KR101078032B1 - Side view type light emitting device package and backlight module comprising the same - Google Patents

Abstract

The present invention provides a side light emitting device package having a small size and excellent stability and a backlight module having the same. The present invention provides a lead frame including at least one lead, a light emitting device on the lead frame, and a lead frame. Provided is a side emitting type light emitting device package and a backlight module having the same, wherein the light emitting device has a molding material having a supporting part on a lower side thereof and a reflecting part for emitting light generated by the light emitting device in a lateral direction.

Description

Side view type light emitting device package and backlight module comprising the same}

The present invention relates to a side light emitting device package and a backlight module having the same, and more particularly, to a side light emitting device package and a backlight module having the same having excellent stability.

In general, the light emitting device is used as a light source of the backlight module in an electronic device, such as a display device. The light emitting device may be packaged in various forms before coupling to the backlight module. As such a light emitting device package, a side view type light emitting device package has been used for small electronic communication devices such as mobile phones and PDAs, but a top view type for medium and large electronic devices such as TVs and monitors. Light emitting device packages have been used.

Top light emitting device packages are mounted on a rod-shaped substrate to form a rod-shaped light emitting device module. The light emitting device module is disposed on the side of the light guide plate to form an edge type backlight module.

However, the edge-type backlight module has a problem that the thickness of the corresponding portion is thick because the rod-shaped light emitting device module is arranged sideways on the substrate. In order to solve such a problem, there is a need for a method of employing a side light emitting device package in an edge type backlight module instead of a top light emitting device package.

The present invention has been made to solve various problems including the above problems, and an object thereof is to provide a side light emitting device package and a backlight module having a small size and excellent stability.

The present invention provides a molding comprising a lead frame including at least one lead, a light emitting element on the lead frame, a reflecting portion coupled to the lead frame and allowing light generated in the light emitting element to be emitted laterally. Provided is a side light emitting device package having a material.

According to this other characteristic of this invention, the lower side of the said molding material can be made thicker than the upper side of the said molding material.

According to another feature of the invention, the thickness difference between the upper side and the lower side of the molding material may be less than the thickness of the conductive layer of the printed circuit board on which the side-emitting light emitting device package is to be mounted.

According to still another feature of the present invention, the thickness difference between the upper side and the lower side of the molding material may be 100 μm or less.

According to still another feature of the present invention, the width of the lower end surface of the molding material may be greater than the width of the upper end surface of the molding material.

According to another feature of the invention, the width difference between the width of the upper cross-section and the lower cross-section of the molding material may be less than the thickness of the conductive layer of the printed circuit board on which the side-emitting light emitting device package is mounted.

According to another feature of the present invention, the width difference between the width of the upper cross section and the lower cross section of the molding material may be 100 μm or less.

According to still another feature of the present invention, it is possible to have support portions at both lower ends of the molding material.

According to another feature of the present invention, the difference between the lower thickness at the support of the molding material and the lower thickness at the center of the molding material may be equal to or less than the thickness of the conductive layer of the printed circuit board on which the side light emitting device package is mounted. have.

According to still another feature of the present invention, the difference between the lower thickness at the support of the molding material and the lower thickness at the center of the molding material may be 100 μm or less.

According to another feature of the invention, the support portion may be formed in a direction opposite to the direction in which the light generated by the light emitting element of the molding material is emitted.

According to another feature of the invention, at least one lead of the lead frame is in close contact with the bottom surface of the molding material extends along the bottom surface of the molding material in the direction in which the light is emitted, the end protrudes out of the molding material It can be done.

According to another feature of the present invention, at least one lead of the lead frame may be extended from the inside of the molding material to the outside, bent and in close contact with the bottom of the molding material to extend along the bottom of the molding material.

According to still another feature of the present invention, at least one lead of the lead frame may be extended from the bottom of the molding material to the outside of the molding material.

According to still another feature of the present invention, the length of the support portion from the lower side of the molding material to the upward direction may be 500 μm or less.

According to still another feature of the present invention, the molding material may have a support portion on its upper side.

The invention also provides a substrate, a reflective sheet on a portion of the substrate, a light guide plate on the reflective sheet, and the above-mentioned side-emitting light emitting device packages arranged to irradiate light onto the light guide plate on another portion of the substrate. It provides a backlight module having any one.

According to the side light emitting device package and the backlight module having the same according to the present invention made as described above, it is possible to implement a side light emitting device package and a backlight module having the same, while having a small size and excellent stability.

1 is a bottom perspective view schematically showing a side light emitting device package according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line II-II 'of the side-emitting light emitting device package of FIG. 1.
3 is a cross-sectional view taken along line III-III ′ of the side-emitting light emitting device package of FIG. 1.
4 is a side view of the side-emitting light emitting device package of FIG. 1.
5 is a bottom view of the side-emitting light emitting device package of FIG. 1.
6 is a front view of the side-emitting light emitting device package of FIG. 1.
7 is a conceptual diagram schematically illustrating a case in which a side light emitting device package according to another embodiment of the present invention is disposed on a printed circuit board.
8 is a side cross-sectional view schematically showing a side light emitting device package according to another embodiment of the present invention.
9 is a bottom perspective view schematically showing a side light emitting device package according to another embodiment of the present invention.
10 is a perspective view schematically showing a side light emitting device package according to another embodiment of the present invention.
11 is a schematic side view illustrating a backlight module according to another embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms, and the following embodiments are intended to complete the disclosure of the present invention, the scope of the invention to those skilled in the art It is provided to inform you completely. In addition, the components may be exaggerated or reduced in size in the drawings for convenience of description.

In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on the orthogonal coordinate system, and can be interpreted in a broad sense including the three axes. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

1 is a bottom perspective view schematically illustrating a side light emitting device package according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line II-II 'of the side light emitting device package of FIG. 3 is a cross-sectional view taken along line III-III ′ of the side light emitting device package of FIG. 1, FIG. 4 is a side view of the light emitting device package of FIG. 1, and FIG. 5 is a side light emitting device of FIG. 1. 6 is a bottom view of the device package, and FIG. 6 is a front view of the side light emitting device package of FIG. 1.

Referring to the drawings, the side-emitting light emitting device package according to the present embodiment includes a lead frame 10, a light emitting device 20 and a molding material (40).

The light emitting device 20 may be used as a light source of various electronic devices as a device emitting light by receiving an electric signal. For example, the light emitting device 20 may be composed of a diode of a compound semiconductor, and the light emitting device 20 may be referred to as a light emitting diode (LED). Such light emitting diodes may emit light of various colors depending on the material of the compound semiconductor. On the other hand, the light emitting element 20 can emit considerable heat together with light emission, and the emission of such heat will be described later.

The leadframe 10 includes at least one lead 14, in which the leadframe 10 includes leads 14 arranged in the + y and -y directions about the light emitting device 20. The case is shown. The light emitting device 20 may be disposed on the lead frame 10. For example, the light emitting device 20 may be bonded onto the lead frame 10 using a suitable adhesive member. Furthermore, the light emitting device 20 may be electrically connected to the lead frame 10 using a suitable connector, for example, a bonding wire (not shown).

The lead frame 10 may further include a die pad 12 in addition to the lead 14 as shown in the drawing. The light emitting device 20 disposed on the lead frame 10 is particularly a die pad 12. It may be disposed on. In this case, the die pad 12 may be bent to have the groove 13, and the light emitting device 20 may be bonded onto the die pad 12 in the groove 13. The depth of the groove 13 may be greater than the height of the light emitting device 20 so that the light emitting device 2 may be seated in the groove 13.

The leads 14 may serve to mediate electrical signal transmission between the light emitting device 20 and an external device. The number of leads 14 may be appropriately selected according to the light emitting element 20, for example, in the case of a light emitting diode, a pair of leads may be provided as shown. The die pad 12 may be separated from the leads 14 or may be connected to one of the leads 14 in that the die pad 12 may not directly participate in the electrical signal transmission of the light emitting device 20. In the figure, the lead 14 arranged in the + y direction around the light emitting element 20 is shown integrally with the die pad 12. As shown in FIG. Of course, the lead 14 disposed in the + y direction with respect to the light emitting device 20 is spaced apart from the die pad 12, but various modifications may be made such that both may be electrically connected through wiring (wiring) or the like. This is possible. Of course, the wiring is not made between the lead 14 and the die pad 12, but may be made between the lead 14 and the light emitting device 20. Of course, the lead 14 and the light emitting device 20 arranged in the -y direction with respect to the light emitting device 20 may also be electrically connected through wiring (not shown).

The die pad 12 and the lid 14 may be made of the same material or different materials. When the die pad 12 and the lead 14 are made of the same material, the lead frame 10 may be formed by patterning a conductive plate using a punching technique or the like. When there is a concern that the die pad 12 may be separated from the lead frame 10 during the packaging operation, the die pad 12 may be integrally formed with one of the plurality of leads 14.

The molding material 40 may be coupled to the lead frame 10 to form an overall appearance of the side-emitting light emitting device package. The molding material 40 has a reflecting portion 50 for causing the light generated by the light emitting element 20 to be emitted laterally, and has a supporting portion 42 at the lower side. The reflector 50 may be understood to define an opening 52 in a direction (+ x direction) in which light generated by the light emitting device 20 is to be emitted. Accordingly, the light emitting device 20 may be exposed in the molding material 40 through the opening 52. Of course, in order to protect the light emitting device 20 from external moisture or the like, a light-transmitting filler (not shown) covering the light emitting device 20 exposed by the molding material 40 is required so that the light emitting device 20 is not exposed to the outside. Of course, it can also be formed.

Such fillers may incorporate phosphors to fill the grooves 13 and / or the openings 52 in whole or in part. Phosphors may be used in various colors independently or in combination. For example, the phosphor may implement white color by using one or a combination of yellow phosphor, green phosphor, and red phosphor, but the present embodiment is not limited thereto. The filler may be filled only in the groove 13 or may be filled together in the groove 13 and the opening 52. For example, the groove 13 may be filled with a filler mixed with phosphors, and the opening 52 may be separately filled with a phosphor-free (transparent) filler.

The reflector 50 is disposed to face the side of the light guide plate when mounted in the backlight module (see FIG. 11). The reflector 50 may reflect light emitted from the light emitting device 20 to increase the luminous efficiency of the light emitting device 20. For example, the opening 52 may be formed to have an inclined surface, and the angle of the inclined surface may be appropriately selected in consideration of light reflection efficiency and formability.

The molding material 40 may be formed on the lead frame 10 by using a suitable molding method such as an injection molding method or a transfer molding method. The molding material 40 may comprise a suitable resin, such as an epoxy molding resin. The reflector 50 may refer to a portion of the molding material 40 including the opening 52.

In such a configuration, in the case of the side-emitting type light emitting device package according to the present embodiment, the molding material 40 has a supporting portion 42 at the bottom thereof. Specifically, the support part 42 is provided in the both ends of the molding material 40 at the lower side (+ y direction and -y direction).

As shown in FIG. 1, the side-emitting light emitting device package has a thickness t4 (see FIG. 4) of the molding material 40 in a direction in which light is emitted (+ x direction) at a height h1 in the z direction. It is relatively thin. Accordingly, in order to mount the side light emitting device package, when the side light emitting device package is disposed at a lower portion thereof, that is, in a -z direction and disposed on a printed circuit board (not shown) that is substantially parallel to the xy plane, The thickness t4 of the molding material 40 is so thin that the lid 14 does not come into contact with the printed circuit board and the side light emitting device package collapses. It may not be easy.

However, in the case of the side-emitting light emitting device package according to the present embodiment, since the molding material 40 has the supporting portion 42 at the bottom, even if the thickness t4 of the molding material 40 of the side-emitting light emitting device package is thin. By increasing the length t1 in the x-axis direction at the portion of the support portion 42 of the molding material 40 in contact with the printed circuit board, the side light emitting device package is effectively prevented from falling down, thereby ensuring stability of the side light emitting device package. Can dramatically increase.

Meanwhile, as shown in the drawing, the support part 42 may be formed in the opposite direction to the direction in which the light generated by the light emitting device 20 is emitted (+ x direction) of the molding material 40. At this time, at least one lead 14 of the lead frame 10 is in close contact with the bottom surface of the molding material 40 extends along the bottom surface of the molding material 40 and extends in a direction in which light is emitted (+ x direction), Its end may be protruded out of the molding material (40). In detail, at least one lead 14 of the lead frame 10 extends from the inside of the molding material 40 to the outside, and is bent to closely contact the bottom surface of the molding material 40 to form the bottom surface of the molding material 40. And extends in the direction in which the light is to be emitted (+ x direction), the end of which protrudes out of the molding material 40. In this case, the inner part of the molding material 40 of the leads 140 may be referred to as an inner lead, and the outer part of the molding material 40 may be referred to as an outer lead. The external lead may be provided to form an electrical contact between the side-emitting light emitting device package and the external product. The outer lead extends from the inner lead and may be arranged bent at least once on the bottom surface of the molding material 40.

Such a side-emitting type light emitting device package may be mounted on a printed circuit board (not shown) positioned below the bottom of the bottom surface, that is, positioned in the −z direction and substantially parallel to the xy plane (see FIG. 11). In this case, the lead 14 exposed on the bottom surface of the side-emitting light emitting device package in the -z direction is soldered to the printed circuit board. As described above, in the case of the side-emitting light emitting device package according to the present embodiment, the lead 14 is molded. It is in close contact with the bottom of the ash 40 extends along the bottom of the molding material 40 extends in the direction in which light is to be emitted (+ x direction) so that the end is protruded out of the molding material 40, through soldering By securing a sufficient area of the lead in contact with the printed circuit board it can significantly increase the stability of the side-emitting light emitting device package.

Of course, in the side-emitting type light emitting device package according to the comparative example of the present invention, the lead 14 is in close contact with the bottom of the molding material 40 extends along the bottom of the molding material 40, the direction in which light is to be emitted (+ It may be considered to extend in the longitudinal direction (y direction) of the side light emitting device package, which is substantially perpendicular to the direction, rather than the x direction, so that the end portion protrudes out of the molding material 40. However, in this case, when the plurality of side light emitting device packages are arranged in a line as close to each other as possible in the y direction, since the leads 14 extend in the y direction and protrude outside the molding material 40, the adjacent side light emitting devices are adjacent to each other. The distance between the light emitting device packages is bound to be farther away. Accordingly, when manufacturing the backlight module using the side light emitting device packages, the number of the side light emitting device packages per unit length is reduced, so that a small size and high efficiency backlight module cannot be realized.

In contrast, in the case of the side-emitting type light emitting device package according to the present embodiment, the lead 14 is in close contact with the bottom surface of the molding material 40 and extends along the bottom surface of the molding material 40. And the end portion protrudes out of the molding material 40, thereby sufficiently securing the area of the lead in contact with the printed circuit board through soldering, thereby significantly increasing the stability of the side-emitting light emitting device package. In this case, a small size and high efficiency backlight module can be realized.

For reference, the side light emitting device package according to the comparative example of the present invention as described above is not well known.

In addition, in the case of the side-emitting light emitting device package having such a structure, the molding member 40 is supported in the opposite direction (-x direction) to the direction in which the light generated by the light emitting device 20 is emitted (+ x direction). 42 and at the same time, the lead 14 is in close contact with the bottom of the molding member 40 extends along the bottom of the molding member 40 and extends in the direction in which light is to be emitted (+ x direction) so that the end is molded. By protruding to the outside of the ash 40, the total thickness (t1 + t2 + t3, see FIG. 4) of the part of the side light emitting device package which is in close contact with the printed circuit board is 42 of the molding member 40. By greater than the thickness (t4 = t2) of the portion excluding, it is possible to significantly increase the ease of handling and stability of the side-emitting light emitting device package.

7 is a conceptual diagram schematically illustrating a case in which a side light emitting device package according to another embodiment of the present invention is disposed on a printed circuit board. In the side-emitting type light emitting device package, as shown in FIG. 11, the bottom surface of the molding material is positioned on the substrate 110 so that the emitted light is emitted laterally. However, the side light emitting device package may not only be used as the side light emitting device but may also be used as the top light emitting device package by being disposed on the printed circuit board 60 as shown in FIG. 7.

At this time, when the degree of protruding of the support 42 of the molding material 40 is smaller than the thickness of the conductive layer 62 on the printed circuit board 60, the support 42 is formed of the conductive layer (as shown in FIG. 7). By arranging the side light emitting device package to dig 62, the top surface of the side light emitting device package (upper surface in the arrangement as shown in FIG. 7) can be substantially parallel to the printed circuit board 60. . However, if the degree of protruding of the support 42 of the molding material 40 is greater than the thickness of the conductive layer 62 on the printed circuit board 60, the top surface of the side light emitting device package (as shown in FIG. 7) is disposed. The upper surface in the closed state) cannot be substantially parallel to the printed circuit board 60.

Therefore, the difference between the lower thickness (t1 + t2 in FIG. 4) at the support part 42 of the molding material 40 and the lower thickness (t2 in FIG. 4) at the center of the molding material 40 is the side light emission type. By making the light emitting device package less than or equal to the thickness of the conductive layer 62 of the printed circuit board 60 to be mounted, the side light emitting device package can be used as a top light emitting device package. In general, since the thickness of the conductive layer 62 of the printed circuit board 60 is 100 μm, the difference between the lower thickness at the support 42 of the molding material 40 and the lower thickness at the center of the molding material 40 is different. It can be made to be 100 micrometers or less.

The lead 14 is in close contact with the bottom surface of the molding material 40 and extends along the bottom surface of the molding material 40, and extends in the direction in which light is to be emitted (+ x direction), and an end thereof protrudes out of the molding material 40. In addition, when the molding member 40 has a supporting portion protruding in a direction opposite to the direction in which light is to be emitted (+ x direction) (-x direction), if the degree of protruding is excessively large, the backlight module is eventually used. The non-light emitting portion (dead space) is increased in the display device is formed. In addition, if the degree of protruding is excessively large, the yield may be deteriorated by impairing the stability of the reflow process in the reflow process of mounting the side-emitting light emitting device package on the printed circuit board. Of course, when the degree of protruding is insignificant, it is inevitable to hinder the handling of the side-emitting light emitting device package and the stability of the reflow process as described above.

Therefore, the thickness of the molding material 40 (except for the supporting part 42) in the direction (+ x direction) in which the light generated by the light emitting device 20 is to be emitted is t2 (= t4) and at least the thickness of the lead frame 10. The length in the direction away from the molding material 40 of the portion protruding out of the molding material 40 of the lead 14 in the direction t3 and the direction in which the light is to be emitted (+ x direction) (-x direction) If the length in the direction away from the molding material 40 (except the support 42) of the protruding support 42 is referred to as t1, it is necessary to properly maintain t2 / (t1 + t3). The following Table 1 is a table showing the defective rate when manufacturing the backlight module by changing the ratio of t2 and t1 + t3.

Numerical condition (t2: t1 + t3) Defective rate 7.0: 1 25.0% 6.5: 1 5.0% 6.0: 1 3.0% 5.5: 1 2.0% 5.0: 1 1.8% 4.5: 1 1.7% 4.0: 1 1.8% 3.5: 1 2.0% 3.0: 1 6.0% 2.0: 1 7.0%

Referring to the table, it can be seen that when t2 / (t1 + t3) is 3.5 to 6.5, the defective rate is surely reduced to 5% or less. Therefore, it is preferable to make t2 / (t1 + t3) 3.5 to 6.5.

On the other hand, the lead 14 is in close contact with the bottom surface of the molding material 40 extends along the bottom surface of the molding material 40 and extends in the direction in which light is to be emitted (+ x direction), the end of which is outside the molding material 40. In the z-direction of the side-emitting light emitting device package even though the molding member 40 has a supporting portion protruding in a direction opposite to the direction in which light is to be emitted (+ x direction) (-x direction). If h1) becomes considerably large, when the side light emitting device package is placed on a printed circuit board or the like to mount the side light emitting device package, the lead 14 is not in contact with the printed circuit board and the side light emitting device package is mounted. Handling of the side light emitting device package may not be easy, such as a problem that the light emitting device package collapses. Therefore, it is also important to set the relationship between the thickness t2 of the molding material 40 of the side-emitting light emitting device package and the height h1 of the molding material 40 in the z direction.

As a result of a number of repeated experiments, when the thickness t2 of the portion of the side-emitting light emitting device package except for the support part 42 of the molding material 40 is 1.5 mm, the height of the molding material 40 in the z direction ( When h1) exceeds 3mm, when the side light emitting device package is disposed on a printed circuit board or the like to mount the side light emitting device package, the lid 14 is not in contact with the printed circuit board and the side light is emitted. The rate at which the fluorescent light emitting device package collapses sharply increased. Therefore, the ratio of the thickness t2 of the portion excluding the supporting portion 42 of the molding material 40 of the side-emitting light emitting device package to the height h1 of the molding material 40 in the z direction is preferably 1: 2 or less. Do.

In addition, as a result of many repeated experiments, when the thickness t2 of the portion excluding the supporting portion 42 of the molding material 40 of the side-emitting light emitting device package is 1.5 mm, the molding material 40 moves toward the z direction. If the height h1 is less than 1.8 mm, when the side light emitting device package is mounted to the backlight module together with the light guide plate, it is difficult to properly center the center of the light emitting device 20 and the light guide plate of the side light emitting device package. Was found to occur. If the center of the light emitting device 20 and the center of the light guide plate of the side light emitting device package are not properly aligned, the efficiency of the backlight module may be drastically reduced. Therefore, the ratio of the thickness t2 of the portion excluding the support 42 of the molding material 40 of the side-emitting light emitting device package to the height h1 of the molding material 40 in the z direction is preferably 1: 1.2 or more. Do.

As a result, the height h1 of the molding material 40 in the z direction and the thickness t2 of the portion excluding the supporting part 42 of the molding material 40 of the side-emitting light emitting device package are 1.2 ≦ h / t1 ≦ 2. By satisfying the relationship as described above, it is possible to effectively achieve a significant improvement in the stability of the side-emitting light emitting device package and prevention of light efficiency degradation in the backlight module.

The lead frame 10 may further include a heat radiating pad 30 connected to the die pad 12 and extended to the bottom surface of the molding material 40 in addition to the die pad 12 on which the light emitting device 20 is disposed. It may be. The light emitting device 20 may generate heat in addition to generating light during operation. When excessive heat is generated, the light emitting device 20 may hinder the performance of the light emitting device 20. In order to prevent this may further include a heat radiation pad 30 for discharging the heat generated by the light emitting device 20 to the outside. In this case, heat emitted from the light emitting device 20 may be transferred to the heat radiating pad 30 through the die pad 12 below, and released to the outside through the heat radiating pad 30.

The heat dissipation pad 30 may be connected to the die pad 12 to extend from the inside of the molding material 40 to the outside through the bottom surface of the molding material 40. It may be in close contact with the bottom of the 40 and may extend in the -x direction or the + x direction along the bottom of the molding material 40.

Of course, as shown in FIG. 8, which is a side cross-sectional view schematically showing a side light emitting device package according to another embodiment of the present invention, the heat radiation pad 30a may be increased in thickness to increase the heat radiation effect. In this case, since the thickness of the die pad 12a is relatively thick as compared with the die pad 12 of FIG. 1, it is difficult to bend the die pad 12a, so that the surface of the die pad 12a is different from that shown in FIG. A dent may be formed in the groove 13a for mounting the light emitting device 20.

In any case, the die pad 12 and the heat dissipation pads 30 and 30a may be integral. Of course, the two may be separately formed and then connected. The heat radiation pad 30 may be formed of a material having high thermal conductivity, for example, a metal.

On the other hand, the reflector 50 may include a bottom portion 54 below the opening 52 and a ceiling 56 above the opening 52 as shown. As clearly shown in FIG. 6, the reflector 50 may have an asymmetric shape with the center of the opening 52 biased upward. For example, the reflector 50 may have a vertically asymmetric structure in which the thickness of the bottom portion 54 is greater than the thickness of the ceiling 56. This structure contributes to raising the center height of the opening 52 and may reduce light loss in the backlight module, as described below.

On the other hand, it has been described that the molding material 40 has a support 42 in each of the lower end portion, but the present invention is not limited to this, of course, various modifications are possible. For example, as shown in FIG. 9, which is a bottom perspective view schematically illustrating a side-emitting type light emitting device package according to another embodiment of the present invention, the support 42 is provided only at both lower end portions of the molding member 40. Rather, it may be extended all the way (in the y direction) along the lower side of the molding material 40.

In this case, it will be understood that the lower side of the molding material is thicker than the upper side of the molding material 40. Of course, as described above with reference to FIG. 7, the difference in thickness between the upper side and the lower side of the molding material 40 is due to the conductive layer 62 of the printed circuit board 60 (see FIG. 7) on which the side light emitting device package is mounted. 7) the thickness may be less than or equal to, and specifically, the thickness of the conductive layer of the general printed circuit board may be 100 μm or less.

Of course, the width of the lower end surface of the molding material 40 may be larger than the width of the upper end surface of the molding material 40 with respect to the side light emitting device package. In this case as well, as described above with reference to FIG. 7, the difference between the width of the upper end face and the lower end face of the molding material 40 is equal to or less than the thickness of the conductive layer of the printed circuit board on which the side light emitting device package is to be mounted. Specifically, the thickness of the conductive layer of a general printed circuit board can be 100 μm or less.

On the other hand, the length of the support part 42 in the upper direction (+ z direction) from the lower side of the molding material 40 can be 500 micrometers or less. This is an appropriate length of the support portion 42 necessary for raising the side light emitting device package as shown in FIG. 11 and the like, even if the length of the support part 42 is larger than that. This is because only the volume of the molding material 40 is increased without providing a problem, such as an increase in manufacturing cost.

10 is a perspective view schematically showing a side light emitting device package according to another embodiment of the present invention.

As described above, the side light emitting device package is not simply used as the side light emitting device, but in some cases, it is disposed on the printed circuit board 60 as shown in FIG. It can also be used. At this time, when the side light emitting device package is disposed on the printed circuit board 60 similarly to the top light emitting device package, the top surface of the side light emitting device package (as shown in FIG. 7) In order to make () be approximately parallel to the printed circuit board 60, as shown in Figure 10, the molding material 40 may have a support 42 also on the upper side. In this case, when the side light emitting device package is used for side light emission, the stability of the side light emitting device package and the ease of handling are enhanced by the support 42, and the side light emitting device package is used for top light emission. At the time, the upper surface of the side light emitting device package (upper surface in an arrangement as shown in FIG. 7) is substantially parallel to the printed circuit board 60 by the support 42 positioned on the upper and lower sides of the molding material 40. can do.

11 is a schematic side view illustrating a backlight module according to another embodiment of the present invention. As shown, the backlight module according to the present embodiment includes a substrate 110, a reflective sheet 115 on a portion of the substrate 110, a light guide plate 120 on the reflective sheet 115, and a substrate 110. A side light emitting device package 130 according to any one of the above-described embodiments, which is disposed on another portion and disposed to irradiate light to the light guide plate 120, is provided. The substrate 110 may include a printed circuit board on which predetermined circuit wiring is formed.

In the case of the backlight module according to the present exemplary embodiment, the molding member 40 of the side light emitting device package 130 has the support 42 at the bottom thereof, such that the substrate 110 of the side light emitting device package 130 is provided. ) And the ease of handling of the side-emitting light emitting device package 130 during the manufacturing process can be effectively increased.

In this structure, the side light emitting device package 130 based on the vertical direction of the substrate 110 due to the thickness difference between the side light emitting device package 130 and the light guide plate 120 and the interposition of the reflective sheet 115. It may be difficult to match the center of the light guide plate 120 with the center of the opening (52 of FIG. 1) of the reflection part 50 of FIG. 1. However, as described above, by forming the reflector 50 in a vertical asymmetric structure to increase the center of the opening 52, the center of the opening 52 and the center of the light guide plate 120 may be coincident with each other.

Accordingly, light is radiated from the light emitting device (20 in FIG. 1) toward the side center of the light guide plate 120 to reduce light loss in the backlight module and thus have high luminous efficiency even under low power. Therefore, the backlight module according to this embodiment may be used as a light source of a small low power electronic device as well as a high power electronic device.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

10: lead frame 12: die pad
14: lead 20: light emitting element
30: heat dissipation pad 40: molding material
50: reflecting portion 52: opening
54: bottom 56: ceiling

Claims (17)

A leadframe including at least one lead;
A light emitting device on the lead frame; And
And a molding material coupled to the lead frame and having a reflecting portion for emitting light generated by the light emitting element in a lateral direction and having a supporting portion on a lower side thereof.
A portion of the lead frame extends from the lower side of the molding material to the outside of the molding material to form an outer lead, the bottom surface of the support portion is located below the outer lead, side-emitting light emitting device package. A leadframe including at least one lead;
A light emitting device on the lead frame; And
The light emitting device package is coupled to the lead frame, the light emitting device has a reflecting portion to emit laterally, and has a support portion on the lower side, and a lower side than the upper side; . The method of claim 2,
The thickness difference between the upper side and the lower side of the molding material is less than the thickness of the conductive layer of the printed circuit board on which the side light emitting device package is mounted, side light emitting device package. The method of claim 2,
The thickness difference between the upper side and the lower side of the molding material is less than 100㎛, side-emitting light emitting device package. A leadframe including at least one lead;
A light emitting device on the lead frame; And
A molding member coupled to the lead frame and having a reflecting portion for emitting light generated by the light emitting element in a lateral direction, having a supporting portion on a lower side, and having a width of a lower cross section than a width of an upper cross section; Light emitting light emitting device package. The method of claim 5,
The width difference between the width of the upper cross-section and the lower cross-section of the molding material is less than the thickness of the conductive layer of the printed circuit board on which the side light emitting device package is mounted, side light emitting device package. The method of claim 5,
The width difference between the width of the upper cross section and the lower cross section of the molding material is less than 100㎛, side light emitting device package. A leadframe including at least one lead;
A light emitting device on the lead frame; And
And a molding member coupled to the lead frame and having a reflecting portion for emitting light generated by the light emitting element in a lateral direction and having support portions at both lower ends thereof. The method of claim 8,
The width difference between the lower thickness at the support of the molding material and the lower thickness at the center of the molding material is less than the conductive layer thickness of the printed circuit board on which the side light emitting device package is mounted. The method of claim 8,
The width difference between the lower thickness at the support of the molding material and the lower thickness at the center of the molding material is 100 μm or less, side-emitting light emitting device package. A leadframe including at least one lead;
A light emitting device on the lead frame; And
A molding member coupled to the lead frame, the molding member having a reflecting portion configured to emit light generated by the light emitting element in a lateral direction, and a support portion formed under the opposite direction in a direction in which the light generated by the light emitting element is emitted; Side light emitting device package. The method of claim 11,
At least one lead of the lead frame is in close contact with the bottom surface of the molding material extends along the bottom surface of the molding material in the direction in which the light is emitted, the end of the light emitting device package protruding out of the molding material. The method of claim 12,
At least one lead of the lead frame is extended from the inside of the molding material to the outside, is bent and in close contact with the bottom surface of the molding material, extending along the bottom surface of the molding material, side light emitting device package. The method of claim 13,
At least one lead of the lead frame is extended from the bottom of the molding material to the outside of the molding material, side light emitting device package. A leadframe including at least one lead;
A light emitting device on the lead frame; And
And a molding member coupled to the lead frame and having a reflector to emit light generated by the light emitting element in a lateral direction, and having a support on the lower side and a length of the support on the lower side from the upper side to 500 μm or less. , Side emitting light emitting device package. A leadframe including at least one lead;
A light emitting device on the lead frame; And
And a molding material coupled to the lead frame and having a reflecting portion to emit light generated by the light emitting element in a lateral direction, and having a support portion at an upper side and a lower side thereof. Board;
A reflective sheet on a portion of the substrate;
A light guide plate on the reflective sheet; And
A backlight module comprising the side light emitting device package of any one of claims 1 to 16, arranged to irradiate light onto the light guide plate on another portion of the substrate.

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