode separation line LS Lens part P1 First pad P2 Second pad R1, R2 Reflector SH Adhesive storage groove

Claims (13)

A substrate in which a first electrode is formed on one side and a second electrode is formed on the other side with respect to an electrode separation line;
A light emitting device including a first pad electrically connected to the first electrode and a second pad electrically connected to the second electrode;
A reflective surface provided on the substrate and having a front surface opened so as to guide light generated from the light emitting device to the front of the light emitting device package and an upper surface opened to accommodate the light emitting device. A reflective mold member in which a cup portion is formed;
An upper lid formed in a shape corresponding to the upper surface of the reflective mold member so as to cover the open upper side of the reflective cup portion of the reflective mold member;
The upper lid is formed to maintain a constant optical distance between the light guide plate and the light emitting element, and the front end of the upper lid is in contact with the light guide plate toward the light guide plate. A light emitting device package comprising: a projecting interval maintaining portion.   The distance maintaining part is formed with a light guide plate contact surface in contact with the light guide plate at a tip thereof, and is formed partially or entirely longer above the entrance of the reflection cup part. The light emitting device package according to claim 1.   The said upper cover body is a metal plate-shaped reflector accommodated in the cover body accommodation recessed part formed in the said reflection mold member so that at least one part may be fixed to the said reflection mold member. Item 2. A light emitting device package according to Item 1. The upper lid is formed on at least a part of the left side surface and protrudes leftward, and is formed on at least a part of the rear surface and protrudes rearward and at least part of the right side surface. Including at least one right-side convex portion that is formed and protrudes in the right direction;
The lid housing recess includes at least one of a left recess corresponding to the left protrusion, a rear recess corresponding to the rear protrusion, and a right recess corresponding to the right protrusion. 4. The light emitting device package according to 3.   The lid housing recess includes an adhesive housing groove that houses an adhesive capable of bonding the upper lid to the reflective mold member so that the upper lid is bonded and fixed to the reflective mold member. The light emitting device package according to claim 3.   In the light emitting device, the first pad is formed on a part of a lower surface, the second pad is formed on another part of the lower surface, and a light emitting layer is formed in parallel with the first pad and the second pad, The flip-chip type horizontally mounted light emitting device is mounted on the electrode separation line and is electrically connected to the substrate so that the first pad and the second pad are parallel to the substrate. The light emitting device package according to claim 1.   The horizontal mounting type light emitting device includes at least a part of an upper surface of the light emitting device and at least a part of a lower surface of the light emitting device so as to guide light generated from the light emitting layer in a direction parallel to the first pad and the second pad. The light emitting device package according to claim 6, further comprising a reflector formed in at least one portion of the light emitting device package.   The light conversion material according to claim 6, further comprising a light conversion material formed in a shape surrounding at least one of a front surface, a left side surface, a right side surface, and a rear surface of the light emitting device except for an upper surface and a lower surface of the light emitting device. Light emitting device package.   The light emitting device package according to claim 8, wherein the light conversion material surrounding the light emitting device has different thicknesses on at least one of a front surface, a left side surface, a right side surface, and a rear surface of the light emitting device.   The light emitting device package according to claim 8, wherein an inclined surface or a curved surface is formed on an outer surface of the light conversion material surrounding at least one surface of each surface of the light emitting device.   The light emitting device according to claim 8, further comprising a lens unit that is formed in at least one surface direction of each surface of the light emitting device on which the light conversion material surrounding the light emitting device is formed to guide an optical path. Device package.   The light emitting device includes a light emitting layer formed in parallel with the first pad and the second pad, and is electrically connected to the substrate so that the first pad and the second pad are perpendicular to the substrate. The light emitting device package according to claim 1, wherein the light emitting device package is a vertically mounted light emitting device. A substrate in which a first electrode is formed on one side and a second electrode is formed on the other side with respect to an electrode separation line;
A light emitting device including a first pad electrically connected to the first electrode and a second pad electrically connected to the second electrode;
A reflective surface provided on the substrate and having a front surface opened so as to guide light generated from the light emitting device to the front of the light emitting device package and an upper surface opened to accommodate the light emitting device. A reflective mold member in which a cup portion is formed;
An upper lid formed in a shape corresponding to the upper surface of the reflective mold member so as to cover the open upper side of the reflective cup portion of the reflective mold member;
A light guide plate provided in the light path of the light emitting element;
The upper lid body is formed so as to maintain a constant optical distance between the light guide plate and the light emitting element, and the front end of the upper lid body faces the light guide plate so that the tip of the upper lid body contacts the light guide plate. The backlight unit includes a spacing maintaining portion that protrudes.

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